In an approach to determining the optimal size and shape of additive manufactured packaging, a delivery location corpus, a storage location corpus, and a transportation mechanism corpus are received. A notification to design a package for an item is received. The optimal design attributes are determined for the delivery location. The optimal design attributes are determined for the storage location. The optimal design attributes are determined for the transportation mechanism. The additive manufactured packaging for the item is designed based on the optimal design attributes for the delivery location, the storage location, and the transportation mechanism.

A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.

It is provided a computer-implemented method for designing a folded sheet object, comprising the steps of providing (S10) panels separated by bend lines, including at least four adjacent panels forming a cycle and separated by concurrent bend lines, with predetermined angles between successive bend lines; and determining (S20) a control law linking the angles between the adjacent panels of the cycle, as a function of the predetermined angles between successive bend lines. Such a method improves the design of a folded sheet object.

This disclosure relates to a method for producing a padding for transporting general cargo in an outer packaging using a computer, a 3D scanner and/or a padding machine by obtaining 3D data of a 3D CAD model and material data for each item of cargo from a database and/or by three-dimensional scanning of the cargo with the 3D scanner, sorting the cargo on the basis of the 3D CAD data and the material data into an existing transport category or into a transport category that is created, grouping the items into a cargo group on the basis of the transport category and/or the general cargo ID, virtually arranging the cargo group in the outer packaging, selecting a 3D CAD model of a padding template based on the virtual arrangement, calculating a difference, a break and/or an association between the virtual arrangement of the cargo group in the selected 3D CAD model of the padding template and the 3D CAD model of the selected padding template, the 3D CAD model of the cargo and the coordinates and orientation of the 3D CAD model of the cargo as 3D CAD model of a virtual padding, and producing the padding from the 3D CAD model of the virtual padding with the padding machine.

The present disclosure relates generally to systems and methods for creating protective packaging. A device comprises a processor and a memory. The memory contains computer readable instructions that, when executed by the processor, cause the processor to receive, from an external sensor, data that is indicative of physical characteristics for an object to be packaged, determine a type of object to which the object to be packaged corresponds based on the physical characteristics, select one or more type of packaging elements for packaging the object based on the type of object, and cause a packaging machine to create packaging elements of the selected type.

Systems, apparatuses and/or methods may provide for generating a packing order of items within a container that consolidates the items into a reduced space. Items may be scanned with a three-dimensional (3D) imager, and models may be generated of the items based on the data from the 3D imager. The items may be located within minimal-volume enclosing bounding boxes, which may be analyzed to determine whether they may be merged together in one of their bounding boxes, or into a new bounding box that is spatially advantageous in terms of packing. If a combination of items is realizable and is determined to take up less space in a bounding box than the bounding boxes of the items considered separately, then they may be merged into a single bounding box. Thus, a spatially efficient packing sequence for a plurality of real objects may be generated to maximize packing efficiency.

Packaging for preservation of biological material, wherein, in use, the packaging is filled with biological material and placed in an apparatus for preserving the biological material such that a heat exchange fluid flows around the packaging, the packaging including: one or more packaging walls configured to define an internal compartment for receiving the biological material; and one or more thermal contours defined across at least one of the packaging walls, wherein, in use, the flow of the heat exchange fluid is at least partially directed by the one or more thermal contours to improve heat transfer between the heat exchange fluid and the biological material contained in the packaging.

A temperature change of a device on an integrated circuit chip due to self-heating and thermal coupling with other device(s) is modeled considering inefficient heat removal from the backside of the chip. To perform such modeling, ratios of an imaginary heat amount to an actual heat amount for different locations on the IC chip must be predetermined using a test integrated circuit (IC) chip. During testing, one test device at one specific location on the test IC chip is selected to function as a heat source, while at least two other test devices at other locations on the test IC chip function as temperature sensors. The heat source is biased and changes in temperature at the heat source and at the sensors are determined. These changes are used to calculate the value of the imaginary heat amount to actual heat amount ratio to be associated with the specific location.

A method for designing a product processing apparatus. The method includes: providing a design of a product processing apparatus; providing a representation of the product processing apparatus; providing a representation of a product; providing a representation of a product package; simulating the interactions of any combination of the product, apparatus, and package as a set of transformations utilizing the product, apparatus, and/or package representations; creating a surrogate model for at least one transformation of the set utilizing the simulation results; evaluating the performance of the apparatus utilizing the set of surrogate models of the transformations; and altering the design of the apparatus according to the evaluation.

Printed circuit boards (PCBs) can be designed to have dynamic warp characteristics complimentary to those of an attached component. A PCB and an attached component can be designed to dynamically warp, during a thermal excursion, in the same direction and with approximately the same magnitude of warp. Warp characteristics of the PCB and the attached component can be determined by the vertical thickness of conductor and dielectric layers, by the wiring density and number of conductor layers. Warp characteristics can also be at least partially determined by the arrangement/ordering of conductor and dielectric layers, by dimensions of a sash structure surrounding a component outline and by dimensions of a prepreg layer applied to an existing design. Such a prepreg layer can cover a portion or an entirety of one of the PCBs planar surfaces.