A multi-bit flip-flop includes a first flip-flop, a second flip-flop and a first inverter. The first flip-flop has a first driving capability, and includes a first reset pin configured to receive a first reset signal. The second flip-flop has a second driving capability different from the first driving capability. The second flip-flop includes a second reset pin configured to receive the first reset signal, and the first reset pin and the second reset pin are coupled together. The first inverter is configured to receive a first clock signal on a first clock pin, and configured to generate a second clock signal inverted from the first clock signal. The first flip-flop and the second flip-flop are configured to share at least the first clock pin.

Systems and methods for providing Chronos Channel interconnects in an ASIC are provided. Chronos Channels rely on a reduced set of timing assumptions and are robust against delay variations. Chronos Channels transmit data using delay insensitive (DI) codes and quasi-delay-insensitive (QDI) logic. Chronos Channels are insensitive to all wire and gate delay variations, but for those belonging to a few specific forking logic paths called isochronic forks. Chronos Channels use temporal compression in internal paths to reduce the overheads of QDI logic and efficiently transmit data. Chronos Channels are defined by a combination of a DI code, a temporal compression ratio and hardware.

Approaches for placing logic of a circuit design include determining respective relative activation rates of control paths in a high-level language (HLL) program by a design tool. The HLL program specifies a circuit design. The design tool compiles the HLL program into logic functions and determines respective relative activation rates of signal connections between the logic functions based on the relative activation rates of the control paths in the HLL program. The design tool selects placement locations on an integrated circuit device for the logic functions using a placement cost minimization function that factors the relative activation rates of the signal connections into placement costs.

A method and system for migrating an existing ASIC design from one semiconductor fabrication process to another are disclosed herein. In some embodiments, a method for migrating the existing ASIC design comprises parsing the gate-level netlist one row at a time into one or more standard cells forming the ASIC design, forming a plurality of mapping tables having mapping rules for mapping the parsed one or more standard cells into equivalent target standard cells implemented in the second semiconductor fabrication process, mapping the parsed one or more standard cells into the equivalent target standard cells using the plurality of mapping tables, and generating a target gate-level netlist describing the ASIC design in terms of the equivalent target standard cells.

A voltage controlled oscillator includes a resonator and an amplifier. The resonator includes a capacitive element and an inductive element. The inductive element has a plurality of conductive segments forming a physical loop. The inductive element has electrical connections on the physical loop to the plurality of conductive segments forming at least one electrical loop disposed within an interior space formed by the physical loop. The amplifier has an input and an output, the input coupled to a first conductive segment forming a first impedance and the output coupled to a second conductive segment forming a second impedance.

A method of configuring an integrated circuit including multiple hardware tiles, includes: establishing a data forwarding path through the multiple hardware tiles by configuring each hardware tile, except for a last hardware tile, of the multiple hardware tiles to be in a data forwarding state, in which configuring each hardware tile, except for the last hardware tile, to be in a forwarding state includes installing a respective forwarding state counter specifying a corresponding predefined length of time that the hardware tile is in the data forwarding state; supplying, along the data forwarding path, each hardware tile of the plurality of hardware tiles with a respective program data packet comprising program data for the hardware tile; and installing, for each hardware tile of the multiple hardware tiles, the respective program data.

An emulator system and a method for emulating functionalities of an integrated circuit design are disclosed. In one aspect, the system includes a plurality of verification components each comprising circuitry configured to perform transactions with at least another verification component. The system can include a plurality of proxies, each executing on a processor and corresponding to a respective one of the verification components. The system can include a switch that is communicatively coupled with the proxies, the switch dynamically configurable to, in a first time duration, operate with a first subset of the proxies to enable a first transaction between a functional module of the design and a first verification component. The switch can be dynamically configurable to, in a second time duration, operate with a second subset of the proxies to enable a second transaction between the functional module and a second verification component.

A method and system for migrating an existing ASIC design from one semiconductor fabrication process to another are disclosed herein. In some embodiments, a method for migrating the existing ASIC design comprises parsing the gate-level netlist one row at a time into one or more standard cells forming the ASIC design, forming a plurality of mapping tables having mapping rules for mapping the parsed one or more standard cells into equivalent target standard cells implemented in the second semiconductor fabrication process, mapping the parsed one or more standard cells into the equivalent target standard cells using the plurality of mapping tables, and generating a target gate-level netlist describing the ASIC design in terms of the equivalent target standard cells.

An integrated circuit (IC) including a plurality of finfet cells designed with digital circuit design rules to provide smaller finfet cells with decreased cell heights, and analog circuit cell structures including first finfet cells of the plurality of finfet cells and including at least one cut metal layer. The smaller finfet cells with decreased cell heights provide a first shorter metal track in one direction and the at least one cut metal layer provides a second shorter metal track in another direction to increase maximum electromigration currents in the integrated circuit.

A multi-bit flip-flop includes a first flip-flop, a second flip-flop, a first inverter, and a second inverter. The first flip-flop has a first driving capability. The second flip-flop has a second driving capability different from the first driving capability. The first inverter is configured to receive a first clock signal on a first clock pin, and is configured to generate a second clock signal inverted from the first clock signal. The second inverter is coupled to the first inverter, is configured to receive the second clock signal, and is configured to generate a third clock signal inverted from the second clock signal. The first flip-flop and the second flip-flop are configured to share at least the first clock pin.