A mask, a manufacturing method thereof and a mask assembly are provided. The mask includes a display region and welding regions located on opposite sides of the display region in a first direction, wherein the welding region at least includes a thickened portion, and a set welding region is disposed on the thickened portion; a thickness of the set welding region is greater than that of the display region; and in a horizontal direction of the display region, the thickened portion protrudes from a surface of at least one side of the display region.

A mask, a manufacturing method thereof and a mask assembly are provided. The mask includes a display region and welding regions located on opposite sides of the display region in a first direction, wherein the welding region at least includes a thickened portion, and a set welding region is disposed on the thickened portion; a thickness of the set welding region is greater than that of the display region; and in a horizontal direction of the display region, the thickened portion protrudes from a surface of at least one side of the display region.

A method of manufacturing a photomask including the steps of receiving initial photomask design data associated with one or more patterns to be formed on a photomask and optimizing the initial photomask design data to minimize printing exposure energy while maintaining an acceptable pattern quality and size. In embodiments, the step of optimizing includes setting minimization of printing exposure energy as a priority design rule, setting optimization of pattern quality and size as a secondary design rule, iterating size of mask design features to determine a range of size biases that satisfy both the priority and secondary design rules so as to provide an initial optimized mask design, and adjusting mask variables over the range of size biases to determine mask variables that further optimize the initial optimized mask design to obtain a final optimized mask design.

A method of manufacturing a photomask including the steps of receiving initial photomask design data associated with one or more patterns to be formed on a photomask and optimizing the initial photomask design data to minimize printing exposure energy while maintaining an acceptable pattern quality and size. In embodiments, the step of optimizing includes setting minimization of printing exposure energy as a priority design rule, setting optimization of pattern quality and size as a secondary design rule, iterating size of mask design features to determine a range of size biases that satisfy both the priority and secondary design rules so as to provide an initial optimized mask design, and adjusting mask variables over the range of size biases to determine mask variables that further optimize the initial optimized mask design to obtain a final optimized mask design.

A pellicle includes a frame configured to attach to a photomask, wherein the frame includes a vent hole. The pellicle further includes a filter covering the vent hole, wherein the filter directly connects to an outer surface of the frame. The pellicle further includes a membrane extending over a top surface of the frame. The pellicle further includes a mount between the frame and the membrane, wherein the mount is attachable to the frame by an adhesive.

A pellicle includes a frame configured to attach to a photomask, wherein the frame includes a vent hole. The pellicle further includes a filter covering the vent hole, wherein the filter directly connects to an outer surface of the frame. The pellicle further includes a membrane extending over a top surface of the frame. The pellicle further includes a mount between the frame and the membrane, wherein the mount is attachable to the frame by an adhesive.

The present invention relates generally to the technical field of integrated circuit mask design, and more particularly to a method, an apparatus and an electronic device for Hessian-Free photolithography mask optimization. The method includes steps: S1, inputting a design layout of a mask to be optimized; S2, positioning error monitoring points on the design layout of the mask to be optimized; S3, obtaining an optimization variable x of the mask to be optimized; S4, forming an objective function cost on the optimization variable x; and S5, optimizing the objective junction cost by a Hessian-Free-based conjugate gradient method, to obtain an optimization result of the mask to be optimized. Optimizing the objective function cost based on a Hessian-Free conjugate gradient method to obtain an optimization result of the mask to be optimized, which can greatly reduce the computation resources in the optimization process, make the optimization process simpler, feasible, and improve the optimization efficiency. Meanwhile, there is no need to use the quasi-Newton method to obtain the approximate replacement matrix of the H matrix, which can improve the accuracy of the optimization result.

In some embodiments, a reticle structure is provided. The reticle structure includes a reticle stage and a reticle mounted on the reticle stage. The reticle stage includes plural first burls and plural second burls, in which the second burls are disposed on a center of the reticle stage and the first burls disposed on an edge of the reticle stage such that the first burls surround the second burls. The reticle includes a base material and a pattern layer overlying the base material. The base material is secured on the first and second burls of the reticle stage. The pattern layer includes plural first gratings, and each of the first burls is vertically aligned with one of the first gratings.

In some embodiments, a reticle structure is provided. The reticle structure includes a reticle stage and a reticle mounted on the reticle stage. The reticle stage includes plural first burls and plural second burls, in which the second burls are disposed on a center of the reticle stage and the first burls disposed on an edge of the reticle stage such that the first burls surround the second burls. The reticle includes a base material and a pattern layer overlying the base material. The base material is secured on the first and second burls of the reticle stage. The pattern layer includes plural first gratings, and each of the first burls is vertically aligned with one of the first gratings.

An lithographic reticle may be formed comprising a transparent substrate, a substantially opaque mask formed on the transparent substrate that defines at least one exposure window, wherein the at least one exposure window has a first end, a first filter formed on the transparent substrate within the at least one exposure window and abutting the first end thereof, and a second filter formed on the transparent substrate within the at least one exposure window and abutting the first filter, wherein an average transmissivity of the first filter is substantially one half of a transmissivity of the second filter. In another embodiment, the at least one exposure window includes a third filter abutting the second end and is adjacent the second filter. Further embodiments of the present description include interconnection structures and systems fabricated using the lithographic reticle.