A method for manufacturing an array of optical fiber ferrules includes producing on a first side of a wafer a pattern of an array of disks or holes (111, 112) in a metallic coating (121, 122). The metallic coating is covered with a negative photoresist layer. A second side of the wafer opposite to the first side is illuminated with light that propagates as a divergent or collimated beam through the photoresist layer, thereby creating a conical pattern within the photoresist layer. The photoresist layer is developed to create conical apertures. A sheet with a conical openings pattern registered to the conical apertures is attached so that a small diameter of each conical opening of the sheet is smaller than, and in contact with, a large diameter of the conical aperture to which it is registered, thereby forming an array of optical fiber ferrules.

A manufacturing method of a mask includes forming a first mask layer, forming a second mask layer on the first mask layer, forming a photoresist pattern layer on the second mask layer, removing a first area of the second mask layer, which is exposed through the photoresist pattern layer, defining an opening through the first mask layer, removing a portion of the photoresist pattern layer to expose a portion of a second area of the second mask layer, and removing the portion of the second area of the second mask layer.

A method of providing a mask includes providing a first mask layer facing a second mask layer, in the second mask layer, providing a first opening which corresponds to a deposition opening of the mask, providing an auxiliary layer which faces the first mask layer with the second mask layer therebetween and covers the first opening, in the auxiliary layer, providing a second opening which corresponds to the first opening and exposes the first mask layer to outside the auxiliary layer, in the first mask layer, providing a third opening which corresponds to the first opening and the second opening by using the auxiliary layer as a mask and providing the auxiliary layer separated from the first mask layer and the second mask layer to provide the deposition mask having the first mask layer having the third opening and the second mask layer having the first opening.

A metal plate includes a surface including a longitudinal direction of the metal plate and a width direction orthogonal to the longitudinal direction. A surface reflectance by regular reflection of a light is 8% or more and 25% or less. The surface reflectance is measured when the light is incident on the surface at an angle of 45°±0.2°. The light is in at least one plane orthogonal to the surface.

An apparatus (e.g., a multi-spectral optical filter array, an optical wafer, an optical component) has an aperture mask printed directly thereon, the aperture mask including a positive or negative photoresist. The apparatus includes a substrate having the aperture mask printed on at least one of a light entrance surface or a light exit surface of the substrate so as to provide an aperture over a portion of the substrate. The photoresist from which the aperture mask is formed is photo-definable or non-photo-definable, and is deposited/printed to form the aperture mask on the substrate.

A mask, a mask assembly, and a method of fabricating a mask are disclosed herein. The mask comprises a polymer film in which at least one cell region and at least one peripheral region are defined, the at least one peripheral region surrounding the at least one cell region, a conductive layer disposed on the polymer film and including a metal, an inorganic layer disposed between the polymer film and the conductive layer and including a silicon-based inorganic material, and holes that penetrate the polymer film, the conductive layer, and the inorganic layer and overlap the at least one cell region in a plan view.

A mask assembly includes a mask frame including a cell opening, and an outer frame defined along a periphery of the cell opening, and a cell mask disposed on the mask frame and including a polymer material. The cell mask includes a masking part which includes a deposition part disposed corresponding to the cell opening of the mask frame and including a masking pattern, and a non-deposition part extending from the deposition part, and a bonding part overlapping the outer frame of the mask frame and extending from the masking part. The non-deposition part includes a non-pattern portion, and a pattern portion having a thickness smaller than a thickness of the non-pattern portion.

The metal plate includes a plurality of pits located on the surface of the metal plate. The manufacturing method for a metal plate for use in manufacturing of a deposition mask includes an inspection step of determining a quality of the metal plate based on a sum of volumes of a plurality of pits located at a portion of the surface of the metal plate.

Embodiments of the present disclosure generally relate to pattern replication, imprint lithography, and more particularly to methods and apparatuses for creating a large area imprint without a seam. Methods disclosed herein generally include filling seams between pairs of masters with a filler material such that the seams are flush with a surface of the masters having a plurality of features disposed thereon.

Polymer nanostructures and compositions, devices, and systems comprising polymer nanostructures. In various examples, a composition, a device, or a system comprises a plurality of polymer nanostructures. The polymer nanostructures are disposed on a surface of a substrate. In various examples, the polymer nanostructures are disposed in pre-determined pattern on a surface of a substrate. In various examples, the polymer nanostructures are self-supporting. In various examples, a polymer nanostructure comprises a polypeptide group or the like. In various examples, a polymer nanostructure comprises an end group, such as, for example, a fluorescent end group, or the like. In various examples, a system is a sensor, which can be used to analyze a sample. In various examples, a composition, a device, or a system is used to analyze samples, such as, for example, samples comprising one or more volatile organic compound(s).