A memory sub-system configured to: measure a plurality of sets of signal and noise characteristics of a group of memory cells in a memory device; determine a plurality of optimized read voltages of the group of memory cells from the plurality of sets of signal and noise characteristics respectively; generate features from the plurality of sets of signal and noise characteristics, including at least one compound feature generated from the plurality of sets of signal and noise characteristics; generate, using the features, a classification of a bit error rate of data retrievable from the group of memory cells; and control an operation to read the group of memory cells based on the classification.

A semiconductor device includes an error correction code circuit and a register circuit. The error correction code circuit is configured to generate first data according to second data. The register circuit is configured to generate reset information according to a difference between the first data and the second data, for adjusting a memory cell associated with the second data. A method is also disclosed herein.

According to one embodiment, a memory device includes a first nonvolatile memory die, a second nonvolatile memory die, a controller, and a first temperature sensor and a second temperature sensor incorporated respectively in the first nonvolatile memory die and the second nonvolatile memory die. The controller reads temperatures measured by the first and second temperature sensors, from the first and second nonvolatile memory dies. When at least one of the temperatures read from the first and second nonvolatile memory dies is equal to or higher than a threshold temperature, the controller reduces a frequency of issue of commands to the first and second nonvolatile memory dies or a seed of access to the first and second nonvolatile memory dies.

The abstract of the disclosure was objected to because of informality (e.g. format, reference to figures, etc.). See MPEP § 608.01 (b). Please amend the abstract to recite: Non-volatile memory device may include at least an array of memory cells. The non-volatile memory cells may include associated decoding and sensing circuitry and a memory controller. Methods for checking the erasing phase of a non-volatile device may include performing a dynamic erase operation of at least a memory block and storing in a dummy row at least an internal block variable of the dynamic erase operation and/or a known pattern.

A read-disturb-based physical storage read temperature information identification system includes a global read temperature identification subsystem coupled to at least one storage device. Each at least one storage device reads valid data and obsolete data from at least one physical block in that storage device and, based on the reading of the valid data and the obsolete data, generates read disturb information associated with each row provided by the at least one physical block in that storage device. Each at least one storage devices then uses the read disturb information associated with each row provided by the at least one physical block in that storage device to generate a local logical storage element read temperature map for that storage device that it provides to the global read temperature identification subsystem.

Techniques disclosed herein can be used to improve cross-temperature coverage of memory devices and improve memory device reliability in cross-temperature conditions. More specifically, a memory trim set can be selected from multiple candidate memory trim sets when performing a memory operation (such as a memory write operation), based on a temperature metric and a P/E cycle metric for the memory device. The candidate memory trim sets include multiple respective memory trim values (e.g., memory configuration parameters, such as program voltage step size, program pulse width, program verify level, etc., as discussed above) for performing the memory operation. The temperature metric can be indicative of a temperature of at least a region of the memory device (e.g., the entire device, a memory plane, a memory block, etc.), and the P/E cycle metric can be indicative of a number of P/E cycles performed by the memory device within a selected time interval.

A temperature control method, a memory storage apparatus, and a memory control circuit unit are disclosed. The method includes: detecting a system parameter of the memory storage apparatus, and the system parameter reflects wear of a rewritable non-volatile memory module in the memory storage apparatus; determining a temperature control threshold value according to the system parameter; and performing a temperature reducing operation in response to a temperature of the memory storage apparatus reaching the temperature control threshold value to reduce the temperature of the memory storage apparatus.

A temperature control method, a memory storage apparatus, and a memory control circuit unit are disclosed. The method includes: detecting a system parameter of the memory storage apparatus, and the system parameter reflects wear of a rewritable non-volatile memory module in the memory storage apparatus; determining a temperature control threshold value according to the system parameter; and performing a temperature reducing operation in response to a temperature of the memory storage apparatus reaching the temperature control threshold value to reduce the temperature of the memory storage apparatus.

A system and method for read threshold calibration in a non-volatile memory are provided. Physical dies in the memory are divided into groups based on device-level parameters such as time and temperature parameters. An outlier die may be identified outside of the plurality of groups based on a comparison of a bit error rate (BER) indicator for each die to a threshold. For each group of dies, a read parameter is determined for at least one die, and applied to each of the plurality of dies of the group. The read parameter may be determined based on a threshold measurement of a representative one or more word lines.

Apparatuses and techniques are described for detecting and isolating defective blocks of memory cells in a multi-plane operation such as program or erase. In one aspect, a program operation begins in a multi-plane mode, for one block in each plane. If fewer than all blocks complete programming by the time a trigger number of program loops have been performed, one or more unpassed blocks are programmed further, one at a time, in a single plane mode. If the one or more unpassed blocks do not complete programming when a maximum allowable number of program loops have been performed, they are marked as bad blocks and disabled from further operations. In another aspect, when a trigger number of program loops have been performed, one or more unpassed blocks are subject to a word line leakage detection operation.