A method of fabricating a metal mask includes receiving a metal planar substrate and patterning the metal planar substrate. The metal planar substrate includes a first surface and a second surface opposite to the first surface. The patterning the metal planar substrate includes forming strip-shaped structures, forming through holes, and forming a blind hole in a direction from the first surface to the second surface. The through holes extend to the first surface and the second surface. The through holes and the strip-shaped structures are alternately arranged. The blind hole extends across the through holes.

A deposition mask includes: a first surface and a second surface, in which a plurality of through-holes are formed; a pair of long side surfaces connected to the first and second surfaces, and defining a profile of the deposition mask in a longitudinal direction of the deposition mask; and a pair of short side surfaces connected to the first and second surfaces, and defining a profile of the deposition mask in a width direction of the deposition mask. The long side surface includes a first portion that is recessed inside and includes a first end portion positioned along the first surface, and a second end portion positioned along the second surface and positioned inside the first end portion. The through-hole includes a first recess formed on the first surface, and a second recess formed on the second surface and connected to the first recess through a hole connection portion.

A method of manufacturing a metal mask includes calendering a metal material, so as to form a metal mask substrate, where the metal mask substrate includes a surface and a plurality of grooves formed in the surface, and the grooves all extend in a direction. The surface has at least one sampling region, while at least two grooves are distributed in the sampling region, where an average area ratio of the area of the grooves within the sampling region to the area of the sampling region ranges between 45% and 68%.

Embodiments described herein provide method a method of forming optical devices using nanoimprint lithography that maintains the critical dimension of the optical device structures. The method described herein accounts for lateral shrinkage of the solvent based resist during the cure process to maintain the critical dimension. The method includes disposing a stamp coating on a stamp having an inverse optical device pattern of inverse structures. The coating is disposed on sidewalls, inverse structure bottom, and inverse structure top of the inverse structures. The method includes etching the inverse structures such that the stamp coating remains on the sidewalls and is removed from the inverse structure top and bottom. The method further includes imprinting the stamp into an optical device material disposed and subjecting the imprintable optical device material to a cure process which transfers the optical device critical dimension to the optical device structures of the optical device pattern.

An adhesive strip including a support, a substrate and a plurality of fixing elements protruding from the substrate. The fixing elements and substrate are formed from a photo-curable adhesive composition that includes component A: a (meth)acrylate monomer or oligomer having at least two (meth)acrylate groups and having an average molecular weight M.sub.w from 700 g/mol to 7000 g/mol; component B: a (meth)acrylate monomer or oligomer having at least two (meth)acrylate groups and having an average molecular weight M.sub.w equal or greater than 150 g/mol and less than 700 g/mol; component C: a photoinitiator; and component D: a polythiol. A reclosable fastener can be formed with the adhesive strip such as a reclosable male-to-male adhesive based on a fastener having two adhesive strips.

A fine metal mask includes a plate including a first and a second surfaces. The first surface has a first inner edge defining a first opening. The second surface has a second inner edge defining a second opening communicated with the first opening. The plate includes a first and a second curved surfaces respectively connecting the first surface inside the first opening and the second surface inside the second opening. The first and the second curved surfaces connect with a third inner edge defining a third opening smaller than the first and the second openings. The third inner edge includes a first straight edge, a second straight edge and a circular edge. The first and the second straight edges form an included angle. The circular edge has a radius smaller than or equal to 15 microns and connects between the first and the second straight edges.

The present disclosure relates to a method for forming a nanostencil mask. The method involves irradiating a substrate to increase resistivity of a plurality of first portions of the substrate relative to one or more second portions of the substrate surrounding the plurality of first portions. The method also involves passing a current through the substrate, the current preferentially passing through and weakening the one or more second portions of the substrate. This preference is a result of the higher resistivity in the one or more first portions of the substrate causing the current to pass through the relatively lower resistivity second portion(s). The method also involves subjecting the substrate to a material removal process, the material removal process preferentially removing the weakened one or more second portions of the substrate and thereby forming a nanostencil mask comprising the plurality of first portions of the substrate.

The metal plate includes a plurality of pits located on the surface of the metal plate. The manufacturing method for a metal plate for use in manufacturing of a deposition mask includes an inspection step of determining a quality of the metal plate based on a sum of volumes of a plurality of pits located at a portion of the surface of the metal plate.

A transfer component and a manufacturing method thereof, and a transfer head are provided in the disclosure. The method includes the following. An elastic adhesive layer is disposed on a surface of a substrate. A reticle with a hollow area is disposed on the elastic adhesive layer. The elastic adhesive layer is etched through the hollow area of the reticle.

Systems and methods to integrate electrical sensors comprising parallel electrodes into microfluidic devices that are manufactured using soft lithography are disclosed herein. With minimal fabrication complexity, more uniform electric fields than conventional coplanar electrodes are produced. The methods disclosed are also more suitable for the construction of complex electrical sensor networks in microfluidic devices due to greater layout flexibility and provide improved sensitivity over conventional coplanar electrodes.