Electronic devices and methods for single event effect mitigation are described. The device can include a processor, a memory cell, and an integrated particle sensor. The memory cell can comprise a substrate, a deep well coupled to the substrate, and a ground-coupled well coupled to the deep well. The integrated particle sensor can be coupled between the substrate and the deep well, and the ground-coupled well and the deep well. The integrated particle sensor can be operable to detect an ionizing particle generating the single event effect. The electronic device can be a field-programmable gate array.

The method can include detecting an ionizing particle generating a single event effect at a memory cell of the electronic device, switching from the memory cell to a redundant memory cell associated with the memory cell when the single event effect is detected, and reconfiguring the memory cell based on the redundant memory cell.

Embodiments of the present disclosure relate to a memory system, a memory controller, and a method of operating the memory system. According to embodiments of the present disclosure, a memory system may perform an integrity check operation on target code when information indicating whether a supply voltage supplied to a memory system is maintained at or below a first level for a first unit time is received from a voltage drop detector configured to sense a level of the supply voltage. Accordingly, the memory system is capable of minimizing the time of operation in the state in which a bit-flip occurs and preventing a problem in which irrecoverable data is recorded in a memory device due to malfunction of firmware.

A solid state drive (SSD) housing assembly includes an SSD housing and an extension frame. The SSD housing includes a first extension joint and a first mounting joint. The first mounting joint is a mechanism by which the housing can be mounted to an external device. The SSD housing has the form of a rectangular case in which an SSD module is held. The extension frame includes a second extension joint and a second mounting joint. The second mounting joint is a mechanism by which the frame can be mounted to the external device. The extension frame is attachable to and detachable from the SSD housing by virtue of the first extension joint and the second extension joint.

A system for preventing data remanence in memory is provided. The system includes a computing device, a memory chip coupled to the computing device and including memory, and a heater, the heater configured to prevent data remanence in a memory by providing heat to at least a portion of the memory. The memory includes a plurality of bits configured to electronically store data.

A semiconductor device includes an internal signal processing block suitable for generating an internal enable signal and an internal control signal that correspond to an external enable signal and an external control signal, and a monitoring unit suitable for outputting a monitoring signal that corresponds to a predetermined internal signal, based on the internal enable signal and the internal control signal, in an initial operation period.

The purpose of the invention is to compensate for the radiation tolerance of a semiconductor memory. An apparatus (10) for compensating for radiation tolerance comprises: a voltage value acquisition unit (11) that acquires a data retention voltage value that is a maximum voltage value at which data is inverted when a power supply voltage of a semiconductor memory having a latch circuit is lowered; a correction value determination unit (12) that determines a voltage correction value on the basis of a difference between the data retention voltage value and a reference voltage value; and a voltage adjustment unit (13) that adjusts at least one among the power supply voltage and a substrate bias voltage by using the voltage correction value. The reference voltage value is set to be equal to or lower than the data retention voltage value that satisfies a required radiation tolerance.

A load control device may include a semiconductor switch, a control circuit, and first and second terminals adapted to be coupled to a remote device. The load control device may include a first switching circuit coupled to the second terminal, and a second switching circuit coupled between the first terminal and the second terminal. The control circuit may be configured to render the first switching circuit conductive to conduct a charging current from an AC power source to a power supply of the remote device during a first time period of a half-cycle of the AC power source, and further configured to render the first and second switching circuits conductive and non-conductive to communicate with the remote device via the second terminal during a second time period of the half-cycle of the AC power source.

A memory system is provided. The memory system includes a memory device having a plurality of memory cells; and a memory controller configured to control the memory device to: store write data in first memory cells from among the plurality of memory cells, identify a current charge amount of a first cell string including at least one of the first memory cells and a current charge amount of a second cell string adjacent to the first cell string, and store dummy data in at least one memory cell connected to the first cell string or the second cell string based on the current charge amount of the first cell string and the current charge amount of the second cell string.

An armor piece may include a tested material. The armor piece also may include a plurality of electrical contacts distributed about and electrically connected to the tested material. The armor piece further may include a non-volatile memory (NVM) device. The NVM device may be hardened against exposure to x-ray radiation. The NVM device may be configured to store control voltages associated with respective electrical contacts of the plurality of electrical contacts.

The present disclosure includes storage circuits, such latches. In one embodiment, a circuit includes a plurality of latches, each latch including a first N-type transistor formed in a first P-type material, a first P-type transistor formed in a first N-type material, a second N-type transistor formed in a second P-type material, and a second P-type transistor formed in a second N-type material. The first and second N-type transistors are formed in different P-wells and the first and second P-type transistors are formed in different N-wells. In other storage circuits, charge extraction transistors are coupled to data storage nodes and are biased in a nonconductive state. These techniques make the data storage circuits more resilient, for example, to an ionizing particle striking the circuit and generating charge carriers that would otherwise change the state of the storage node.