A method for manufacturing a chemically amplified photosensitive composition capable of reducing a foreign matter derived from a sulfur-containing compound. The method includes an acid generating agent which generates an acid by irradiation with an active ray or radiation, a sulfur-containing compound which is a solid at room temperature, a first solvent having a Hansen solubility parameter in which a polar term δp is 10 (MPa.sup.0.5) or more, and a second solvent which is different than the first solvent, the method including preparing a solution of the sulfur-containing compound by dissolving the sulfur-containing compound in the first solvent, and blending the solution of the sulfur-containing compound, the acid generating agent, and the second solvent.

The present disclosure provides a method of manufacturing a conductive pattern and applications thereof, the method including: a step of preparing a laminate including a transparent substrate, a light shielding pattern that is formed on the transparent substrate, and a negative tone photosensitive resin layer that is disposed on the transparent substrate and the light shielding pattern and is in contact with the transparent substrate; a step of irradiating a surface of the transparent substrate opposite to a surface facing the light shielding pattern with light; a step of developing the negative tone photosensitive resin layer to form a resin pattern in a region defined by the transparent substrate and the light shielding pattern; and a step of forming a conductive pattern on the light shielding pattern.

Disclosed are a salt represented by formula (I), an acid generator, and a resist composition:

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wherein R.sup.1, R.sup.2 and R.sup.3 each represent a hydroxy group, *—O—R.sup.10, *—O-L.sup.10-CO—O—R.sup.10, etc.; L.sup.10 represents an alkanediyl group; R.sup.10 represents an acid-labile group; R.sup.4 to R.sup.9 each represent a halogen atom, a haloalkyl group, etc.; A.sup.1, A.sup.2 and A.sup.3 each represent a hydrocarbon group, etc.; m1 and m7 represent an integer of 0 to 5, m2 to m6, m8 and m9 represent an integer of 0 to 4, 0≤m1+m7≤5, 0≤m2+m8≤4, 0≤m3+m9≤4, and at least one of m1, m2 and m3 represents an integer of 1 or more; X.sup.4 represents a single bond, —CH.sub.2—, etc.; and Al.sup.− represents an organic anion.

A polymer compound is provided which is changed from a water-insoluble state to a water-soluble state by irradiation with light. The polymer compound is represented by Formula (5), where A and B are a single bond or a functional group, R.sup.3, R.sup.4, and R.sup.9 are hydrogen or an alkyl group, and R.sup.6 and R.sup.7 are hydrogen, an alkyl group, or the like.

Embodiments in accordance with the present invention encompass compositions encompassing a latent catalyst and a thermal or photoactivator along with one or more monomers which undergo ring open metathesis polymerization (ROMP) when said composition is heated to a temperature from 50° C. to 100° C. or higher to form a substantially transparent film. Alternatively the compositions of this invention also undergo polymerization when subjected to suitable radiation. The monomers employed therein have a range of refractive index from 1.4 to 1.6 and thus these compositions can be tailored to form transparent films of varied refractive indices. The compositions of this invention further comprises inorganic nanoparticles which form transparent films and further increases the refractive indices of the compositions. Accordingly, compositions of this invention are useful in various opto-electronic applications, including as coatings, encapsulants, fillers, leveling agents, among others.

A photosensitive resin composition is also provided that includes a polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor; a photo-radical polymerization initiator; and a solvent, in which an acid value of an acid group contained in the polymer precursor and having a neutralization point in a pH range of 7.0 to 12.0 is in a range of 2.5 to 34.0 mgKOH/g, and either the polymer precursor contains a radically polymerizable group or the photosensitive resin composition includes a radically polymerizable compound other than the polymer precursor.

A photosensitive resin composition is also provided that includes a polymer precursor selected from a polyimide precursor and a polybenzoxazole precursor; a photo-radical polymerization initiator; and a solvent, in which an acid value of an acid group contained in the polymer precursor and having a neutralization point in a pH range of 7.0 to 12.0 is in a range of 2.5 to 34.0 mgKOH/g, and either the polymer precursor contains a radically polymerizable group or the photosensitive resin composition includes a radically polymerizable compound other than the polymer precursor.

A lithographic printing plate precursor having an image-recording layer on a hydrophilic support, in which the image-recording layer includes an organic polymer particle, and the organic polymer particle is a reaction product obtained by at least reacting an aromatic polyvalent isocyanate compound having a structure represented by Formula PO and water, a method for making a lithographic printing plate having excellent printing resistance in the case of using an ultraviolet-curable ink in printing, a new organic polymer particle, and a resin composition including the organic polymer particle. ##STR00001##

A radiation-sensitive resin composition includes: a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid; a radiation-sensitive acid generator; and a compound represented by formula (1). Ar.sup.1 represents a group obtained by removing (a+b+2) hydrogen atoms from an aromatic hydrocarbon ring having 6 to 30 ring atoms; R.sup.1 represents a halogen atom or a monovalent organic group having 1 to 20 carbon atoms; L.sup.1 represents a divalent linking group; R.sup.2 represents a substituted or unsubstituted monovalent aromatic hydrocarbon group having 6 to 20 carbon atoms; a is an integer of 0 to 10, b is an integer of 1 to 10, wherein a sum of a and b is no greater than 10; and X.sup.+ represents a monovalent radiation-sensitive onium cation.

##STR00001##

A method of manufacturing a semiconductor structure includes the following operations. A photoresist layer is formed on a metal layer, in which the photoresist layer includes an additive selected from the group consisting of a first heterocyclic compound containing a triazole ring, a second heterocyclic compound containing an imidazole ring, biphenyl thiol, biphenyl dithiol, benzenethiol, and benzenedithiol. The photoresist layer is exposed to an actinic radiation. The photoresist layer is developed by a developer to form holes in the photoresist layer. Redistribution lines are formed in the holes by an electroplating process.