According to one embodiment, a substrate processing device includes a stage configured to mount a substrate, a mold having a first surface facing an upper surface of an outer peripheral edge of the substrate and a second surface facing a side surface of an outer peripheral continuous with the upper surface of the outer peripheral edge, a mold moving mechanism configured to move the mold to bring the first surface close to the upper surface of the outer peripheral edge of the substrate and the second surface close to the side surface of the outer peripheral of the substrate, and a nozzle arranged in the mold, wherein the nozzle ejects resist.

The present disclosure provides a coating method and a coating system. The coating method comprises: providing a substrate, and dropping a first liquid onto the substrate; dropping, onto the first liquid, a second liquid which is immiscible with the first liquid and has a density greater than that of the first liquid; and rotating the substrate, such that the first liquid is diffused on the surface of the substrate, and the second liquid is diffused on the surface of the first liquid.

A storage container storing a treatment liquid for manufacturing a semiconductor is provided, wherein the occurrence of defects on the semiconductor, such as particles, is suppressed and a fine resist pattern or a fine semiconductor element is manufactured. The storage container includes a storage portion that stores a treatment liquid for manufacturing a semiconductor, and the treatment liquid for manufacturing a semiconductor includes one kind or two or more kinds of metal atoms and a total content of particulate metal is 0.01 to 100 mass ppt with respect to a total mass of the treatment liquid.

A storage container storing a treatment liquid for manufacturing a semiconductor is provided, wherein the occurrence of defects on the semiconductor, such as particles, is suppressed and a fine resist pattern or a fine semiconductor element is manufactured. The storage container includes a storage portion that stores a treatment liquid for manufacturing a semiconductor, and the treatment liquid for manufacturing a semiconductor includes one kind or two or more kinds of metal atoms and a total content of particulate metal is 0.01 to 100 mass ppt with respect to a total mass of the treatment liquid.

A black photosensitive resin composition comprising (A) an acid crosslinkable group-containing silicone resin, (B) carbon black, and (C) a photoacid generator is coated onto a substrate to form a photosensitive resin coating which has improved reliability with respect to adhesion and crack resistance, resolution and flexibility while maintaining satisfactory light shielding properties.

A black photosensitive resin composition comprising (A) an acid crosslinkable group-containing silicone resin, (B) carbon black, and (C) a photoacid generator is coated onto a substrate to form a photosensitive resin coating which has improved reliability with respect to adhesion and crack resistance, resolution and flexibility while maintaining satisfactory light shielding properties.

An object of the present invention is to provide: a compound containing an imide group which is not only cured under film formation conditions of inert gas as well as air, generates no by-product and has excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but can also form an organic underlayer film with favorable adhesion to a substrate. The present invention provides a material for forming an organic film, including: (A) a compound for forming an organic film shown by the following general formula (1A) or (1B); and (B) an organic solvent, ##STR00001##
noting that in the general formula (1A), when W.sub.1 represents any of ##STR00002##
R.sub.1 does not represent any of ##STR00003##

The present invention includes pleated paper and planar paper coated with a fire suppressive ink, wherein the pleated paper is Kraft paper with a weight of 25 to 50 pounds, with pleat angles of about 88 to 92°, and pleat heights between approximately 3/32 of an inch and ⅛ of an inch, and the planar paper is Kraft paper with a weight of 40 to 60 pounds. The fire suppressive ink is preferably applied with a flexographic printing process and preferably comprises at least one inorganic fusible salt and an organic resin. The inventive pleated paper is an environmentally friendly packaging material with improved protective qualities, which can also shield items from fire, contain fires, and suppress fires to avoid thermal runaway. The inventive paper is particularly useful for packaging and shipping flammable items, such as lithium-ion batteries.

The present invention includes pleated paper and planar paper coated with a fire suppressive ink, wherein the pleated paper is Kraft paper with a weight of 25 to 50 pounds, with pleat angles of about 88 to 92°, and pleat heights between approximately 3/32 of an inch and ⅛ of an inch, and the planar paper is Kraft paper with a weight of 40 to 60 pounds. The fire suppressive ink is preferably applied with a flexographic printing process and preferably comprises at least one inorganic fusible salt and an organic resin. The inventive pleated paper is an environmentally friendly packaging material with improved protective qualities, which can also shield items from fire, contain fires, and suppress fires to avoid thermal runaway. The inventive paper is particularly useful for packaging and shipping flammable items, such as lithium-ion batteries.

A method of processing a substrate, includes emitting light including vacuum ultraviolet light to a front surface of the substrate, which has a resist film formed thereon from a resist material for EUV lithography, before an exposure process in an interior of a processing container.