A method of making an integrated circuit includes steps of selecting a first cell and a second cell for an integrated circuit layout from a cell library in an electronic design automation (EDA) system, the first and second cells each having a cell active area, a cell gate electrode, at least one fin of a first set of fins, and a cell border region, each cell also having the active area at an exposed side, and placing the first exposed side against the second exposed side at a cell border. The method also includes operations of aligning at least one fin of the first set of fins with at least one fin of the second set of fins across a cell border.

This application provides a chip apparatus, including a die, a first bond pad, a second bond pad, and a first solder pad. The first bond pad and the second bond pad are disposed on an upper surface of the die. A first power module and a second power module are disposed in the die. The first power module is coupled to the first bond pad. The second power module is coupled to the second bond pad. The first solder pad is separately coupled to an external power supply of the chip apparatus, the first bond pad, and the second bond pad. According to the foregoing technical solution, isolation between different power modules is improved, and noise transmitted on a power supply path can be better filtered out. This improves power supply noise performance of the chip apparatus.

Predicting power usage of a chip may include receiving placement data describing a placement, within the chip, of a plurality of logical components of the chip; providing the placement data as an input to a neural network; and determining, by the neural network, based on the placement data, a predicted power usage of the chip.

One example includes a method for generating a solar farm design. Geographic map data defines geographic features and boundaries of a geographic region. A solar panel block library that stores virtual solar panel block types is accessed. Each of the virtual solar panel block types corresponds to a design of a respective solar panel block that includes solar panels, an inverter, and an access road, and each virtual solar panel block type includes predetermined dimensions and a predefined output power rating. An array of a virtual solar panel block type to fit within the geographic features and boundaries of the geographic region on the map is generated based on the dimensions of each of the virtual solar panel blocks in the array. The array is iteratively modified to optimize a criterion of the solar farm design, and the design is stored in a memory for subsequent solar farm installation.

The design of Dynamic Random Access Memory (DRAM) pass transistors is provided via generating a first plurality of transistor leakage currents by simulating different dopant configurations in a transistor; generating a second plurality of transistor leakage currents by simulating, for each dopant configuration of the different dopant configurations, a single trap insertion in the transistor; fitting the first and second pluralities of transistor leakage currents with first and second leakage current distributions; combining the first and second leakage current distributions to produce a third leakage current distribution; generating a third plurality of statistically generated leakage currents for a specified trap density for the transistor based on the first leakage current distribution, on the second leakage current distribution and on a specified trap density; and modeling and evaluating a DRAM cell including the transistor based on the third plurality of statistically generated leakage currents.

A partitioning method for partitioning a group of power-ground (PG) cells is disclosed. The method includes: placing at least one out-boundary PG cell on a substrate, wherein power strips of the at least one out-boundary PG cell are aligned with corresponding power rails on the substrate; and placing at least one in-boundary PG cell on the substrate, wherein power strips of the at least one in-boundary PG cell are aligned with corresponding power rails on the substrate.

Systems and methods are provided for using an integrated circuit design tool to analyze timing requirements of a circuit design for an integrated circuit. A slack is calculated for a timing path in the circuit design that fails to satisfy a timing constraint. The slack is decomposed into multiple categories of delays in the timing path. The categories of delays for the slack may include intrinsic margin, clock skew, logic delay, and fabric interconnect delay. The logic delay may include local interconnect delay and logic circuit delay. The fabric interconnect delay may include delays in interconnect elements that are used to make connections between larger blocks of the logic circuits. Different optimization strategies are provided to solve the timing constraint failure for each of the different categories of slack breakdown. Slack profiles of the entire design in each of the four categories of slack are also provided.

An optimization apparatus of: performing a search for an optimal solution through iteration of processing configured to determine, by using a difference between a first energy value of an evaluation function in a first state and a second energy value of the evaluation function in a second state, whether to accept a state transition from the first state to the second state, and perform the state transition; and in the performing of the search for the state, storing the difference between the first and second energy values, and the respective values of the evaluation function in the second state, in a case where negation of the state transition is consecutively iterated a specific number of times, selecting one state from among the stored second states, based on the differences, and making the state transition from the first state to the selected one state.

A method comprises creating an electronic module design having a plurality of electronic components and defining a model of functional behavior of a subset of the plurality of electronic components, the subset of the plurality of electronic components excluding a first electronic component. Functional behavior of the first electronic component is defined in a user-defined functional design intent file based on a first template, and a power behavior of the first electronic component is defined in a user-defined power design intent file based on a second template. A simulation file is generated based on the model of functional behavior and based on the functional behavior and the power behavior of the first electronic component. The simulation file is run to simulate operation of the electronic module design. A performance status is determined of the electronic module design in response to running the simulation file.

Disclosed in the present application are a logic circuit design method and apparatus, and a storage medium. The method comprises: designing and generating an initial MOSFET-TFET hybrid logic circuit, the MOSFET-TFET hybrid logic circuit comprising several logic gates; in the series branch of the initial MOSFET-TFET hybrid logic circuit, replacing a first type of TFET with a MOSFET; the first type of TFET being directly grounded or connected to a power supply and not directly connected to the output ends of the logic gates. The logic circuit design method of the present application overcomes the defect of excessive current attenuation caused by the TFET in the series branch by replacing the first type of TFET in the series branch of the initial logic circuit with a MOSFET The first type of TFET is a TFET that is directly grounded or connected to a power supply and not directly connected to the output ends of the logic gates.