Product displays are used to hold and present products. A method of manufacturing a product display can include forming display unit and cartridge blanks for assembly into a product display that has been designed using a product display design model executed on a computing device. A dataset of standardized units is created and includes products, cartridges, and display units. The product display design model generates product display design options that specify geometric arrangements of cartridges within display units, where the cartridges are each associated with a product type. The geometric arrangements are based on inputs that include combinations of a target total product count, a target mix ratio, product types, and a product display type. Display unit blanks and cartridge blanks used to construct display units and cartridges of the product display are formed by a manufacturing device based on a generated product display design option.

The present disclosure provides a method and an apparatus for generating a layout of a semiconductor device. The method includes placing a first cell and a second cell adjacent to the first cell, placing a first conductive pattern in a first track of the first cell extending in a first direction, wherein the first conductive pattern is configured as an input terminal or an output terminal of the first cell, placing a second conductive pattern in a first track of the second cell extending in the first direction, wherein the second conductive pattern is configured as an input terminal or an output terminal of the second cell, and aligning the first conductive pattern with the second conductive pattern.

This application discloses a computing system to identify structures of an integrated circuit capable of being fabricated utilizing a lithographic mask described by mask layout data and to generate process windows for the identified structures based, at least in part, on the mask layout data and a failure definition for the identified structures. The computing system utilizes process windows for the identified structures to determine failure rates for the identified structures based on a distribution of the manufacturing parameters. The computing system determines frequency of occurrences for the identified structures from the mask layout data and generates a die yield metric for the integrated circuit by aggregating the failure rates for the identified structures based on the frequency of occurrences for the identified structures in the integrated circuit. These increases in yield of the integrated circuit allow manufacturers to produce more units per fixed processing cost of the wafer.

A casting system design method is disclosed. The casting system design method comprises the steps of: receiving an input of entities associated with the shape of a cast product; generating respective entities for the constituent elements of a casting system on the basis of the inputted shape-related entities and pre-stored knowledge-based basic design information; generating a 3D graphic shape of a casting system designed on the basis of the generated entities; and editing the design of the casting system according to editing commands inputted on a graphics user interface (GUI) on which a 2D graphic shape corresponding to the generated 3D graphic shape is displayed, and dynamically modifying and displaying the 2D graphic shape so as to correspond to the editing.

An integrated circuit includes a first cell, a second cell, a buffer zone and a first power rail. The first cell includes a first set of fins extending in a first direction. Each fin of the first set of fins corresponds to a transistor of a first set of transistors. The second cell includes a second set of fins extending in the first direction. Each fin of the second set of fins corresponds to a transistor of a second set of transistors. The second set of fins is separated from the first set of fins in a second direction. The buffer zone is between the first cell and the second cell. The first power rail extends in the first direction, and overlaps at least the buffer zone. The first power rail is in a first metal layer, and is configured to supply a first voltage.

An integrated circuit includes a middle active-region structure between a group-one active-region structure and a group-two active-region structure. The integrated circuit also includes a main circuit, a group-one circuit, and a group-two circuit. The main circuit includes at least one boundary gate-conductor intersecting the middle active-region structure. The group-one circuit includes a group-one isolation structure separating the group-one active-region structure into a first part in the group-one circuit and a second part in a first adjacent circuit. The group-two circuit includes a group-two isolation structure separating the group-two active-region structure into a first part in the group-two circuit and a second part in a second adjacent circuit.

Provided is a semiconductor process modeling system. The semiconductor process modeling system includes a preprocessing component configured to generate tensor data from raw data obtained from semiconductor manufacturing equipment, wherein, when the raw data is expressed as a raw matrix representing values of a plurality of process parameters for each of a plurality of wafers, at least one element of the raw matrix is omitted, when the tensor data is expressed as a tensor matrix representing values of a plurality of preprocessed process parameters for each of the plurality of wafers, the number of omitted elements of the tensor matrix is less than the number of omitted elements of the raw matrix, and the preprocessing component is configured to generate the tensor data by modifying the raw data based on at least one of characteristics of the semiconductor manufacturing equipment and characteristics of the plurality of process parameters.

A method of making a semiconductor device includes electrically connecting a component to a first side of a first fuse, wherein the first fuse is a first distance from the component. The method further includes electrically connecting the component to a first side of a second fuse, wherein the second fuse is a second distance from the component, and the second distance is different than the first distance. The method further includes electrically connecting a second side of the second fuse to a dummy vertical interconnect segment.

A computer-implemented method for integrated circuit routing is described. The computer-implemented method comprising receiving a description of interconnected terminals of an integrated circuit with a wiring route electrically coupling the interconnected terminals and configuring a simulated environment defined via a plurality of voxels based on the description. The individual voxels included in the plurality of voxels each correspond to a spatial representation for a corresponding region of a layout associated with the integrated circuit. The computer-implemented method further includes determining local contributions of the individual voxels to a characteristic metric of the integrated circuit based on an electromagnetic simulation of the integrated circuit and revising the wiring route based on the local contributions of the individual voxels.

A system for managing additive manufacturing (AM) may comprise a datastore configured to store entries pertaining to a design for a three-dimensional (3D) object. The entries may be configured to include a respective set of parameters for an AM process. The parameters may be configured to cause an AM system to produce 3D objects having anisotropic mechanical properties that satisfy specified anisotropic mechanical requirements. The system may further comprise a design manager configured to determine a set of parameters that optimally satisfy the specified requirements, e.g., satisfy the requirements at a minimal cost.