A multi-audio stethoscope head comprising a head body (1) including a sound collecting surface (11), a vibrating diaphragm, and a fastener. The sound collecting surface (11) is provided with a sound guiding hole (16), and the fastener (3) is provided with an axial through hole (33), a fastener sidewall (31) for attaching to the head body (1), and a diaphragm pressing portion (32) for tightly attaching the vibrating diaphragm (2) to the head body (1). The vibrating diaphragm (2) is disposed between the diaphragm pressing portion (32) and the head body (1). Protruding poles (6) protruding toward the vibrating diaphragm (2) is arranged on the sound collecting surface (11) at the radially inner side of the through hole (33), and when the vibrating diaphragm (2) is not subject to external pressure, the vibrating diaphragm (2) is spaced from the protruding poles (6).

First data comprising a first range of audio frequencies is received. The first range of audio frequencies corresponds to a predetermined cochlear region of a listener. Second data comprising a second range of audio frequencies is also received. Third data comprising a first modulated range of audio frequencies is acquired. The third data is acquired by modulating the first range of audio frequencies according to a stimulation protocol that is configured to provide neural stimulation of a brain of the listener. The second data and the third data are arranged to generate an audio composition from the second data and the third data.

First data comprising a first range of audio frequencies is received. The first range of audio frequencies corresponds to a predetermined cochlear region of a listener. Second data comprising a second range of audio frequencies is also received. Third data comprising a first modulated range of audio frequencies is acquired. The third data is acquired by modulating the first range of audio frequencies according to a stimulation protocol that is configured to provide neural stimulation of a brain of the listener. The second data and the third data are arranged to generate an audio composition from the second data and the third data.

A fixture assembly can be used for testing and calibrating hearing devices in a fast, reliable and repeatable manner. The fixture assembly includes a support frame that supports an arm assembly with a holder to hold acoustics coupler(s) and hearing device for the purpose of acoustic testing and calibration.

Embodiments for one-way sound absorbing systems are described herein. In one example, a sound absorbing system includes a waveguide having open ends for receiving an incoming acoustic wave and wall portions defining a first port and a second port. A first electroacoustic absorber is mounted to the first port and is electrically connected to a shunting circuit, while a second electroacoustic absorber is mounted to the second port and is electrically connected to an open circuit. The sound absorption of the system is directional dependent.

When a multitude of devices (200) operate in a transmissive medium (206) and absorb a mechanical wave signal, absorption of the signal by devices (200) closer to the transmission source (208) may limit available signal strength experienced by devices located further from the source. Device design and/or operation can be adjusted to mitigate such attenuation. For example, the properties and/or actions of closer devices can be adjusted to reduce their absorption of the signal, including limiting the action of the absorptive structures employed and/or changing the frequency of absorption.

Embodiments described herein may provide a surface acoustic wave (SAW) device, methods of fabricating the SAW device, and a system incorporating the SAW device. The SAW device may include a piezoelectric substrate and individual resonators may be formed by a plurality of electrodes on the surface of the piezoelectric substrate. A dielectric layer having a positive thermal coefficient of frequency (TCF) may be formed on each of the plurality of electrodes. In various embodiments, temperature compensation may be achieved by providing more or less of the dielectric layer on at least one resonator than on the other resonators based on a configuration of the resonators. In various embodiments, temperature compensation may be achieved by providing at least one resonator with a different duty factor than the other resonators based on a configuration of the resonators.

Embodiments described herein may provide a surface acoustic wave (SAW) device, methods of fabricating the SAW device, and a system incorporating the SAW device. The SAW device may include a piezoelectric substrate and individual resonators may be formed by a plurality of electrodes on the surface of the piezoelectric substrate. A dielectric layer having a positive thermal coefficient of frequency (TCF) may be formed on each of the plurality of electrodes. In various embodiments, temperature compensation may be achieved by providing more or less of the dielectric layer on at least one resonator than on the other resonators based on a configuration of the resonators. In various embodiments, temperature compensation may be achieved by providing at least one resonator with a different duty factor than the other resonators based on a configuration of the resonators.

A speaker comprises a housing, a transducer residing inside the housing, and at least one sound guiding hole located on the housing. The transducer generates vibrations. The vibrations produce a sound wave inside the housing and cause a leaked sound wave spreading outside the housing from a portion of the housing. The at least one sound guiding hole guides the sound wave inside the housing through the at least one sound guiding hole to an outside of the housing. The guided sound wave interferes with the leaked sound wave in a target region. The interference at a specific frequency relates to a distance between the at least one sound guiding hole and the portion of the housing.

The present teachings relate to an electronic device comprising: a first module for generating an audio signal; a second module for generating an ultrasonic signal; a mixer for generating a combined signal; a transmitter for outputting an acoustic signal dependent upon the combined signal; and, a processing means for controlling the ultrasonic signal; wherein, in response to receiving a first instruction signal for initiating the ultrasonic signal, the processing means is configured to increase the amount of the ultrasonic signal in the combined signal from an essentially zero value to a predetermined value over a predetermined enable time-period. The present teachings also relate to an electronic device configured to decrease the amount of the ultrasonic signal in the combined signal from an essentially zero value to a predetermined value over a predetermined disable time-period, and to an electronic device configured to remove the audio signal from the combined signal whilst preventing pop-noise, and to an electronic device capable of replacing the ultrasonic signal whilst minimizing the processing time. The present teachings further relate to a method for reducing the occurrence of pop noise in an acoustic signal associated with: initiating the ultrasonic signal in the combined signal, terminating the ultrasonic signal in the combined signal, terminating the audio signal in the combined signal, and replacing the ultrasonic signal in the combined signal. The present teachings also relate to a computer software product for implementing any of the method steps disclosed herein, and to a computer storage medium storing the computer software herein disclosed.