According to one embodiment, a head actuator includes a first suspension assembly including a first support plate, a first wiring member with first wiring lines, and a first head, and a second suspension assembly including a second support plate, a second wiring member with second wiring lines, and a second head. The first wiring lines include at least four first read lines and at least four first write lines. The second wiring lines include at least four second read lines and at least four second write lines. At least two of the first read lines and at least two of the first write lines are arranged at a position offset to the second read lines and the second write lines in a width direction of the wiring member.

Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.

According to one embodiment, a magnetic disk device includes a magnetic disk, a magnetic head, a control unit, and a setting unit. The magnetic head includes a write element which writes data to the magnetic disk and heater elements which adjust a levitation amount relative to the magnetic disk. The setting unit sets a heater value to be set on the basis of a measurement result of measuring the recording quality of the data written to the magnetic disk. The control unit controls electric power to be supplied to the heater elements on the basis of the heater value to be set to the setting unit.

A data storage device includes a base, a data storage disk, an actuator arm, a suspension, and a piezoelectric actuator. The data storage disk is attached to the base and has a read/write surface defining an x-y plane. The actuator arm is attached to the base at a first pivot point to rotate parallel to the x-y plane. The suspension is attached to the actuator arm at a second pivot point, the suspension having a first end comprising a curved edge surface, and a second end supporting a head that is configured to interact with the read/write surface. The piezoelectric actuator is disposed on the actuator arm and comprises a biasing finger configured to contact the curved edge surface to rotate the suspension parallel to the x-y plane about the second pivot point. An actuator arm assembly and a method of use are also described.

A method of manufacturing a head gimbal assembly includes a head connecting step which a thermally assisted magnetic head is connected to a suspension. The head connecting step includes a solder ball arrangement step which a solder ball is arranged so that a laser diode of the thermally assisted magnetic head is connected to a flexure of the suspension, in an assembly structure which a slider of the thermally assisted magnetic head is adhered to the suspension. The solder ball arrangement step is performed using a connecting ball, as the solder ball, having a size smaller than a wiring gap between an electrode surface of the laser diode and the flexure, and being in melted-particle condition.

A disk drive suspension of the embodiments includes a load beam, and a flexure including a mounting portion on which a slider is mounted and overlapping with the load beam. The load beam includes a tab further extending than the mounting portion longitudinal direction of the load beam. The tab is shaped in an arc such that a central portion in a lateral direction protrudes with respect to both end portions in the lateral direction, in the load beam. Each of the both end portions includes a flat surface parallel to the lateral direction.

A hard disk drive flexible printed circuit (FPC) includes a plurality of fingers extending from a main portion, with each finger having a thermally-conductive stiffener, at least one wiring layer over the stiffener, and a cover film over the at least one wiring layer, where the centroid of the stiffener is offset from the centerline of the cover film. Thus, utilizing the heat-sink characteristics of the stiffener, temperature differences among the upper and lower electrical pads of the FPC resulting from a heat-based interconnection procedure can be reduced and the temperatures across the FPC finger made more uniform, damage to the FPC prevented, and soldering yields improved.

According to one embodiment, a suspension assembly includes a support plate, a wiring member disposed on the support plate, and a head supported on the support plate through the wiring member. The wiring member includes a distal end portion electrically connected to the head, a connection end portion extending outside the support plate, and a plurality of wirings extending between the distal end portion and the connection end portion. The connection end portion includes an opening with predetermined length and width and thirteen or more connection terminals disposed in the opening and arranged at intervals in a direction of the length. A percentage of an area of the opening occupied by areas of the thirteen or more connection terminals is 40% to 65% inclusive.

A disk device according to one embodiment includes a recording medium, a magnetic head, a wiring member, and a flexible printed circuit board. The magnetic head is configured to read/write information from/to the recording medium. The wiring member includes a plurality of first terminals, and a plurality of first wires that electrically connect the magnetic head to the first terminals. The flexible printed circuit board includes a surface, a plurality of second terminals located on the surface to be connected to the first terminals by means of a conductive adhesive, and a ground plane spaced apart from the second terminals in a direction along the surface.

A head driving device includes a head supporting portion supporting a head member, a first beam, a second beam, a first piezoelectric unit including a pair of piezoelectric elements, and a second piezoelectric unit including a pair of piezoelectric elements. When voltage is applied to the piezoelectric elements of the first piezoelectric unit, the piezoelectric elements deform, and a distal end of the first beam moves. The piezoelectric elements of the second piezoelectric unit also deform by application of voltage, and moves a distal end of the second beam in a same direction as the distal end of the first beam.