In one embodiment, an apparatus includes a module having an array of transducers and a heating element positioned proximate to the array of transducers. The heating element has opposite ends and a center portion therebetween, where the heating element is configured to produce more heat per unit length along the opposite ends than in the center portion.

A row bar for forming magnetic heads includes a row of magnetic head forming portions each having a magnetic head and a cutting portion adjacent to the magnetic heads. A row of bonding pads and a first ELG pad are provided at the magnetic head, a second ELG pad is provided at the cutting portion, both of the first and the second ELG pads are adapted for contacting with a probe during lapping process, and a conductive structure that is higher than surfaces of the first and the second ELG pads is formed at peripheries of the first and the second ELG pads respectively. Due to the conductive structures, a probe used in lapping process will be prevented from shifting from the ELG pads to ensure a stable contact, thereby obtaining efficient and accurate resistance measurement.

A row bar for forming magnetic heads includes a row of magnetic head forming portions each having a magnetic head and a cutting portion adjacent to the magnetic heads. A row of bonding pads and a first ELG pad are provided at the magnetic head, a second ELG pad is provided at the cutting portion, both of the first and the second ELG pads are adapted for contacting with a probe during lapping process, and a conductive structure that is higher than surfaces of the first and the second ELG pads is formed at peripheries of the first and the second ELG pads respectively. Due to the conductive structures, a probe used in lapping process will be prevented from shifting from the ELG pads to ensure a stable contact, thereby obtaining efficient and accurate resistance measurement.

Magnetic sensors with effectively shaped side shields and their fabrication processes are provided. One such process includes depositing sensor materials on a substrate, shaping the sensor materials to form a stripe height of the magnetic sensor, shaping the sensor materials to form a track width of the magnetic sensor, depositing side shield materials on the shaped sensor materials, shaping the side shield materials such that a resulting side shield extends further than the stripe height, depositing an insulator layer on the shaped side shield materials, and shaping the insulator layer.

Magnetic sensors with effectively shaped side shields and their fabrication processes are provided. One such process includes depositing sensor materials on a substrate, shaping the sensor materials to form a stripe height of the magnetic sensor, shaping the sensor materials to form a track width of the magnetic sensor, depositing side shield materials on the shaped sensor materials, shaping the side shield materials such that a resulting side shield extends further than the stripe height, depositing an insulator layer on the shaped side shield materials, and shaping the insulator layer.

Magnetic sensors with effectively shaped side shields and their fabrication processes are provided. One such sensor includes a substrate, a sensor stack disposed on the substrate and having a stripe height, where the sensor stack further includes a front edge disposed at an air bearing surface (ABS) of the magnetic sensor, a back edge opposite of the front edge, and two side edges, and a side shield adjacent to each of the two side edges of the sensor stack, each side shield having a side shield height defined as a distance from the ABS to a back edge of the side shields, where the side shield height is greater than the stripe height, and where substantially no residue from materials used to form the side shield are disposed at the back edge of the sensor stack.

Magnetic sensors with effectively shaped side shields and their fabrication processes are provided. One such sensor includes a substrate, a sensor stack disposed on the substrate and having a stripe height, where the sensor stack further includes a front edge disposed at an air bearing surface (ABS) of the magnetic sensor, a back edge opposite of the front edge, and two side edges, and a side shield adjacent to each of the two side edges of the sensor stack, each side shield having a side shield height defined as a distance from the ABS to a back edge of the side shields, where the side shield height is greater than the stripe height, and where substantially no residue from materials used to form the side shield are disposed at the back edge of the sensor stack.

According to one embodiment, a disk device includes a rotatable recording medium, a head, and a housing which includes a first enclosed space accommodating the recording medium and the head, and a second enclosed space defined between the first enclosed space and outside air. Low-density gas is sealed in each of the first enclosed space and the second enclosed space, and a pressure of the first enclosed space is different from that of the second enclosed space.

According to one embodiment, a disk device includes a rotatable recording medium, a head, and a housing which includes a first enclosed space accommodating the recording medium and the head, and a second enclosed space defined between the first enclosed space and outside air. Low-density gas is sealed in each of the first enclosed space and the second enclosed space, and a pressure of the first enclosed space is different from that of the second enclosed space.

Magnetic sensors with effectively shaped side shields and their fabrication processes are provided. One such sensor includes a substrate, a sensor stack disposed on the substrate and having a stripe height, where the sensor stack further includes a front edge disposed at an air bearing surface (ABS) of the magnetic sensor, a back edge opposite of the front edge, and two side edges, and a side shield adjacent to each of the two side edges of the sensor stack, each side shield having a side shield height defined as a distance from the ABS to a back edge of the side shields, where the side shield height is greater than the stripe height, and where substantially no residue from materials used to form the side shield are disposed at the back edge of the sensor stack.