An electronic modulating device is provided, which includes a first substrate, an electrode, and an insulating layer. The electrode is disposed on the first substrate, wherein the electrode comprises an opening defining a top edge and a bottom edge of the electrode, and the opening has a central portion. The insulating layer is disposed on the electrode and within the opening. Wherein a thickness of the insulating layer at the bottom edge is greater than a thickness of the insulating layer at the central portion, and the electrode has a first inner side and at least a portion of the first inner side is uneven.

The present invention provides a display panel laminate structure and its manufacturing method. The display panel laminate structure includes a liquid crystal panel, a first support layer, a cover plate, a second support layer, and a sealant layer. The first support layer includes a first hollow portion, and a first medium is positioned in the first hollow portion. The second support layer includes a second hollow portion, and a second medium is positioned in the second hollow portion. A refractive index of the first medium and a refractive index of the second medium are both smaller than a refractive index of the sealant layer.

The present invention provides a display panel laminate structure and its manufacturing method. The display panel laminate structure includes a liquid crystal panel, a first support layer, a cover plate, a second support layer, and a sealant layer. The first support layer includes a first hollow portion, and a first medium is positioned in the first hollow portion. The second support layer includes a second hollow portion, and a second medium is positioned in the second hollow portion. A refractive index of the first medium and a refractive index of the second medium are both smaller than a refractive index of the sealant layer.

The present invention discloses a display panel and a display device, the display panel includes a display region and a non-display region located outside the display region. The display panel includes a first buffer layer and a plurality of display region film layers. The first buffer layer is located in the non-display region. The first buffer layer flexibly connects to at least two of the plurality of display region film layers. The present invention can resist the shear stress between the display region film layers, and prevent the display panel from peeling.

The display device may include a display panel and a frame diposed on a rear surface of the display panel. The display device also includes a plurality of binders fixed to the rear surface of the display panel and disposed between the display panel and the frame, and a plurality of coupling members penetrating through the frame and coupled to the plurality of binders. Therefore, the flatness of the display panel attached to the plurality of binders may be improved by adjusting the locations of the frame and the plurality of binders. Also, the display panel and the frame may be easily attached and detached using the plurality of binders and the plurality of coupling members.

An array substrate, includes: a substrate, a first metal layer, a first buffer layer, and an active layer, a gate insulating layer, a second metal layer, a first insulating layer, a third metal layer and a first planarization layer. The first metal layer is electrically connected with the first doped area of the active layer through the bridge layer of the second metal layer. The third metal layer is electrically connected with the second doped area of the active layer. The array substrate of the present disclosure reduces a size of a thin film transistor by stacking the first metal layer, the second metal layer, and the third metal layer, thereby increasing pixel density. A display panel is also provided.

A display device according to an exemplary embodiment of the present invention includes a display panel; a frame disposed on a rear surface of the display panel; a plurality of binders fixed to the rear surface of the display panel and disposed between the display panel and the frame; and a plurality of coupling members penetrating the frame and coupled to the plurality of binders. Accordingly, the display panel and the frame may be easily attached and detached using the plurality of binders and the plurality of coupling members.

The following structure mitigates problems caused by heat generated by the LED and the driver IC. A liquid crystal display device including a liquid crystal display panel in which liquid crystal is sandwiched between a TFT substrate, having a pixel, and a counter substrate including: a display area being formed in an area in which the TFT substrate and the counter substrate overlap each other, a terminal area being formed on the TFT substrate, in which the counter substrate does not overlap, the terminal area being formed along a first side of the counter substrate which extends in a first direction, a second cover glass being disposed on the counter substrate, and a first cover glass being disposed under the TFT substrate, in which a width of the first cover glass in the first direction is larger than a width of the second cover glass in the first direction.

The display device may include a display panel and a frame disposed on a rear surface of the display panel. The display device also includes a plurality of binders fixed to the rear surface of the display panel and disposed between the display panel and the frame, and a plurality of coupling members penetrating through the frame and coupled to the plurality of binders. Therefore, the flatness of the display panel attached to the plurality of binders may be improved by adjusting the locations of the frame and the plurality of binders. Also, the display panel and the frame may be easily attached and detached using the plurality of binders and the plurality of coupling members.

The present application discloses a array substrate, a manufacturing method of the array substrate, and a display panel, the manufacture procedure includes the following steps: sequentially forming a buffer layer and a photoresist layer on a glass substrate; placing the substrate into an activation agent for activation, and forming an activation liquid particle layer with a first preset pattern at a corresponding position where the activation agent is in contact with the photoresist layer, and forming an activation liquid particle layer with a second preset pattern at a corresponding position where the activation agent is in contact with the buffer layer; removing the photoresist layer and the activation liquid particle layer with the first preset pattern; and performing chemical plating to form a first metal layer at a position corresponding to the activation liquid particle layer with the second preset pattern in contact with the buffer layer.