Disclosed are a test method and algorithm for an aging life of a composite, and a use thereof. The test method and algorithm includes: respectively placing specimens in four temperature environments to undergo damp and hot, high and low temperature impact and high and low temperature alternating cycle for a specified time; testing the physical, chemical and electrical properties of the specimens by using laminated combined test pieces; fitting parameters in a micro-gasification expansion oscillation equation; fitting constants in a kinetic correlation equation (2) of the parameters; calculating new values of the parameters in any temperature environment by using the constant equation (2); and substituting the new values of the parameters back into the equation (1), so as to evaluate or predict the physical, chemical and electrical properties of the specimens at any time.

The invention discloses a method and a system for characterizing IGBT module aging based on Miner theory, including first establishing a life prediction model with a junction temperature fluctuation T.sub.jm and an average junction temperature ΔT.sub.j as inputs; then measuring a chip junction temperature data of an IGBT module; recording the junction temperature fluctuation T.sub.jm and the average junction temperature ΔT.sub.j of each power cycle; performing one life prediction in each cycle; and taking a reciprocal of a predicted life corresponding to each cycle and adding them to obtain an aging characteristic parameter D of the IGBT module. The invention may more suitably characterize the aging degree of the IGBT, and has the advantages of monotonically increasing change trend and high resolution.

A method of forming a semiconductor device includes: providing a first circuit having a plurality of circuit cells; analyzing a loading capacitance on a first pin cell connecting a first circuit cell and a second circuit cell in the plurality of circuit cells to determine if the loading capacitance of the first pin cell is larger than a first predetermined capacitance; replacing the first pin cell by a second pin cell for generating a second circuit when the loading capacitance is larger than the first predetermined capacitance, wherein the second pin cell is different from the first pin cell; and generating the semiconductor device according to the second circuit.

Systems and method for predicting production decline for a target well include generating a static model and a decline model to generate a well production profile. The static model is generated with supervised machine learning using an input data set including historical production data, and calculates an initial resource production rate for the target well. The decline model is generated with a neural network using the input data and dynamic data (e.g., an input time interval and pressure data of the target well), and calculates a plurality of resource production rates for a plurality of time intervals. The system can perform multiple recursive calculations to calculate the plurality of resource production rates, generating the well production profile. For instance, the predicted resource production rate of a first time interval is used as one of inputs for predicting the resource production rate for a second, subsequent time interval.

A system and method for performing time-dependent reliability prediction of a printed circuit board (PCB) embedded in a sensor that monitors the health (viz., performance) of operating equipment subject to different environmental stressors. The method includes developing a digital twin (DT) of the physical PCB, generating sensor data, transmitting the sensor data, and receiving sensor data and historical conditional data by the twinning module, wherein the historical condition data includes known failure data of one or more electronic components of the circuit board based on an internal condition or and external condition. The method further includes embedded physics-based reliability models informed by inputs from the sensor data and the historical conditional data, generating a real-time failure prediction signal based on the physics-based reliability models, and reporting the real-time failure prediction signal. The circuit board may include printed circuit boards (PCBs), particularly additively-manufactured printed circuit boards (AM-PCBs).

A method for operating a machine component under stress. The method comprises determining a probability of failure PoF(N) of the component as a function of N cycles, selecting a time-based acceptable risk limit for the component and selecting an operational profile for the component, converting the time-based acceptable risk limit to a cycle-based acceptable risk limit using the operational profile, comparing the cycle-based acceptable risk limit with the PoF(N) values to determine an operational status of the component, comparing the cycle-based acceptable risk limit with the PoF(N) values, and operating the machine component responsive to results of the comparing step.

The present disclosure provides a method and an apparatus for testing a semiconductor device. The method includes providing an active area in an integrated circuit design layout; grouping the active area into a first region and a second region; calculating a first self-heating temperature of the first region of the active area; calculating a second self-heating temperature of the second region of the active area; and determining an Electromigration (EM) evaluation based on the first self-heating temperature and the second self-heating temperature.

A system and method for adding hierarchy to a netlist. A netlist is received and converted into a connected graph. Location parameters for the nodes of the connected graph are mapped onto the connected graph. Landmark structures are identified in the connected graph, wherein identifying includes recording a location associated with each landmark structure. Patterns are searched for in the connected graph, wherein searching proceeds outward from an anchor defined by the location of each of the identified landmark structures.

In some examples, a method of operating a circuit is described. The method may include performing a circuit function and estimating a probability of failure of the circuit based on one or more stress origination metrics, one or more stress victim events, and one or more initial state conditions.

In some examples, a method comprises performing a circuit function via a circuit; and estimating a remaining life of the circuit. Moreover, estimating the remaining life of the circuit may include measuring one or more circuit parameters over a period of time during operation of the circuit, and estimating the remaining life of the circuit based on the one or more measured circuit parameters over the period of time during operation of the circuit.