A flexible digital radiographic detector assembly includes a flexible sleeve enclosing a photosensor array supported by a flexible substrate. Integrated circuit readout electronics are coupled to the photosensor array and to a circuit board having conductive contacts. The contacts engage a hand carried read out electronics box to initiate a read out of image data captured in the photosensor array and to display the image data on a screen in the read out electronics box.

An imaging system is provided. A method for installing the imaging system is provided. The imaging system may include a first modality imaging apparatus. The first modality imaging apparatus may have a detector including a scintillator unit, a photodetector unit, a circuit unit, a supporting block, and a supporting board. The supporting block may be disposed on an end of the scintillator unit. The supporting board may be disposed between the photodetector unit and the circuit unit.

A patient support apparatus may include a support surface configured to conduct air along a top face of the support surface so that heat and moisture from a patient lying on the support surface are drawn away from the top face of the support surface. An opening may be formed in a side of the support surface. A cavity may extend from the opening into the support surface. An inlet port may be positioned within the cavity and fluidly coupled to the top face. A blower assembly may be configured to position within the cavity. The blower assembly may have an outlet port that couples to the inlet port when the blower assembly is positioned within the cavity. The blower assembly may conduct air through the inlet port to the top face of the support surface.

A patient support apparatus may include a support surface configured to conduct air along a top face of the support surface so that heat and moisture from a patient lying on the support surface are drawn away from the top face of the support surface. An opening may be formed in a side of the support surface. A cavity may extend from the opening into the support surface. An inlet port may be positioned within the cavity and fluidly coupled to the top face. A blower assembly may be configured to position within the cavity. The blower assembly may have an outlet port that couples to the inlet port when the blower assembly is positioned within the cavity. The blower assembly may conduct air through the inlet port to the top face of the support surface.

Provided are an X-ray detector having fabrication fault tolerant structure and a method for manufacturing the same using a micro-transfer printing (MTP) technique. The X-ray detector may include a photodiode layer formed on a base substrate within a pixel area and including a plurality of photodiode pixel units, a dummy layer formed the base substrate within a peripheral area, a plurality of pixel driving integrated chips printed on the photodiode layer, a plurality of primary column and row integrated chips printed on the dummy layer, and metal lines coupling the column and row integrated chips with pixel driving integrated chips and other constituent elements, wherein the plurality of pixel driving integrated chips and primary column and row integrated chips are manufactured separately from the photodiode layer and the dummy layer and attached on the photodiode layer and the dummy layer, respectively.

Provided are an X-ray detector having fabrication fault tolerant structure and a method for manufacturing the same using a micro-transfer printing (MTP) technique. The X-ray detector may include a photodiode layer formed on a base substrate within a pixel area and including a plurality of photodiode pixel units, a dummy layer formed the base substrate within a peripheral area, a plurality of pixel driving integrated chips printed on the photodiode layer, a plurality of primary column and row integrated chips printed on the dummy layer, and metal lines coupling the column and row integrated chips with pixel driving integrated chips and other constituent elements, wherein the plurality of pixel driving integrated chips and primary column and row integrated chips are manufactured separately from the photodiode layer and the dummy layer and attached on the photodiode layer and the dummy layer, respectively.

An excore detector assembly for measuring flux outside of a nuclear reactor core. The excore detector assembly includes a housing and at least one self-powered detector inside the housing for measuring flux generated by the nuclear reactor core. The at least one self-powered detector includes a sheath, a detector material section inside the sheath, an insulator between the sheath and the detector material, and a flux signal output line.

Disclosed herein is a radiation detector, comprising: an avalanche photodiode (APD) with a first side coupled to an electrode and configured to work in a linear mode; a capacitor module electrically connected to the electrode and comprising a capacitor, wherein the capacitor module is configured to collect charge carriers from the electrode onto the capacitor; a current sourcing module in parallel to the capacitor, the current sourcing module configured to compensate for a leakage current in the APD and comprising a current source and a modulator; wherein the current source is configured to output a first electrical current and a second electrical current; wherein the modulator is configured to control a ratio of a duration at which the current source outputs the first electrical current to a duration at which the current source outputs the second electrical current.

Disclosed herein is a radiation detector, comprising: an avalanche photodiode (APD) with a first side coupled to an electrode and configured to work in a linear mode; a capacitor module electrically connected to the electrode and comprising a capacitor, wherein the capacitor module is configured to collect charge carriers from the electrode onto the capacitor; a current sourcing module in parallel to the capacitor, the current sourcing module configured to compensate for a leakage current in the APD and comprising a current source and a modulator; wherein the current source is configured to output a first electrical current and a second electrical current; wherein the modulator is configured to control a ratio of a duration at which the current source outputs the first electrical current to a duration at which the current source outputs the second electrical current.

Epoxy-based inline infrared (IR) filter assembly, and manufacture and use of the same. Co-axial infrared filter assemblies comprise a substantially cylindrical filter body forming a central cavity characterized by opposing holes at each end. The filter body forms an outer conductor, and SMA connectors coupled to the opposing holes at each end of the body are electrically coupled to form an inner conductor positioned along a long axis of the filter body. An infrared absorbing material (such as castable epoxy resin) fills the central cavity of the filter body. Methods for producing the co-axial infrared filter include pressing SMA connectors into the respective ends of the filter body, electrically coupling the SMA connectors, and filling the filter body with epoxy. Electronic systems for operating a dark matter detector include a feedline comprising a coaxial filter configured to advantageously block infrared noise.