A system for designing a circuitry configuration of heat-exchanger units includes an interface to acquire design parameters the heat-exchanger units, a memory to store computer-executable programs including a relaxed decision diagram formation module, and a processor, in connection with the memory, configured to perform the computer-executable programs. The computer-executable programs include steps of providing a configuration of the heat-exchanger units, providing the design parameters of the heat-exchanger units acquired via the interface, generating a relaxed decision diagram based on the design parameters, creating constraints with respect to connections of the heat-exchanger units according to the relaxed decision diagram, and generating feasible configurations of the heat-exchanger units by a mixed-integer-programing method using the constraints.

A system and a method are disclosed for placing hardware components on a printed circuit board (“PCB”) in a way that enables all hardware components on the PCB to be passively cooled without using active cooling systems. Components are selected to be placed onto the PCB and heat metrics for each component is obtained (e.g., from a server). The components are ranked based on the amount of heat that each component generates. A corresponding position for each of the hardware components is determined based on the ranking of the components and the orientation of the PCB. The placement is based on the concept that air having higher temperature rises while air having cooler temperature falls. A representation of the PCB according to corresponding positions of the hardware components may be generated for display.

A method and apparatus for device simulation are provided. The method includes: establishing a simulation model of a to-be-detected device, where the to-be-detected device includes a first resistor and a parasitic resistor, the parasitic resistor includes a second resistor and a contact resistor, the first resistor is a bulk resistor of the to-be-detected device, the second resistor is a terminal resistor of the to-be-detected device, and the contact resistor is an equivalent resistor of a contact plug on the to-be-detected device; determining temperature coefficients of resistance corresponding to the first resistor, the second resistor, and the contact resistor, and adding the temperature coefficients of resistance to the simulation model; and performing device simulation of Simulation Program with Integrated Circuit Emphasis (SPICE) according to the simulation model.

Embodiments include thermally coupled aware device placement in the schematic design stage of the development of an integrated circuit. Aspects of the invention include obtaining a schematic design of a macro, the schematic design including a plurality of devices disposed within the macro. Aspects also include determining an initial temperature for each of the plurality of devices, where the initial temperature due to self-heating. Aspects further include determining, iteratively for each of the plurality of devices, an uplift temperature, where the uplift temperature for a first device of the plurality of devices is determined based on the initial temperature of each of the other plurality of devices and a distance between the first device and each of the other plurality of devices as encoded in the schematic design. Aspects also include modifying the schematic design of the macro based on a determination that the uplift temperature of at least one of the plurality of devices is above a threshold value.

A method for designing hotspots heat dissipation elements (HHDEs), the method includes (i) obtaining integrated circuit (IC) design information about the integrated circuit; (ii) finding, based on the IC design information, hotspots; (iii) and designing, by a computerized system, the HHDEs, based on the IC design information. At least one HHDE of the HHDEs is made of diamond.

A quality rating for a memory device to be installed at a memory sub-system is determined, where the quality rating corresponds to a performance of the memory device at one or more operating temperatures. A determination is made whether the quality rating for the memory device satisfies a first quality rating condition associated with a first temperature zone of two or more temperature zones of the memory sub-system. Responsive to the determination that the quality rating for the memory device satisfies the first quality rating condition, the memory device is assigned to be installed at a first memory device socket of the first temperature zone.

A radiation effect shielding calculation method based on a three-dimensional spacecraft model is provided. The method includes obtaining the three-dimensional spacecraft model; dividing a 4π space irradiation environment into meshes to obtain space irradiation vectors corresponding to the meshes respectively; setting one or more analysis points at each target model component; inputting the space irradiation vectors to the three-dimensional spacecraft model to obtain a three-dimensional distribution of actual shielding at each analysis point; obtaining a three-dimensional distribution of an equivalent aluminum shielding thicknesses according to equivalent thickness conversion for different materials; calculating residual irradiation effect values of the three-dimensional distribution of the equivalent aluminum shielding thicknesses of each analysis point to obtain corresponding detailed irradiation data; and performing information post processing and integrating in all directions to obtain a corresponding total radiation effect value.

A method of testing an integrated circuit on a test circuit board includes performing, by a processor, a simulation of a first heat distribution throughout an integrated circuit design, manufacturing the integrated circuit according to the integrated circuit design, and simultaneously performing a burn-in test of the integrated circuit and an automated test of the integrated circuit. The burn-in test has a minimum burn-in temperature of the integrated circuit and a burn-in heat distribution across the integrated circuit. The integrated circuit design corresponds to the integrated circuit. The integrated circuit is coupled to the test circuit board. The integrated circuit includes a set of circuit blocks and a first set of heaters.

A method includes: receiving a layout of an integrated circuit; identifying, based on the layout, at least a first net and at least a second net, wherein the first net extends through the integrated circuit along a vertical direction, and the second net terminates at a middle portion of the integrated circuit along the vertical direction; dividing the integrated circuit into a plurality of grid units, wherein he first net is constituted by a first subset of the plurality of grid units, and the second net is constituted by a second subset of the plurality of grid units; estimating a first thermal conductivity of each of the first subsets of grid units; estimating a second thermal conductivity of each of the second subsets of grid units; and estimating an equivalent thermal conductivity of the integrated circuit based on combining the first thermal conductivity and the second thermal conductivity.

An apparatus and method predict an initial deformation temperature of coal without an additional test by using a predictive model. The apparatus includes a parameter extractor configured to analyze characteristics of test coal and to extract parameters of the test coal based on the test coal characteristic analysis; a temperature analyzer configured to analyze an initial deformation temperature (IDT) of the test coal; a modeler configured to derive an IDT predictive model for predicting the test coal IDT using the extracted parameters of the test coal and the test coal IDT; and a predictor configured to predict an initial deformation temperature (IDT) of target coal to be supplied to the coal-fired power plant by substituting parameters of the target coal into the IDT predictive model. The test coal characteristics are analyzed by ash component analysis, elementary analysis, industrial analysis, or calorific value analysis.