The present application discloses a design method, a design device, a computer device, and a storage medium for a chip. Where, the design method of the chip includes creating a power bus network according to position of the pad and the chip layout floor plan, determines the position of the power port of the circuit module in the power bus network, and creates a power supply network model according to the power bus network, according to the power supply network model and the power port of the circuit module generates a network table with a power supply network in the power supply port of the power bus network, and circuit simulation is performed according to a network table in which the power supply network is embedded. The design method, design device, computer device and storage medium provided herein, shorten the chip design development cycle, and reduce design costs.

Systems and methods for context aware circuit design are described herein. A method includes: identifying at least one cell to be designed into a circuit; identifying at least one context parameter having an impact to layout dependent effect of the circuit; generating, for each cell and for each context parameter, a plurality of abutment environments associated with the cell; estimating, for each cell and each context parameter, a sensitivity of at least one electrical property of the cell to the context parameter by generating a plurality of electrical property values of the cell under the plurality of abutment environments; and determining whether each context parameter is a key context parameter for a static analysis of the circuit, based on the sensitivity of the at least one electrical property of each cell and based on at least one predetermined threshold.

Systems and methods to translate or convert a desired circuit into a database that instructs a place and route or wire bonding machine where on a substrate to place components and also where to place bond wires on the pads of a connection matrix on a substrate. During the assembly process, the pads of the connection matrix are populated with bond wires using the database.

Disclosed is a method implemented with a computer system executing instructions for a semiconductor design simulation. The method includes generating a plurality of floor plans placing a plurality of circuit blocks differently, generating a plurality of power models from the plurality of floor plans, and selecting a layout corresponding to one of the plurality of floor plans by selecting at least one power model satisfying system requirements from among the plurality of power models.

Within a layout of a first surface in a flip chip configuration, a bump restriction area is mapped according to a set of bump placement restrictions, wherein a first bump placement restriction specifies an allowed distance range between a bump and a qubit chip element in a layout of the first surface in the flip chip configuration. An electrically conductive material is deposited outside the bump restriction area, to form the bump, wherein the bump comprises an electrically conductive structure that electrically couples a signal from the first surface and is positioned according to the set of bump placement restrictions.

Route segments of a set of nets may be grouped into route groups. Terminals of the set of nets may be grouped into terminal groups. For each net in the set of nets, a net signature may be determined based on route groups associated with the net and terminal groups associated with the net. The set of nets may be grouped into net groups based on the net signatures.

An EDA pad package library updating/application method and system, a medium, and a terminal. The method includes: extracting a graphic data of a pad and setting information of a component based on the pad from an EDA wiring data; querying and downloading a graphic model of the component according to attribute information of the component; forming a simulated package pad by simulating and assembling the graphical model of the component and the graphical data of the pad according to setting information of the component based on the pad; storing the simulated package pad in a model database, updating an existed EDA pad package library by associating the simulated package pad to a predetermined keyword/words in the model database. A package pad created by others can be quickly obtained without a package pad library. The best pads that have been verified can be updated continuously and quickly.

Techniques that facilitate hybrid modeling for a device under test associated with a cooling system (e.g., a two-phase cooling system) are provided. In one example, information indicative of a first model of a device under test associated with a cooling system is determined. Second information indicative of constraints that define values for an operational quantity related to the cooling system is also determined. Information indicative of a second model for the device under test is generated based on the information indicative of the first model and the second information indicative of the one or more constraints. In an aspect, a first simulation process is performed to determine first thermal properties for a first simulation domain associated with the device under test. In another aspect, a second simulation process is performed to determine second thermal properties for a second simulation domain associated with the device under test.

An integrated circuit structure includes a metal level comprising a plurality of interconnect lines along a first direction. A cell is on the metal level, wherein one or more of the plurality of interconnect lines that extend through the cell comprise a power shared track that is segmented inside the cell into one or more power segments and one or more signal segments so that both power and signals share a same track.

A design method for a semiconductor package including a first chip, a second chip, a 2.5 dimensional (2.5D) interposer, a package substrate, and a board includes generating a layout including the 2.5D interposer on the package substrate and the first and second chips individually arranged on the 2.5D interposer, based on design information; analyzing signal integrity and power integrity between the first and second chips from the layout; analyzing signal integrity or power integrity between the first chip and at least one third chip on the board from the layout; and determining whether to modify the layout based on the analysis results.