A microelectronic device comprises a microelectronic device structure comprising a section comprising page buffers, and an additional section horizontally neighboring the section and comprising page buffer drivers and a timing delay chain coupled to the page buffer drivers. Each of the page buffer drivers is coupled to different group of the page buffers than each other of the page buffer drivers. The timing delay chain comprises timing delay circuits coupled in series with one another. Each of the timing delay circuits is configured to adjustably delay propagation of a control signal therethrough. Memory devices, methods of operating memory devices, and electronic systems are also described.

A microelectronic device comprises a microelectronic device structure comprising a section comprising page buffers, and an additional section horizontally neighboring the section and comprising page buffer drivers and a timing delay chain coupled to the page buffer drivers. Each of the page buffer drivers is coupled to different group of the page buffers than each other of the page buffer drivers. The timing delay chain comprises timing delay circuits coupled in series with one another. Each of the timing delay circuits is configured to adjustably delay propagation of a control signal therethrough. Memory devices, methods of operating memory devices, and electronic systems are also described.

Embodiments provide a memory structure, including: a capacitive structure, provided with an upper electrode layer; a conductive column, arranged on the upper electrode layer, and in contact with and electrically connected to the upper electrode layer; a metal layer, arranged on a side of the conductive column away from the upper electrode layer, the conductive column being in contact with a surface of the metal layer facing the upper electrode layer; and at least one buffer column, spaced apart from the conductive column, in contact with the surface of the metal layer facing the upper electrode layer, and extending in a direction from the metal layer to the upper electrode layer.

Embodiments provide a memory structure, including: a capacitive structure, provided with an upper electrode layer; a conductive column, arranged on the upper electrode layer, and in contact with and electrically connected to the upper electrode layer; a metal layer, arranged on a side of the conductive column away from the upper electrode layer, the conductive column being in contact with a surface of the metal layer facing the upper electrode layer; and at least one buffer column, spaced apart from the conductive column, in contact with the surface of the metal layer facing the upper electrode layer, and extending in a direction from the metal layer to the upper electrode layer.

A semiconductor structure and a memory are provided. The semiconductor structure includes a first active area; a first gate located on the first active area, the first active area and the first gate being configured to form a first transistor; a second active area, the second active area and the first active area being arranged along a first direction, the second active area and the first active area being independent from each other; a second gate located on the second active area, and the second active area and the second gate being configured to form a second transistor, wherein sizes of the first transistor and the second transistor are same, a deviation between an electrical parameter of the first transistor and an electrical parameter of the second transistor is below a preset threshold, and the first transistor and the second transistor belong to a cross coupling amplifying unit.

A semiconductor structure and a memory are provided. The semiconductor structure includes a first active area; a first gate located on the first active area, the first active area and the first gate being configured to form a first transistor; a second active area, the second active area and the first active area being arranged along a first direction, the second active area and the first active area being independent from each other; a second gate located on the second active area, and the second active area and the second gate being configured to form a second transistor, wherein sizes of the first transistor and the second transistor are same, a deviation between an electrical parameter of the first transistor and an electrical parameter of the second transistor is below a preset threshold, and the first transistor and the second transistor belong to a cross coupling amplifying unit.

An equalization circuit structure includes a semiconductor substrate including an equalization active region; a gate layer including a gate pattern and a power supply line, wherein the gate pattern is disposed on the equalization active region and configured for forming a transistor unit with the equalization active region, and the power supply line electrically connects the equalization active region with an external power supply and is configured for supplying power to the transistor unit.

An equalization circuit structure includes a semiconductor substrate including an equalization active region; a gate layer including a gate pattern and a power supply line, wherein the gate pattern is disposed on the equalization active region and configured for forming a transistor unit with the equalization active region, and the power supply line electrically connects the equalization active region with an external power supply and is configured for supplying power to the transistor unit.

A system is provided. The system includes a multiply-and-accumulate circuit and a local generator. The multiply-and-accumulate circuit is coupled to a memory array and generates a multiply-and-accumulate signal indicating a computational output of the memory array. The local generator is coupled to the memory array and generates at least one reference signal at a node in response to one of a plurality of global signals that are generated according to a number of the computational output. The local generator is further configured to generate an output signal according to the signal and a summation of the at least one reference signal at the node.

The present invention includes apparatus and a method for reading one or more data states from an integrated circuitry memory cell, including the steps of connecting the memory cell to a bit line which is connected to an amplifier having an offset control which introduces an offset during the sensing portion of a read cycle to identify a data state stored in the memory cell.