A memory device, a memory system including the memory device, and a method of operating the memory device are described. The memory device includes a memory cell array including a plurality of planes, a peripheral circuit configured to perform a read operation including a channel initialization operation on a selected memory block among a plurality of memory blocks included in each of the plurality of planes, and a control logic configured to control the peripheral circuit to perform the read operation including the channel initialization operation, and the control logic sets an activation time of the channel initialization operation based on an read mode of the read operation.

A semiconductor chip capable of improving signal quality includes a host device, a first memory device which is spaced part from the host device and connected to the host device, a repeater module which is connected to the host device and the first memory device, and a second memory device which is spaced apart from the host device and connected to the repeater module. The first memory device receives a data signal from the host device and generates a recovery clock signal, using the data signal. The repeater module receives the recovery clock signal from the first memory device, receives a first input signal from the host device, and samples the first input signal on the basis of the recovery clock signal to generate a sampling signal. The second memory device receives the sampling signal.

A semiconductor chip capable of improving signal quality includes a host device, a first memory device which is spaced part from the host device and connected to the host device, a repeater module which is connected to the host device and the first memory device, and a second memory device which is spaced apart from the host device and connected to the repeater module. The first memory device receives a data signal from the host device and generates a recovery clock signal, using the data signal. The repeater module receives the recovery clock signal from the first memory device, receives a first input signal from the host device, and samples the first input signal on the basis of the recovery clock signal to generate a sampling signal. The second memory device receives the sampling signal.

The operation speed of a semiconductor device is improved. The semiconductor device includes a first memory region and a second memory region; in the semiconductor device, a first memory cell in the first memory region is superior to a second memory cell in the second memory region in data retention characteristics such as a large storage capacitance or a large channel length-channel width ratio (L/W) of a transistor. When the semiconductor device is used as a cache memory or a main memory device of a processor, the first memory region mainly stores a start-up routine and is not used as a work region for arithmetic operation, and the second memory region is used as a work region for arithmetic operation. The first memory region becomes an accessible region when the processor is booted, and the first memory region becomes an inaccessible region when the processor is in normal operation.

A semiconductor memory cell and arrays of memory cells are provided In at least one embodiment, a memory cell includes a substrate having a top surface, the substrate having a first conductivity type selected from a p-type conductivity type and an n-type conductivity type; a first region having a second conductivity type selected from the p-type and n-type conductivity types, the second conductivity type being different from the first conductivity type, the first region being formed in the substrate and exposed at the top surface; a second region having the second conductivity type, the second region being formed in the substrate, spaced apart from the first region and exposed at the top surface; a buried layer in the substrate below the first and second regions, spaced apart from the first and second regions and having the second conductivity type; a body region formed between the first and second regions and the buried layer, the body region having the first conductivity type; a gate positioned between the first and second regions and above the top surface; and a nonvolatile memory configured to store data upon transfer from the body region.

Methods, systems, and devices for dirty write on power off are described. In an example, the described techniques may include writing memory cells of a device according to one or more parameters (e.g., reset current amplitude), where each memory cell is associated with a storage element storing a value based on a material property associated with the storage element. Additionally, the described techniques may include identifying, after writing the memory cells, an indication of power down for the device and refreshing, before the power down of the device, a portion of the memory cells based on identifying the indication of the power down for the device. In some cases, refreshing includes modifying at least one of the one or more parameters for a write operation for the portion of the memory cells.

Technology is disclosed herein for concurrently programming the same data pattern in multiple sets of non-volatile memory cells. Voltage are applied to bit lines in accordance with a data pattern. A select voltage is applied to drain select gates of multiple sets of NAND strings. The system concurrently applies a program pulse to control gates of a different set of selected memory cells in each respective set of the multiple sets of the NAND strings while the select voltage is applied to the drain select gates of the multiple sets of the NAND strings and the voltages are applied to the plurality of bit lines to concurrently program the data pattern into each set of the selected memory cells.

A semiconductor memory device and an operation method capable of suppressing malfunctions and the like and performing safe operations are provided. A flash memory of the disclosure includes a controller which controls an operation based on a code read from a ROM. The operation method of the disclosure includes detecting whether the code read from the ROM has an error by a CRC processing unit; determining whether to transition to a safe mode when the code having the error is detected; and detecting and correcting the error of the code by an ECC processing unit after transitioning to the safe mode.

A memory device in accordance with a described method of operation includes a read only memory (ROM) address controller and a suspend signal generator. The ROM address controller is configured to sequentially output a plurality of operation ROM addresses at which ROM codes to be executed in response to an operation command are stored, and to suspend output of the plurality of operation ROM addresses in response to a suspend signal. The suspend signal generator is configured to generate the suspend signal that is activated during a preset period depending on whether a suspend ROM address is identical to an operation ROM address, among the plurality of operation ROM addresses, currently being output. The suspend ROM address is an address at which a ROM code, execution of which is to be suspended, among the ROM codes, is stored.

Methods, systems, and devices for cell data bulk reset are described. In some examples, a logic state (e.g., a first logic state) may be written to one or more memory cells based on an associated memory device transitioning power states. To write the first logic state to the memory cells, a first subset of digit lines may be driven to a first voltage and a plate may be driven to a second voltage. While the digit lines and plate are driven to the respective voltages, one or more word lines may be driven to the second voltage. In some instances, the word lines may be driven to the second voltage based on charge sharing occurring between adjacent word lines.