An interactive information system includes a first frame, a second frame, and a first inter-frame cable. A first interactive module is arranged in the first frame and includes a first display module; a first touch input module; at least one first user input device; a first control module bridge board configured to transmit intra-frame electrical signals; a first interactive module bridge board configured to transmit inter-frame signals; and a first intra-frame cable. A control module is arranged in the second frame and includes a logic module configured to generate the first GUI and to perform function of the interactive information system based on user inputs. The first interactive module and the control module are electrically coupled via only the first inter-frame cable. Both the first frame and the second frame contain an electro-magnetic (EM) shielding material.

In one embodiment, a computing system may access design data of a printed circuit board to be produced by a manufacturing process. The system may determine one or more corrections for the design data of the printed circuit board based on one or more correction rules for correcting one or more parameters associated with the printed circuit board. The system may automatically adjust one or more of the parameters associated with the design data of the printed circuit board based on the one or more corrections. The adjusted parameters may be associated with an impedance of the printed circuit board. The one or more corrections may cause the impendence of the printed circuit board to be independent from layer thickness variations of the printed circuit board to be produced by the manufacturing process.

A combination of fastening points is obtained by repeating following steps as an optimum value when an evaluation method of a physical quantity acting on a substrate is specified. The steps include: obtaining the physical quantity according to the combination of fastening points; generating a regression model expressing one fastening point candidate by a binary variable; converting the regression model into an Ising model based on the evaluation method; and determining the combination of fastening points by selecting one of fastening points from the fastening point candidate positions using an Ising machine so as to minimize an evaluation value of the Ising model.

An impedance matching method includes following operations: providing load impedance data of a network interface controller chip; providing characteristic data of a network transformer, in which the network transformer is configured to be connected to the network interface controller chip via a transmission line on a printed circuit board, and a first predetermined data rate of the network transformer is lower than a second predetermined data rate of the network interface controller chip; adjusting an arrangement among the load impedance data, a length of the transmission line, and a width of the transmission line according to the characteristic data to adjust an impedance matching between the network transformer and the network interface controller chip, in order to make the network transformer meet a predetermined requirement corresponding to the second predetermined data rate; and storing the arrangement to be design data for fabricating the printed circuit board.

An artificial intelligence (AI) based system and method for electrical design inspection, configured to autonomously extract, convert, and analyze data from electrical documentation related to electrical circuits by utilizing AI algorithms along with deterministic algorithms in order to produce output results.

In one embodiment, an X-ray inspection system may nondestructively inspect a printed circuit board to measure a number of dimensions at a number of pre-determined locations of the printed circuit board. The X-ray inspection system may generate a data set for the printed circuit board based on the measured dimensions. The X-ray inspection system may calculate one or more drilling values based on the data set of the printed circuit board. The X-ray inspection system may provide, to a drilling machine, instructions for drilling a number of plated-through vias based on the calculated drilling values for the printed circuit board.

A stencil-avoidance design method, a stencil-avoidance design device, an electronic device, and a non-transitory storage medium are provided. The method includes: obtaining a plurality of first regions and a plurality of first stencil aperture regions; determining whether a shortest distance between a selected first region of the plurality of first regions and a selected first stencil aperture region of the plurality of first stencil aperture regions is within a preset threshold range; further obtaining a second region and a second stencil aperture region if the shortest distance is within the preset threshold range, and then obtaining a third region; performing a collision step if a collision test is required, and obtaining a final stencil aperture region. The above method can improve the efficiency, accuracy, coverage, and comprehensiveness of the stencil avoidance design.

A non-transitory computer-readable storage medium storing an electromagnetic field analysis program that causes at least one computer to execute a process, the process includes specifying a dimension of a width of wiring included in first circuit information and a dimension of a thickness of the wiring; generating second circuit information obtained by changing value of one selected from the dimension of the width and the dimension of the thickness to zero based on a ratio between the dimension of the width and the dimension of the thickness; and executing an electromagnetic field analysis based on the second circuit information.

A system and method for performing time-dependent reliability prediction of a printed circuit board (PCB) embedded in a sensor that monitors the health (viz., performance) of operating equipment subject to different environmental stressors. The method includes developing a digital twin (DT) of the physical PCB, generating sensor data, transmitting the sensor data, and receiving sensor data and historical conditional data by the twinning module, wherein the historical condition data includes known failure data of one or more electronic components of the circuit board based on an internal condition or and external condition. The method further includes embedded physics-based reliability models informed by inputs from the sensor data and the historical conditional data, generating a real-time failure prediction signal based on the physics-based reliability models, and reporting the real-time failure prediction signal. The circuit board may include printed circuit boards (PCBs), particularly additively-manufactured printed circuit boards (AM-PCBs).

In one embodiment, an automated high-speed X-ray inspection system may generate a first X-ray image of an inspected sample at a first direction substantially orthogonal to a plane of the inspected sample. The first X-ray image may be a high-resolution grayscale image. The system may identify one or more elements of interest of the inspected sample based on the first X-ray image. The first X-ray image may include interfering elements that interfere with the one or more elements of interest in the first X-ray image. The system may determine one or more first features associated with respective elements of interest based on variations of grayscale values in the first X-ray images. The system may determine whether one or more defects are associated with the respective elements of interest based on the one or more first features associated with the element of interest.