Aspects include a system and method for detection of computer-aided design (CAD) objects in point clouds. An example method includes obtaining, by a processing device, a labeled data set. The method further includes training, by the processing device, a model on the labeled data set using a two-dimensional (2D) object detector to calculate a three-dimensional (3D) box out of a detected 2D box by mapping coordinates on a geometric primitive image into 3D. The method further includes fitting, by the processing device, a computer-aided design (CAD) model into the 3D box.

A method and system provide the ability to propagate object connections. A three-dimensional (3D) model (that has 3D object components) is acquired. Two or more of the 3D object components are selected as input elements. A connection between the input elements is defined and selected. Data is autonomously collected from the selected connection. The data includes a number of the input elements, a section type of the input elements, and a relative geometrical position between the input elements. A rule autonomously created based on the data. The 3D model is autonomously searched based on the rule to identify other instances of other 3D object components that are consistent with the data. The connection is then autonomously propagated to the identified other 3D object components.

A system and a method are disclosed for placing hardware components on a printed circuit board (“PCB”) in a way that enables all hardware components on the PCB to be passively cooled without using active cooling systems. Components are selected to be placed onto the PCB and heat metrics for each component is obtained (e.g., from a server). The components are ranked based on the amount of heat that each component generates. A corresponding position for each of the hardware components is determined based on the ranking of the components and the orientation of the PCB. The placement is based on the concept that air having higher temperature rises while air having cooler temperature falls. A representation of the PCB according to corresponding positions of the hardware components may be generated for display.

An integrated circuit includes a middle active-region structure between a group-one active-region structure and a group-two active-region structure. The integrated circuit also includes a main circuit, a group-one circuit, and a group-two circuit. The main circuit includes at least one boundary gate-conductor intersecting the middle active-region structure. The group-one circuit includes a group-one isolation structure separating the group-one active-region structure into a first part in the group-one circuit and a second part in a first adjacent circuit. The group-two circuit includes a group-two isolation structure separating the group-two active-region structure into a first part in the group-two circuit and a second part in a second adjacent circuit.

A computer-implemented method of designing at least a portion of an electronic circuit schematic is described herein. The method comprises receiving requirements for an electronic circuit or at least a portion of an electronic circuit, creating a set of variables and constraints based on the requirements for the electronic circuit, wherein the constraints limit the possible value that may be assigned to the variables, assigning values to the variables using a solver such that the values of the variables satisfy the constraints, and outputting at least a portion of a designed electronic circuit schematic or circuit schematic specification that meets the requirements for the electronic circuit based on the assigned values of the variables.

A system for managing additive manufacturing (AM) may comprise a datastore configured to store entries pertaining to a design for a three-dimensional (3D) object. The entries may be configured to include a respective set of parameters for an AM process. The parameters may be configured to cause an AM system to produce 3D objects having anisotropic mechanical properties that satisfy specified anisotropic mechanical requirements. The system may further comprise a design manager configured to determine a set of parameters that optimally satisfy the specified requirements, e.g., satisfy the requirements at a minimal cost.

Pattern centric process control is disclosed. A layout of a semiconductor chip is decomposed into a plurality of intended circuit layout patterns. For the plurality of intended circuit layout patterns, a corresponding plurality of sets of fabrication risk assessments corresponding to respective ones of a plurality of sources is determined. Determining a set of fabrication risk assessments for an intended circuit layout pattern comprises determining fabrication risk assessments based at least in part on: simulation of the intended circuit layout pattern, statistical analysis of the intended circuit layout pattern, and evaluation of empirical data associated with a printed circuit layout pattern. A scoring formula is applied based at least in part on the sets of fabrication risk assessments to obtain a plurality of overall fabrication risk assessments for respective ones of the plurality of intended circuit layout patterns. The plurality of intended circuit layout patterns is ranked based on their fabrication risk assessments, the corresponding overall fabrication risk assessments, or both. At least a portion of ranking information is outputted to facilitate influence or control over the semiconductor fabrication process.

Automated circuit and layout generation is disclosed. Various embodiments may include a computer system and/or method for generating a circuit layout comprising specifying a circuit schematic to be converted to a circuit layout, receiving a layout script associated with the circuit schematic, the layout script configured to position a plurality of layout instances generated from the circuit schematic, converting the circuit schematic into the plurality of layout instances; and positioning the plurality of layout instances based on the layout script to produce the circuit layout. A circuit may be produced by fabricating a circuit using the layout.

An integrated circuit includes a middle active-region structure between a group-one active-region structure and a group-two active-region structure. The integrated circuit also includes a main circuit, a group-one circuit, and a group-two circuit. The main circuit includes at least one boundary gate-conductor intersecting the middle active-region structure. The group-one circuit includes a group-one isolation structure separating the group-one active-region structure into a first part in the group-one circuit and a second part in a first adjacent circuit. The group-two circuit includes a group-two isolation structure separating the group-two active-region structure into a first part in the group-two circuit and a second part in a second adjacent circuit.

A microscope simulation device includes a processor. The processor is configured to acquire a plurality of pieces of component information each indicating a technical specification of a corresponding microscope component, simulate an assembly of a microscope system based on the acquired plurality of pieces of component information, and output a generated simulation result to a display device.