A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an electronic chip assembled to the circuit board, a sensor chip, a die attach film (DAF) pre-bonded onto the sensor chip, a plurality of wires electrically coupling the electronic chip and the sensor chip to the circuit board, a supporting adhesive layer, a light-permeable sheet, and an optical module that is fixed to the circuit board for surrounding the above components. The sensor chip is adhered to the electronic chip through the DAF such that a sensing region of the sensor chip is perpendicular to a central axis of the optical module. The supporting adhesive layer is in a ringed shape and is disposed on a top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.

A transparent optical device configured to be used with an underlying device. The underlying device is configured to provide output light. The optical device is configured to transmit light from the underlying device through the optical device. The optical device includes first and second zones. The first zone includes a first plurality of transparent regions formed in the first zone allowing light to pass through from the underlying device. The second zone includes a second plurality of transparent regions formed in the second zone which allow light in the first spectrum to pass through from the underlying device at a different transmission efficiency than the first zone.

A transparent optical device configured to be used with an underlying device. The underlying device is configured to provide output light. The optical device is configured to transmit light from the underlying device through the optical device. The optical device includes first and second zones. The first zone includes a first plurality of transparent regions formed in the first zone allowing light to pass through from the underlying device. The second zone includes a second plurality of transparent regions formed in the second zone which allow light in the first spectrum to pass through from the underlying device at a different transmission efficiency than the first zone.

A light field projector device is described which outputs a light field. The projector has a projector base with a projection optical system configured to output light rays to form a projected image, a collimating optical system configured for collimation of the projected image light rays to form a second projected image, which is directed to a display optical system to produce a light field image. Light field projector devices may be used individually or in combination with one or more other projectors which can be arranged to form a direct projection light field display. The arrangement of light field projector devices may have an individual or shared display optical system. The projector device is designed to provide high pixel density, providing an image that looks crisp and unpixellated.

Provided is an image sensor including a metasurface having a light resonance function. The image sensor includes a photoelectric conversion layer, an interlayer material layer on the photoelectric conversion layer, and a single meta pattern layer on the interlayer material layer, wherein the meta pattern layer includes a metasurface, the metasurface having a same phase profile as that of a lens, and the meta pattern layer has a height that causes a resonance at a given wavelength of incident light to block transmission of the given wavelength through the meta pattern layer.

This application discloses a camera module and an electronic device. The camera module includes: a bracket (100); a lens (200), where the lens (200) is disposed on the bracket (100); a substrate (300), where the substrate (300) is connected to the bracket (100); and a photosensitive chip module (400), where the photosensitive chip module (400) is disposed on the substrate (300), the photosensitive chip module (400) is electrically connected to the substrate (300), the photosensitive chip module (400) is disposed opposite to the lens (200), the photosensitive chip module (400) has a light receiving surface (410) facing the lens (200), the light receiving surface (410) is a concave surface, and the light receiving surface (410) is formed by splicing a plurality of protrusions (411) distributed in an array. This application further discloses an electronic device.

This application generally describes an imaging system, such as a multi-camera imaging system. The imaging system can include a plurality of channels and individual of the channels can include an objective lens and a relay optical system. The object lens images received light on a first image plane, as a first image, and the relay optical system images the first image on a second image plane, as a second, magnified image. In examples, the object lens and the relay optical system make up an optically coherent system.

A method for producing a camera module. An objective is aligned with respect to an image sensor and is then fixed in position by being joined to a support that receives the image sensor, a housing that surrounds the image sensor, or an interposed connection structure as a joining partner. The objective is mounted on spacer elements, which are initially still movable, and is then aligned with respect to the image sensor by moving the spacer elements. After the objective is aligned, the spacer elements are welded to the objective and the joining partner. A camera module is also described.

The present disclosure relates to a camera module and an electronic apparatus, the camera module includes an imaging device and a lens including a lens group and a light guide member, wherein the light guide member includes a reflective surface and a curved incident surface formed by extending toward an outside of the light guide member, and wherein the reflective surface is used for reflecting external light incident from the incident surface to the imaging device.

The present disclosure relates to a camera module and an electronic apparatus, the camera module includes an imaging device and a lens including a lens group and a light guide member, wherein the light guide member includes a reflective surface and a curved incident surface formed by extending toward an outside of the light guide member, and wherein the reflective surface is used for reflecting external light incident from the incident surface to the imaging device.