Systems and methods are provided for a turnkey modular printed circuit board enclosure that is generated using a template generator. The template generator accepts a user input comprising an enclosure parameter, based on which a manufacturing file may be generated. The manufacturing file may be provided to a fabricator for fabricating the enclosure or the manufacturing file may be modified in a printed circuit board design environment to incorporate a printed circuit board into the enclosure. The printed circuit board may be a separate printed circuit board that is inserted into the enclosure or it may be embedded in a face of the enclosure.

A system for running one or more applications is provided. Each application may require memory services that can be accelerated using configurable memory assistance circuits associated with different levels of a memory hierarchy. Integrated circuit design tools may be used to generate configuration data for programming the configurable memory assistance circuits. During compile time, the design tools may identify memory service patterns in a source code, match the identified memory service patterns to corresponding templates, parameterize the matching templates, and then synthesize the parameterized templates to produce the configuration data. During run time, a memory assistance scheduler may map the memory services required by each application to available memory assistance circuits in the system. The mapped memory assistance circuits are programmed by the configuration data to provide the desired memory service capability.

A system for running one or more applications is provided. Each application may require memory services that can be accelerated using configurable memory assistance circuits associated with different levels of a memory hierarchy. Integrated circuit design tools may be used to generate configuration data for programming the configurable memory assistance circuits. During compile time, the design tools may identify memory service patterns in a source code, match the identified memory service patterns to corresponding templates, parameterize the matching templates, and then synthesize the parameterized templates to produce the configuration data. During run time, a memory assistance scheduler may map the memory services required by each application to available memory assistance circuits in the system. The mapped memory assistance circuits are programmed by the configuration data to provide the desired memory service capability.

The present disclosure is directed to systems and methods of transferring bulk data, such as OLED compensation mask data, generated by a source device to a sink device using a high-bandwidth embedded DisplayPort (eDP) connection contemporaneous with an ENABLED Panel Self-Refresh (PSR) mode. Upon ENABLING the PSR mode, the source control circuitry causes the source transmitter circuitry, the sink receiver circuitry, and the eDP high-bandwidth communication link to remain active rather than inactive. The source control circuitry generates one or more data transport units (DTUs) having a header portion that contains data indicative of the presence of a bulk data payload and the non-display status of the bulk data payload carried by the DTUs.

The present disclosure is directed to systems and methods of transferring bulk data, such as OLED compensation mask data, generated by a source device to a sink device using a high-bandwidth embedded DisplayPort (eDP) connection contemporaneous with an ENABLED Panel Self-Refresh (PSR) mode. Upon ENABLING the PSR mode, the source control circuitry causes the source transmitter circuitry, the sink receiver circuitry, and the eDP high-bandwidth communication link to remain active rather than inactive. The source control circuitry generates one or more data transport units (DTUs) having a header portion that contains data indicative of the presence of a bulk data payload and the non-display status of the bulk data payload carried by the DTUs.

Embodiments of the invention are directed to a current sensor that includes a current controlled oscillator circuit configured to receive an input current and to provide an output signal having an output frequency which is dependent on the input current. The current sensor further includes a feedforward circuit configured to adapt a reference voltage of the current controlled oscillator in dependence on an instantaneous current value of the input current.

Embodiments of the invention are directed to a current sensor that includes a current controlled oscillator circuit configured to receive an input current and to provide an output signal having an output frequency which is dependent on the input current. The current sensor further includes a feedforward circuit configured to adapt a reference voltage of the current controlled oscillator in dependence on an instantaneous current value of the input current.

Embodiments include herein are directed towards a method for use in an electronic design environment is provided. Embodiments may include receiving a netlist associated with an electronic design and performing genetic optimization on a portion of the netlist to identify and place one or more capacitors on a printed circuit board to minimize an impedance associated with a power plane. Embodiments may further include displaying, at a graphical user interface, a placement of the one or more capacitors, wherein the placement is based upon, at least in part, the performing.

Well pick-up (WPU) regions are disclosed herein for improving performance of memory arrays, such as static random access memory arrays. An exemplary integrated circuit (IC) device includes a circuit region, a WPU region, a first well extending lengthwise along a first direction through the circuit region and into the WPU region, a second well extending lengthwise along the first direction through the circuit region and into the WPU region, and a third well physically connecting a portion of the first well in the WPU region and a portion of the second well in the WPU region.

Well pick-up (WPU) regions are disclosed herein for improving performance of memory arrays, such as static random access memory arrays. An exemplary integrated circuit (IC) device includes a circuit region, a WPU region, a first well extending lengthwise along a first direction through the circuit region and into the WPU region, a second well extending lengthwise along the first direction through the circuit region and into the WPU region, and a third well physically connecting a portion of the first well in the WPU region and a portion of the second well in the WPU region.