Examples of methods for object packings are described herein. In some examples, a method includes loading a first object in a first subset of a volume. In some examples, the method includes determining, using a genetic procedure, an arrangement of second objects in a second subset of the volume to produce a packing that includes the first object and the second objects.

Embodiments of the invention include methods, systems, and computer program products for checking metal coverage in a laminate structure. Aspects of the invention include receiving, by a processor, metal shadowing rules and a semiconductor package design comprising a plurality of laminate layers, a plurality of metal power shapes, and a plurality of signal lines. Each metal power shape is mapped to one or more cells in a two-dimensional array. The processor determines, for each signal line in the semiconductor package design, whether the metal power shapes satisfy the metal shadowing rules. The processor displays a list of signal lines that do not satisfy the metal shadowing rules.

Systems and methods to translate or convert a desired circuit into a database that instructs a place and route or wire bonding machine where on a substrate to place components and also where to place bond wires on the pads of a connection matrix on a substrate. During the assembly process, the pads of the connection matrix are populated with bond wires using the database.

Systems, apparatuses and/or methods may provide for generating a packing order of items within a container that consolidates the items into a reduced space. Items may be scanned with a three-dimensional (3D) imager, and models may be generated of the items based on the data from the 3D imager. The items may be located within minimal-volume enclosing bounding boxes, which may be analyzed to determine whether they may be merged together in one of their bounding boxes, or into a new bounding box that is spatially advantageous in terms of packing. If a combination of items is realizable and is determined to take up less space in a bounding box than the bounding boxes of the items considered separately, then they may be merged into a single bounding box. Thus, a spatially efficient packing sequence for a plurality of real objects may be generated to maximize packing efficiency.

This disclosure relates to a method for producing a padding for transporting general cargo in an outer packaging using a computer, a 3D scanner and/or a padding machine by obtaining 3D data of a 3D CAD model and material data for each item of cargo from a database and/or by three-dimensional scanning of the cargo with the 3D scanner, sorting the cargo on the basis of the 3D CAD data and the material data into an existing transport category or into a transport category that is created, grouping the items into a cargo group on the basis of the transport category and/or the general cargo ID, virtually arranging the cargo group in the outer packaging, selecting a 3D CAD model of a padding template based on the virtual arrangement, calculating a difference, a break and/or an association between the virtual arrangement of the cargo group in the selected 3D CAD model of the padding template and the 3D CAD model of the selected padding template, the 3D CAD model of the cargo and the coordinates and orientation of the 3D CAD model of the cargo as 3D CAD model of a virtual padding, and producing the padding from the 3D CAD model of the virtual padding with the padding machine.

Embodiments of the invention include methods, systems, and computer program products for checking metal coverage in a laminate structure. Aspects of the invention include receiving, by a processor, metal shadowing rules and a semiconductor package design comprising a plurality of laminate layers, a plurality of metal power shapes, and a plurality of signal lines. Each metal power shape is mapped to one or more cells in a two-dimensional array. The processor determines, for each signal line in the semiconductor package design, whether the metal power shapes satisfy the metal shadowing rules. The processor displays a list of signal lines that do not satisfy the metal shadowing rules.

A method for performing a design rule check of a computer aided design (CAD) file corresponding to a geometry of a tool for use in a process for making an article from a starting material. Design rules defined to avoid a geometry of the tool documented as causing an inefficiency in a non-printing or non-platemaking operation of the process are stored in a computer. A design rule checking (DRC) module of the computer processes the CAD file relative to the stored design rules, identifies violations, automatically suggests design changes responsive to each violation, receives a user input responsive to suggested design changes, and modifies the CAD file in response to the user input. Non-transitory computer readable media containing code for implementing the method and related CAD systems are also described.

An article-storage simulation device includes an acquisition unit that acquires a size of each of the plurality of articles and a size of the storage container. A simulator determines the number of storage containers to be used for storing the articles and a number of articles to be stored by calculation. The calculation uses the acquired size of the articles and the acquired size of the container. The simulator (i) places the article in the container, (ii) determines whether a next article can be placed in the container after the article is placed, and (iii) in a case where the simulator determines that the next article can be placed, places the next article in the container after the article is placed and in a case where the simulator determines that the next article cannot be placed, adds a next container to be used for storing the next article.

Embodiments of the invention include methods, systems, and computer program products for checking metal coverage in a laminate structure. Aspects of the invention include receiving, by a processor, metal shadowing rules and a semiconductor package design comprising a plurality of laminate layers, a plurality of metal power shapes, and a plurality of signal lines. Each metal power shape is mapped to one or more cells in a two-dimensional array. The processor determines, for each signal line in the semiconductor package design, whether the metal power shapes satisfy the metal shadowing rules. The processor displays a list of signal lines that do not satisfy the metal shadowing rules.

The present disclosure relates generally to systems and methods for creating protective packaging. A device comprises a processor and a memory. The memory contains computer readable instructions that, when executed by the processor, cause the processor to receive, from an external sensor, data that is indicative of physical characteristics for an object to be packaged, determine a type of object to which the object to be packaged corresponds based on the physical characteristics, select one or more type of packaging elements for packaging the object based on the type of object, and cause a packaging machine to create packaging elements of the selected type.