Managing a temperature of a memory element of an information handling system, the method comprising: identifying a lower temperature boundary of the memory element; determining an initial temperature of the memory element; determining whether the initial temperature is less than the lower temperature boundary; in response to determining that the initial temperature is less than the lower temperature boundary: performing a series of repeated burst refresh operations at the memory element; after performing the series of repeated burst refreshes operations, determining an updated temperature of memory element; determining whether the updated temperature is less than the lower temperature boundary; and in response to determining that the updated temperature is greater than the lower temperature boundary, performing a normal boot of the memory element.

A memory device may receive a read request describing a logical address at the memory device. The memory device may obtain a table entry associated with the logical address. The table entry comprises a physical address corresponding to the logical address and a write temperature data indicating a write temperature for the logical address. The memory device may determine a corrected threshold voltage for reading the physical address based at least in part on the write temperature data and read the physical address using the corrected threshold voltage.

A memory system may improve the endurance and performance of a plurality of memories included in the memory system mounted on a server system or a data processing system. For example, the memory system may throttle energy of a first memory using a second memory having a different characteristic from the first memory, control accesses to a memory region according to a refresh cycle, and control accesses to memories having different temperatures according to a priority of a request for each of the memories.

Exemplary methods, apparatuses, and systems include a media temperature manager receiving operating temperature measurements for a memory subsystem. The media temperature manager generates an average temperature using the operating temperature measurements. The media temperature manager determines that the average temperature satisfies a first value for a dynamic temperature threshold. The dynamic temperature threshold indicates a temperature at which the memory subsystem throttles media operations. The media temperature manager increases the dynamic temperature threshold to a second value in response to the average temperature satisfying the first value for the dynamic temperature threshold.

Exemplary methods, apparatuses, and systems include a media temperature manager receiving operating temperature measurements for a memory subsystem. The media temperature manager generates an average temperature using the operating temperature measurements. The media temperature manager determines that the average temperature satisfies a first value for a dynamic temperature threshold. The dynamic temperature threshold indicates a temperature at which the memory subsystem throttles media operations. The media temperature manager increases the dynamic temperature threshold to a second value in response to the average temperature satisfying the first value for the dynamic temperature threshold.

According to one embodiment, a semiconductor storage device includes a plurality of terminals. The plurality of terminals form at least a first row and a second row. The first row includes a plurality of terminals arranged in a first direction at intervals from each other at locations closer to a first end edge than to a second end edge. The second row includes a plurality of terminals arranged in the first direction at intervals from each other at locations closer to the second end edge than to the first end edge. An area between the first row and the second row on a first surface includes a contact area that is in contact with a heat-conducting member, which is disposed on a printed circuit board in a host device that is electrically connected to the semiconductor storage device.

A memory system includes: a semiconductor storage device including a memory cell array that includes memory cells and a temperature counter configured to increase a count value thereof at a rate that depends on a temperature of the memory cell array; and a memory controller configured to acquire the count value from the semiconductor storage device and reserve a refresh operation for a written memory cell of the memory cell array when a cumulative value of the count value, which is accumulated from when data was written to the memory cell to when the count value is acquired, exceeds a predetermined value.

A method is disclosed that includes causing a first set of a plurality of voltage pulses to be applied to memory cells of a memory device, a voltage pulse of the first set of the voltage pulses placing the memory cells of the memory device at a voltage level associated with a defined voltage state. The method also includes determining a set of bit error rates associated with the memory cells of the memory device in view of a data mapping pattern for the memory cells of the memory device, wherein the data mapping pattern assigns a voltage level associated with a reset state to at least a portion of the memory cells of the memory device. The method further includes determining whether to apply one or more second sets of the voltage pulses to the memory cells of the memory device in view of a comparison between the set of bit error rates for the memory cells and a previously measured set of bit error rates for the memory cells.

A temperature sensing circuit adapted for a memory device and including an oscillator, a count circuit, a control circuit, a sense circuit and a select circuit is provided. The oscillator provides an oscillation signal. The count circuit counts the oscillation signal to generate a first count signal, and generates a second count signal. The count circuit performs a logic operation on the second count signal to generate an enable signal and a sensing adjustment signal. The sense circuit generates a reference temperature voltage by dividing a reference voltage according to the sensing adjustment signal, and compares the reference temperature voltage and a monitor voltage according to the enable signal to generate a determination signal. The select circuit dynamically selects one of the oscillation signal and the first count signal according to the determination signal, and generates a pulse of a refresh request signal according to the dynamically selected one of the oscillation signal and the first count signal.

The present disclosure relates to the field of integrated circuit technologies, and provides a method and device for testing an SR cycle as well as a method and device for testing an AR number. The method for testing an SR cycle includes: executing a preset number of data-retention-capacity acquisition steps, the data-retention-capacity acquisition step including determining a preset refresh time; sending an SR entry command to control a memory to enter an SR operation; sending an SR exit command to control the memory to exit the SR operation after the memory executes the SR for the preset refresh time; detecting a current data retention capacity of the memory; obtaining a cycle of a function of the data retention capacity with respect to the corresponding preset refresh time; and determining the SR cycle of the memory with the cycle of the function.