G01R33/0047

SENSOR DEVICES, ASSOCIATED PRODUCTION METHODS AND METHODS FOR DETERMINING A MEASUREMENT CURRENT
20230168318 · 2023-06-01 ·

A sensor device contains a first magnetic field sensor chip having a first sensor element. The first magnetic field sensor chip is configured to detect a component of a magnetic field at the location of the first sensor element. The sensor device contains a second magnetic field sensor chip having a second sensor element. The second magnetic field sensor chip is configured to detect a component of a magnetic field at the location of the second sensor element. The sensor device contains a current conductor configured to carry a measurement current that induces a magnetic field at the locations of the sensor elements. The magnetic field sensor chips and the current conductor are arranged relative to one another in such a way that an influence of a homogeneous magnetic stray field on the first components is compensated for upon difference formation or summation applied to the first components.

VEHICLE PEDAL STROKE DETECTION APPARATUS AND VEHICLE CONTROL UNIT
20220055582 · 2022-02-24 · ·

A vehicle pedal stroke detection apparatus acquires a first value based on a physical amount regarding a magnetic flux of a magnet that is output from a stroke sensor. The first value is a physical amount regarding a magnitude of a magnetic flux density of the magnet with respect to a displacement of a push rod. Then, the vehicle pedal stroke detection apparatus compares the first value and a second value. The second value is a preset physical amount regarding the magnitude of the magnetic flux density of the magnet with respect to the displacement of the push rod.

SEMICONDUCTOR DEVICE INCLUDING AN ENCAPSULATION MATERIAL DEFINING A THROUGH-HOLE

A semiconductor device includes a substrate, a semiconductor die attached to the substrate, and an encapsulation material. The semiconductor die includes a sensing element. The encapsulation material encapsulates the semiconductor die and a portion of the substrate. The encapsulation material defines a through-hole to receive a conductive element. The sensing element may include a magnetic field sensor to sense a magnetic field generated by the conductive element.

Magnetic Field Sensor Integrated Circuit with Integral Ferromagnetic Material

A magnetic field sensor includes a lead frame, a semiconductor die having a first surface in which a magnetic field sensing element is disposed and a second surface attached to the lead frame, and a non-conductive mold material enclosing the die and at least a portion of the lead frame. The sensor may include a ferromagnetic mold material secured to a portion of the non-conductive mold material. Features include a multi-sloped taper to an inner surface of a non-contiguous central region of the ferromagnetic mold material, a separately formed element disposed in the non-contiguous central region, one or more slots in the lead frame, a molded ferromagnetic suppression device spaced from the non-conductive mold material and enclosing a portion of a lead, a passive device spaced from the non-conductive mold material and coupled to a plurality of leads, and a ferromagnetic bead coupled to a lead. Also described is a coil secured to the non-conductive mold material and a lead having at least two separated portions with a passive component coupled across the two portions.

A MAGNETIC RESONANCE TRANSMIT AND/OR RECEIVE ANTENNA SYSTEM AND RADIOTHERAPY PLANNING COMPUTER PROGRAM PRODUCT

A magnetic resonance transmit and/or receive antenna system configured for being used in combination with a magnetic resonance radiotherapy system. The antenna system can include at least one antenna for transmitting and/or receiving radio frequency signals and a cover enclosing the antenna components. The antenna can include antenna components and the cover can include a spatially varying thickness and/or density towards an outer edge of the surface and/or next to an antenna component as to make the change in radiation attenuation between the enclosing cover compared to the antenna component and/or air more gradual.

ELECTRICAL ISOLATION TO REDUCE MAGNETOMETER INTERFERENCE

A magnetic flux receiver assembly includes a collar that defines a central passageway and an axial collar face, and a tool insert disposable within the central passageway and defining an axial insert face. One or more magnetometers are operatively coupled to the tool insert. One or more buttons are coupled to one or both of the axial collar face and the axial insert face such that an axial gap is defined at an axial interface between the axial collar face and the axial insert face to prevent electrical communication across the axial interface.

Guidance and alignment system and methods for electric vehicle wireless charging systems

Guidance and alignment systems are disclosed for wireless charging systems to assist in aligning the transmitter and receiver inductive power transfer (IPT) couplers. These systems guide positioning and alignment to provide sufficient coupling between the transmitter and receiver IPT couplers. Exemplary systems provide a magnetic field sensor, magnetic field generator, and magnetic vectoring to determine a position of an electric vehicle or a wireless charging base. In a magnetic vectoring system, an alignment system comprising at least three coils (or similar circuits) on a magnetically permeable substrate receives a positioning magnetic field including modulated information signals and processes the received signal to generate an output for determining a position of the positioning magnetic field source relative to the magnetic field sensor position. The alignment system may further comprise a similar structure that generates the positioning magnetic field, that may include modulated information signals, based on input signals.

MAGNETIC FIELD SENSOR, MODULE WITH A MAGNETIC FIELD SENSOR AND METHOD TO MANUFACTURE A MODULE WITH A MAGNETIC FIELD SENSOR
20170234939 · 2017-08-17 · ·

Magnetic field sensor having a magnetic field sensor element and at least a band-shaped electrical contact element, in which the at least one contact element has at least one undercut section to fix in spatially form-fitting manner the magnetic field sensor at a support during the at least sectional injection molding process with a plastic material. Magnetic field sensor module, the magnetic field sensor module comprising a support with at least a fixing section for a magnetic field sensor and a plastic injection molding, wherein the magnetic field sensor module has at least such a magnetic field sensor and the magnetic field sensor is spatially fixed in form-fitting manner with its at least one undercut section at the at least one fixing section of the support and is injection molded with plastic material at least in sections, and a method for producing such a magnetic field sensor module, wherein the method comprises the following steps: correctly positioned arrangement of the at least one magnetic field sensor at the support, wherein the at least one magnetic field sensor with its at least one undercut section is arranged at the at least one fixing section, which has not yet been reshaped; reshaping the at least one fixing section to fix in spatially form-fitting manner the at least one magnetic field sensor at the support; injection molding the support at least in sections and/or the magnetic field sensor with plastic material.

SENSOR PACKAGE
20170219382 · 2017-08-03 ·

A device for detecting an object is suggested comprising a magnetic field sensor, a magnet that is arranged to rotate in a vicinity of the magnetic field sensor, wherein the object is movable in the vicinity of the magnet to affect the rotation of the magnet, wherein the magnetic field sensor is arranged to detect a magnetic field of the magnet. Also, a system comprising such device is provided.

Molded sensor package with an integrated magnet and method of manufacturing molded sensor packages with an integrated magnet

A molded sensor package includes a leadframe having a sensor die attached to the leadframe, a magnet aligned with the sensor die and a single molding compound encasing the sensor die and attaching the magnet to the leadframe. A method of manufacturing the molded sensor package includes loading the magnet and the leadframe into a molding tool so that the magnet is aligned with the sensor die in the molding tool, molding the magnet and the sensor die with the same molding compound while loaded in the molding tool and curing the molding compound so that the magnet is attached to the leadframe by the same molding compound that encases the sensor die.