A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.

A computer-based method for modifying a sound source. The method includes: accessing, by an acoustic processing facility including at least one processor, a multi-dimensional sound signature of an acoustic environment, wherein the multi-dimensional sound signature comprises a time-based sound reflection sequence for the acoustic environment; and receiving sound source data from a sound input device in a recording space. The method further includes modifying, by the acoustic processing facility, the sound source data based at least in part on the multi-dimensional sound signature to generate a modified sound source data; and recording the modified sound source data on a sound recording device.

A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.

A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.

A data link (101) for a MIMO communication system (100) comprises a first transceiver device (106A) comprising a body (109A) having a transducer mounting surface near or at which is mounted a plurality of first transducers (107A-107D) configured to, in use, receive and convert a plurality of electrical waveforms to a respective plurality of acoustic signals. A first bonding layer (120A) bonds a barrier mounting surface of the body of the first transceiver device to a barrier (103). The data link further comprises a second transceiver device (106B) comprising a body (109B) and a plurality of second transducers (107′A-107′D) configured to receive and convert the plurality of acoustic signals transmitted through the barrier to a respective plurality of electrical waveforms. A second bonding layer (120B) bonds a barrier mounting surface of the body of the second transceiver to the barrier.

A loudspeaker comprising: an acoustic diaphragm having front and rear surfaces, the acoustic diaphragm in use being driven so as to vibrate and radiate acoustic waves from its front surface in a forward direction away from the loudspeaker and from its rear surface in a rearward direction, and a drive unit located rearwardly or to the front/outside of the diaphragm, there being at least one open duct leading in a rearward direction away from the diaphragm, in which the at least one open duct has a cross-sectional area which decreases in the rearward direction, and in which acoustic waves radiated from the rear surface of the diaphragm pass through the open duct before contacting a front surface of an acoustic metamaterial absorber located generally behind the drive unit and immediately to the rear of the duct.

Headphones include a speaker unit, a baffle plate that fixes the speaker unit and includes a bass reflex port disposed therein, an ear pad disposed facing toward the baffle plate, and a sound absorber that is positioned between the baffle plate and the ear pad, and that has a hole facing the bass reflex port.

A method of fabricating a transducer includes embedding signal flexes and ground-return flexes inside a backing block. The method includes forming stack configurations with a height in elevation and a width perpendicular to the height. The forming includes: dicing a piezoelectric layer in the elevation into rows (separating the piezoelectric layer into portions); defining a beam pattern for the transducer by aligning the portions on the backing block; and forming gaps in-between each piezoelectric layer portion and each adjacently aligned piezoelectric layer portion. The method includes forming stacks by bonding one or more matching layers to the piezoelectric layer portions by utilizing a conductive surface of a first matching layer of the one or more matching layers. The method also includes forming cavities in the one or more matching layers in elevation, dicing the stacks along an elevation direction into multiple elements, and filling the cavities with a material.

Disclosed is an ultrasonic transducer including: at least one piezoelectric wafer having two parallel planar main faces: a front face and a posterior face; at least one posterior plate having two parallel planar main faces: an anterior face and a rear face, the anterior face of the posterior plate extending facing, and in contact with, the posterior face of the piezoelectric wafer. The posterior plate has a thickness between three and seven times the thickness of the piezoelectric wafer. The posterior plate has an acoustic impedance between 10 MPa.Math.s.Math.m−1 and 35 MPa.Math.s.Math.m−1. Also disclosed is a method for assembling such a transducer as well as a flowmeter including at least one such transducer.

Disclosed herein is a probe including: an acoustic module including a piezoelectric layer configured to generate ultrasonic waves, a matching layer configured to reduce a difference in acoustic impedance between the piezoelectric layer and an object, and a backing layer configured to absorb ultrasonic waves generated by the piezoelectric layer and transmitted backward from the piezoelectric layer; a plurality of attenuation layers provided at both edges of the upper surface of the acoustic module, and configured to attenuate ultrasonic waves generated by the acoustic module; and a lens layer disposed to cover the upper surfaces of the attenuation layers, and configured to focus ultrasonic waves transmitted forward from the piezoelectric layer at a predetermined point.