Patent classifications
G10K11/002
VIBRATION OR ACCELERATION SENSOR APPLYING SQUEEZE FILM DAMPING
A vibration sensor having a moveable mass being suspended in a suspension member and being adapted to move in response to vibrations or accelerations. The moveable mass and the suspension member are rigidly connected across one or more gaps formed by respective opposing surfaces of the moveable mass and the suspension member. The vibration sensor includes a damping arrangement having a damping substance. The moveable mass is arranged to interact directly or indirectly with the damping substance in order to reduce a mechanical resonance peak of the vibration sensor.
Logging while drilling tool
A logging-while-drilling (LWD) tool for use within a formation. The LWD tool may include a transmitter, a receiver, and an acoustic isolator. The transmitter may be operable to transmit an acoustic signal into the formation. The receiver may be operable to receive an acoustic response from the formation. The acoustic isolator may be positioned longitudinally between the transmitter and the receiver to reduce a transfer of acoustic energy between the transmitter and the receiver through the LWD tool. The acoustic isolator may include annular chambers formed in a body of the acoustic isolator and positioned along a longitudinal axis of the acoustic isolator.
ULTRASONIC TRANSDUCER
An ultrasonic transducer, including a piezoelectric element with physical characteristics of radial resonant frequencies and thickness resonant frequencies, and with an upper surface and a lower surface opposite to each other through the piezoelectric element and a lateral surface connecting the upper surface and the lower surface, and an acoustic matching layer set on the upper surface of the piezoelectric element and having a first resonant matching part and a second resonant matching part, wherein a thickness of the first resonant matching part in a direction perpendicular to the upper surface is greater than a thickness of the second resonant matching part in the direction, and the thickness of the first resonant matching part matches one radial resonant frequency of the piezoelectric element and the thickness of the second resonant matching part matches another radial resonant frequency or one of the thickness resonant frequency of the piezoelectric element.
Apparatus, method and computer program for adjustable noise cancellation
An apparatus receives a background audio signal from an earpiece microphone. The earpiece microphone is configured to convert sound from a surrounding environment into the background audio signal. The apparatus outputs, to at least one speaker, a primary audio signal with an altered version of the background audio signal. The altered version is selectable, responsive to control by a user of a user interface, between an amount of active noise cancelation of the sound and an amount of reproduction of the sound. One example embodiment is a headset with microphones and speakers for the respective inputs and outputs.
Ultrasonic probe and method of manufacturing the same
Provided is an ultrasonic probe that is capable of easily dissipating heat generated therein using porous carbon allotrope foams. The ultrasonic probe includes: a matching layer; a piezoelectric layer disposed on a bottom surface of the matching layer; and a backing layer disposed on a bottom surface of the piezoelectric layer and formed of porous carbon allotrope foams and backing materials.
ISOLATION ASSEMBLY FOR AN ELECTROACOUSTIC DEVICE
Methods and apparatus for acoustically and electronically isolating a smart speaker to prevent unauthorized persons from using the smart speaker microphones to eavesdrop and intrude into a personal space.
Ultrasonic sensor
The ultrasonic sensor includes a wave transmitting and receiving device and a cover. The wave transmitting and receiving device has a front surface including a wave transmitting and receiving surface and is configured to transmit and receive an ultrasonic wave through the wave transmitting and receiving surface. The cover covers the wave transmitting and receiving device so as to expose the wave transmitting and receiving surface. The cover is constituted by multiple portions, and the multiple portions are individually made of multiple materials different from each other.
Method for suppressing interference noise in an acoustic system and acoustic system
A method for suppressing interference noise in an acoustic system with a microphone that generates an input signal and a loudspeaker that generates an acoustic signal which partially feeds back to the microphone. A first intermediate signal is formed along a primary signal path as a function of the input signal, and an output signal is formed via a frequency distortion. The output signal is coupled into a signal feedback path. A second intermediate signal is formed in the signal feedback path via a decorrelation and used as an input value for an adaptive filter. The adaptive filter generates a compensation signal which compensates the input signal. A third intermediate signal is formed from the input signal and/or compensated input signal, which is used as an input value for the adaptive filter. The output signal is fed to the loudspeaker for reproduction.
PHASED ARRAY ULTRASONIC TRANSDUCER AND METHOD OF MANUFACTURE
A phased array ultrasonic transducer includes a bonding wire structure, a damping material, a plurality of ultrasonic transducers, and a printed circuit board. The bonding wire structure includes a plurality of bonding wire elements. The damping material surrounds the bonding wire structure and is interposed with the plurality of bonding wire elements. The plurality of ultrasonic transducers is arranged in a matrix beneath a membrane, each of the plurality of ultrasonic transducers being coupled to a corresponding bonding wire element of the plurality of bonding wire elements. The printed circuit board includes a plurality of circuits. Each of the plurality of circuits is coupled to a corresponding bonding wire element of the plurality of bonding wire elements.
VIBRATION ISOLATION OF ELECTRONICS AND/OR COMPONENTS
Implementations of the present invention relate to devices, systems, and methods for isolating electronic components from input vibrations. The vibration isolation device may passively isolate the housed electronics from substantially all input vibrations. The vibration isolation device may include elastic members to suspend the electronic components within a support frame such that input vibrations are unable to directly influence the electronic components.