A high resolution impedance adjustment (ZQ) calibration method using a hidden least significant bit (HLSB) is provided. The high resolution ZQ calibration method generates a data input/output (DQ) code of n+1 bits without a calibration time increase by adding the hidden least significant bit (HLSB) to a ZQ code of n bits output in a ZQ calibration operation of an impedance adjustment (ZQ) pad. A change in a termination resistance of the DQ pad is reduced as small as possible by the DQ code of n+1 bits.

Various apparatuses, systems, methods, and media are disclosed to provide over-voltage protection to a data interface of a multi-protocol memory card that includes a first communication interface and a second communication interface that enable communication using different protocols. An interface voltage protection circuit includes a control circuit configured to receive a first supply voltage for operating the first communication interface. The interface voltage protection circuit further includes a pull-down circuit operatively connected with the control circuit, configured to pull down a voltage at a supply voltage rail of the second communication interface such that a voltage at a plurality of connector terminals of the second communication interface is lower than the first supply voltage.

Apparatuses and methods related to logging failed authentication attempts. Failed authentication attempts can be logged in the circuitry by degrading the circuitry. The degradation can signal a fail authentication attempt while an amount of the degradation can represent a timing of the error.

A system comprising includes a memory device having memory cells a processing device, operatively coupled to the memory device. The processing device is to perform operations including: determining a length of time the memory device has been powered off; and in response to determining that the length of time satisfies a threshold value: for each of multiple groups of memory cells, asserting a corresponding flag; determining, based on the length of time, one or more adjusted demarcation voltages to be used in reading a state of the multiple groups of memory cells; and storing the one or more adjusted demarcation voltages for use in performing memory operations.

A semiconductor device comprises: a voltage generator suitable to pump a power source voltage to generate a first pumping voltage in response to an operation clock, a clock generator suitable to generate the operation clock having a first frequency during an initial operation period in which a level of the first pumping voltage is at a first level and to generate the operation clock having a second frequency after the initial operation period, the second frequency generated to be lower than the first frequency in response to a rise in a level of the first pumping voltage to a second level greater than the first level, and an internal circuit suitable to perform a predetermined internal operation in response to the first pumping voltage.

A semiconductor device includes: a charge pump circuit configured to generate an output voltage by pumping an input voltage according to first and second main clocks, a voltage detection circuit configured to generate a comparison signal by comparing the output voltage with a reference voltage, and a driving control circuit configured to selectively invert first and second external clocks at a start time of an activation period of the comparison signal to receive the inverted clocks as first and second internal clocks, to generate the first and second main clocks according to the first and second internal clocks during the activation period while controlling a transition order so that the second main clock transitions after the first main clock transitions, and to store logic levels of the first and second main clocks, respectively, at an end time of the activation period.

An electronic device includes: a system-on-chip (SoC) including a processor, a near-memory controller controlled by the processor, and a far-memory controller controlled by the processor; a near-memory device including a first memory channel configured to communicate with the near-memory controller and operate in a first mode of a plurality of modes, and a second memory channel configured to communicate with the near-memory controller and operate in a second mode different from the first mode from among the plurality of modes; and a far-memory device configured to communicate with the far-memory controller. The first memory channel is further configured to, based on a command from the near-memory controller, change an operation mode from the first mode to the second mode.

An electronic device includes: a system-on-chip (SoC) including a processor, a near-memory controller controlled by the processor, and a far-memory controller controlled by the processor; a near-memory device including a first memory channel configured to communicate with the near-memory controller and operate in a first mode of a plurality of modes, and a second memory channel configured to communicate with the near-memory controller and operate in a second mode different from the first mode from among the plurality of modes; and a far-memory device configured to communicate with the far-memory controller. The first memory channel is further configured to, based on a command from the near-memory controller, change an operation mode from the first mode to the second mode.

A memory device may include a pin for receiving a direct current (DC) voltage indicating an operating configuration setting of the memory device and for communicating an alternating current (AC) voltage signal that provides feedback to a power management component. The memory device may determine that a supply voltage is outside of a target range, and may drive the AC signal onto the pin based on determining that the supply voltage is outside the range. The pin may be coupled with a capacitive component the passes the AC signal and blocks the DC signal. The power management component may receive the capacitively coupled AC signal and may maintain or adjust the supply voltage based on the received AC signal.

A memory device may include a pin for receiving a direct current (DC) voltage indicating an operating configuration setting of the memory device and for communicating an alternating current (AC) voltage signal that provides feedback to a power management component. The memory device may determine that a supply voltage is outside of a target range, and may drive the AC signal onto the pin based on determining that the supply voltage is outside the range. The pin may be coupled with a capacitive component the passes the AC signal and blocks the DC signal. The power management component may receive the capacitively coupled AC signal and may maintain or adjust the supply voltage based on the received AC signal.