A method for manufacturing a multi-stage compound eye lens includes the steps of manufacturing a micropillar array using a photoetching method, then sputtering ZnO on the surface of the micropillar array, jet printing an ultraviolet curing adhesive onto gaps in the micropillar array using a micro jet printing machine, and controlling the morphology of microlens using the number of droplet dropping instances to obtain a microlens array; further respectively dissolving hexamethyl tetramine and zinc nitrate in deionized water, then pouring the hexamethyl tetramine solution into the zinc nitrate solution to obtain a mixed solution, placing the microlens array into the mixed solution, and placing is in a water bath kettle for a water bath, and finally, removing the microlens array from the mixed solution, rinsing it with deionized water, and drying same to obtain the multi-stage compound eye lens.

A method for manufacturing a cured product pattern of a curable composition includes the steps of, in sequence, depositing a droplet of the curable composition onto a substrate; bringing a mold having an uneven pattern formed in a surface thereof into contact with the curable composition; curing the curable composition; and releasing a cured product of the curable composition from the mold. The mold has a recess having a bottom surface and a stair structure arranged to form an opening surface that becomes wider from the bottom surface toward the surface of the mold. In the contact step, the curable composition comes into contact with the stair portion after a top of the droplet comes into contact with the bottom surface.

Provided is a kit including a curable composition for imprinting, and a composition for forming an underlayer film for imprinting, in which the composition for forming an underlayer film for imprinting contains a polymer having a polymerizable functional group, and a compound in which the lower one of a boiling point and a thermal decomposition temperature is 480° C. or higher and ΔHSP, which is a Hansen solubility parameter distance from a component with the highest content contained in the curable composition for imprinting, is 2.5 or less. Furthermore, the present invention relates to a composition for forming an underlayer film for imprinting, a pattern forming method, and a method for manufacturing a semiconductor device, which are related to the kit.

An imprint mold having a synthetic quartz glass substrate having a transfer fine pattern formed on a surface thereof; and a coating layer formed on at least a part of the fine pattern by at least one of materials different from the substrate.

A photocurable composition can comprise a polymerizable material, a fullerene or fullerene derivative in an amount of at least 0.2 wt % and not greater than 5.0 wt %, and a photoinitiator and may be adapted for AIP or NIL processing. A photo-cured layer made from the photocurable composition can have an improved thermal stability in comparison to a photo-cured layer made from the same photocurable composition except not containing a fullerene or fullerene derivative.

A method producing micro- and/or nanostructures includes fixing a substrate with an embossing material on a substrate accommodating device, contacting of a structured stamp with the embossing material, curing of the embossing material, and removal of the embossing material from the structured stamp.

A method includes treating a surface of a substrate to cause the surface to include a hydrophobic portion and a hydrophilic portion, providing a replication material over the hydrophilic portion, and imprinting the replication material to cause the replication material to have a predetermined characteristic.

Methods for fabricating stamps and systems for patterning a substrate, and devices resulting from those methods are provided.

A pattern forming method comprises dispensing a curable composition onto an underlayer of a substrate; bringing the curable composition into contact with a mold; irradiating the curable composition with light to form a cured film; and separating the cured film from the mold. The proportion of the number of carbon atoms relative to the total number of atoms in the underlayer is 80% or more. The dispensing step comprises a first dispensing step of dispensing a curable composition (A1) substantially free of a fluorosurfactant onto the underlayer, and a second dispensing step of dripping a droplet of a curable composition (A2) having a fluorosurfactant concentration in components excluding a solvent of 1.1% by mass or less onto the curable composition (A1) discretely.

A method of manufacturing a curved-surface metal line is provided. A three-dimensional structure is formed with a metal member and then fixed together with an insulator. Alternatively, the metal member and the insulator are embedded-formed to jointly form the three-dimensional structure, or the metal member and the insulator are fixed together and then jointly form the three-dimensional structure. Then, a photoresist protection layer is formed outside the metal member, and a selective exposure treatment is performed such that corresponding locations of the photoresist protection layer being exposed is subject to a photochemical reaction. The photoresist protection layer is developed, and after the photoresist protection layer is partially dissolved, portions of the metal member at the corresponding locations are simultaneously exposed. The exposed portions of the metal member are etched, and residual portions of the photoresist protection layer are removed to form the metal line provided on the insulator.