A fluorocarboxylic acid-containing polymer comprising recurring units having formula (A1), but not acid labile group-containing recurring units is provided. A resist composition comprising the same offers a high sensitivity and is unsusceptible to nano-bridging or pattern collapse independent of whether it is of positive or negative tone. ##STR00001##

A sulfonium salt represented by a following general formula (1),

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wherein in the general formula (1), each of R.sup.1 to R.sup.3 is independently an alkyl group, an aryl group, or a heteroaryl group;

at least one carbon-carbon single bond contained in the alkyl group is optionally substituted with a carbon-carbon double bond or a carbon-carbon triple bond;

at least one methylene group contained in the alkyl group is optionally substituted with at least one divalent heteroatom-containing group;

Ar.sup.1 is an arylene group;

at least one of R.sup.1, R.sup.2, R.sup.3 and Ar.sup.1 has at least one substituent (R);

at least two of R.sup.1 to R.sup.3, Ar.sup.1, and substituent (R) optionally form a ring;

A is a divalent group selected from a group consisting of —S—, —SO—, and —SO.sub.2—;

Ar.sup.1 is substituted with A at an ortho-position with respect to a sulfonio group (S.sup.+); and

X.sup.− is an anion.

An EO/PO modified 9-phenylacridine photosensitizer having the structure as shown in general formula (I). When the photosensitizer is applied to a photosensitive resin composition, the composition has characteristics of high photosensitivity, high resolution, high solubility, excellent dispersion stability, and excellent developing property, and has good hydrophilicity during development, the amount of sludges in a developer during recycling can be significantly reduced, so that the developer can be used repeatedly and effectively.

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Provided are a photosensitive coloring composition including a pigment and a diketopyrrolopyrrole compound A represented by Formula 1, in which, in a case where molar contents of the diketopyrrolopyrrole compound A and a diketopyrrolopyrrole compound B represented by Formula 1 are each denoted by m.sup.A and m.sup.B, a value of m.sup.A/(m.sup.A+m.sup.B) is 10 mol % to 100 mol %, and a content of the pigment is 35% by mass or more with respect to a total solid content of the photosensitive coloring composition; a cured substance of the photosensitive coloring composition, a color filter including the cured substance, a solid-state imaging element or an image display device, and a novel asymmetric diketopyrrolopyrrole compound.

Diketopyrrolopyrrole compound A: A.sup.1 represents a monovalent organic group having an acidic or a basic functional group, and B.sup.1 represents a monovalent organic group not having an acidic or a basic functional group.

Diketopyrrolopyrrole compound B: A.sup.1 and B.sup.1 represent monovalent organic groups having an acidic or a basic functional group.

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A multi-spray RRC process with dynamic control to improve final yield and further reduce resist cost is disclosed. In one embodiment, a method, includes: dispensing a first layer of solvent on a semiconductor substrate while spinning at a first speed for a first time period; dispensing the solvent on the semiconductor substrate while spinning at a second speed for a second time period so as to transform the first layer to a second layer of the solvent; dispensing the solvent on the semiconductor substrate While spinning at a third speed for a third time period so as to transform the second layer to a third layer of the solvent; dispensing the solvent on the semiconductor substrate while spinning at a fourth speed for a fourth time period so as to transform the third layer to a fourth layer of the solvent; and dispensing a first layer of photoresist on the fourth layer of the solvent while spinning at a fifth speed for a fifth period of time.

The present invention is a positive resist material containing: an acid generator being a sulfonium salt of a sulfonate ion bonded to a polymer main chain; and a quencher being a sulfonium salt shown by the following general formula (1). R.sup.1 represents a fluorine atom, phenyl group, phenyloxycarbonyl group, alkyl group, alkoxy group, alkenyl group, alkynyl group, or alkoxycarbonyl group. Hydrogen atoms of these groups are optionally substituted. R.sup.2 to R.sup.4 each independently represent a halogen atom or hydrocarbyl group. R.sup.2 and R.sup.3, or R.sup.2 and R.sup.4, are optionally bonded with each other to form a ring with a sulfur atom that is bonded thereto. Thus, the present invention provides: a positive resist material having higher sensitivity than conventional positive resist materials, and having little edge roughness (LWR) and dimensional variation (CDU) in an exposure pattern; and a patterning process using the positive resist material.

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A resist composition comprising a polymer is provided, the polymer comprising repeat units derived from a sulfonium or iodonium salt having a nitro-substituted benzene ring in a linker between a polymerizable unsaturated bond and a fluorosulfonic acid site. The resist composition has a high sensitivity and forms a pattern with improved LWR or CDU, independent of whether it is of positive or negative tone.

There is provided a photosensitive resin composition comprising (A) a photopolymerizable compound having an ethylenically unsaturated group and an acid substituent, (B) a curing agent, (C) a photopolymerization initiator, and (D) a photopolymerizable compound, wherein the photopolymerizable compound (D) is a polyfunctional monomer which has a skeleton (X) derived from a polyhydric alcohol and having three or more bonding groups (a), each bonded to another structure and corresponding to a hydroxy group from which the hydrogen atom has been removed, and which has three or more (meth)acryloyl groups bonded directly or indirectly to the bonding groups (a), and wherein at least one (meth)acryloyl group of the three or more (meth)acryloyl groups is bonded to the bonding group(s) (a) via a linking group. There are also provided a dry film using the photosensitive resin composition, a printed wiring board, and a method for producing the printed wiring board.

Disclosed are a semiconductor photoresist composition and a method of forming patterns using the semiconductor photoresist composition. The semiconductor photoresist composition includes an organometallic compound represented by Chemical Formula 1 and a solvent and a method of forming patterns using the same.

A negative working, aqueous base developable, photosensitive photoresist composition and a process of using this composition to produce lithographic images, where this composition is one comprising: a) a polymer containing the four repeat units of structures (1), (2), (3), and (4), but no other types of repeat units; wherein v, x, y and z, respectively, represent the mole % of each repeat units of structures (1), (2), (3) and (4); b) a radical photo-initiator component, which is comprised of at least one radical photo initiator which is activated by a broad absorption of radiation from about 360 nm to about 440 nm; c) a crosslinker component which is either a mixture consisting of crosslinkers of structure (5), (6) and (7), or a single crosslinker of structure (8); d) a radical inhibitor component; e) an optional surfactant component; f) an optional dissolution promoter component; and g) a solvent. The invention also relates to the process of using this negative resist to produce lithographic images. ##STR00001##