An image reading apparatus includes a medium mounting portion configured to mount a medium; a feeding means configured to feed a medium from the medium mounting portion; at least one edge guide each configured to regulate a corresponding one of at least one medium width direction edge of the medium having been mounted on the medium mounting portion; a reading means configured to read the medium and disposed on a further downstream side than the at least one edge guide in the medium feeding direction; and at least one medium detection means configured to detect the medium and disposed on a further downstream side than the at least one edge guide in the medium feeding direction and further outside in the medium width direction than at least one edge regulation position for the edge regulation by the at least one edge guide.

An image reading apparatus includes a medium mounting portion configured to mount a medium; a feeding means configured to feed a medium from the medium mounting portion; at least one edge guide each configured to regulate a corresponding one of at least one medium width direction edge of the medium having been mounted on the medium mounting portion; a reading means configured to read the medium and disposed on a further downstream side than the at least one edge guide in the medium feeding direction; and at least one medium detection means configured to detect the medium and disposed on a further downstream side than the at least one edge guide in the medium feeding direction and further outside in the medium width direction than at least one edge regulation position for the edge regulation by the at least one edge guide.

In a composite optical device having a resin layer on a surface of a glass serving as a base, the resin layer has a first area corresponding to an effective diameter range and a second area disposed outside of the first area, a surface of the first area includes a concave surface of aspheric shape at least in part, and a surface of the second area is continuous with the surface of the first area, and includes an inflection point.

Provided is a process including: obtaining a layout specifying, at least in part, a pattern to be transferred to a substrate via a patterning process and an etch process; and modifying, with one or more processors, the layout to include an etch-assist feature that is larger than a resolution limit of the patterning process and smaller than a resolution limit of the etch process, the etch-assist feature being configured to reduce a bias of the patterning process or the etch process, to reduce an etch induced shift of a feature in the layout due to the etch process, or to expand a process window of another patterning process.

In a case that accommodates an instant film, a first claw opening portion and a second claw opening portion for inserting a claw into the case are provided. In a film cover that light-shields an exposure opening portion of the case, a notched portion continuous to the first claw opening portion is provided. In a case where the film cover is not removed in use, the first claw opening portion is used, and in a case where the film cover is removed in use, the second claw opening portion is used. By using the first claw opening portion, it is possible to avoid contact of the claw and the film cover, and to discharge only an instant film in a state where the film cover is mounted.

In a case that accommodates an instant film, a first claw opening portion and a second claw opening portion for inserting a claw into the case are provided. In a film cover that light-shields an exposure opening portion of the case, a notched portion continuous to the first claw opening portion is provided. In a case where the film cover is not removed in use, the first claw opening portion is used, and in a case where the film cover is removed in use, the second claw opening portion is used. By using the first claw opening portion, it is possible to avoid contact of the claw and the film cover, and to discharge only an instant film in a state where the film cover is mounted.

A method, system and program for determining a position of a feature referenced to a substrate. The method includes measuring a position of the feature, receiving an intended placement of the feature and determining an estimate of a placement error based on knowledge of a relative position of a first reference feature referenced to a first layer on a substrate with respect to a second reference feature referenced to a second layer on a substrate. The updated position may be used to position the layer of the substrate having the feature, or another layer of the substrate, or another layer of another substrate.

An image reading apparatus includes a medium mounting portion configured to mount a medium; a feeding means configured to feed a medium from the medium mounting portion; at least one edge guide each configured to regulate a corresponding one of at least one medium width direction edge of the medium having been mounted on the medium mounting portion; a reading means configured to read the medium and disposed on a further downstream side than the at least one edge guide in the medium feeding direction; and at least one medium detection means configured to detect the medium and disposed on a further downstream side than the at least one edge guide in the medium feeding direction and further outside in the medium width direction than at least one edge regulation position for the edge regulation by the at least one edge guide.

An image reading apparatus includes a medium mounting portion configured to mount a medium; a feeding means configured to feed a medium from the medium mounting portion; at least one edge guide each configured to regulate a corresponding one of at least one medium width direction edge of the medium having been mounted on the medium mounting portion; a reading means configured to read the medium and disposed on a further downstream side than the at least one edge guide in the medium feeding direction; and at least one medium detection means configured to detect the medium and disposed on a further downstream side than the at least one edge guide in the medium feeding direction and further outside in the medium width direction than at least one edge regulation position for the edge regulation by the at least one edge guide.

The purpose of the present invention is to provide an exposure condition evaluation device that appropriately evaluates a wafer exposure condition or calculates an appropriate exposure condition, on the basis of information obtained from an FEM wafer, without relying on the formation state of the FEM wafer. In order to achieve the foregoing, the present invention proposes an exposure condition evaluation device which evaluates an exposure condition of a reduction projection exposure device, on the basis of the information of patterns exposed on a sample by the reduction projection exposure device, and which uses a second feature amount of a plurality of patterns formed by making exposure conditions uniform to correct a first feature amount of a plurality of patterns formed by a plurality of different exposure condition settings.