Patent classifications
G11C8/10
Methods for on-die memory termination and memory devices and systems employing the same
Methods, systems, and apparatuses related to memory operation with on-die termination (ODT) are provided. A memory device may be configured to provide ODT at a first portion (e.g., rank) during multiple communications at a second portion (e.g., rank). For example, a memory device may receive a first command instructing a first portion to perform a first communication and instructing a second portion to enter an ODT mode. The device may perform, with the first portion, the first communication with a host while the second portion is in the ODT mode. The device may receive a second command instructing the first portion to perform a second communication, and the device may perform, with the first portion, the second communication while the second portion remains in the ODT mode. The second portion may persist in the ODT mode for an indicated number of communications, or until instructed to exit the ODT mode.
Apparatuses and methods to mask write operations for a mode of operation using ECC circuitry
An exemplary semiconductor device includes an input/output (I/O) circuit configured to combine data corresponding to a write command received via data terminals with a first subset of corrected read data retrieved from a memory cell array to provide write data. The exemplary semiconductor device further includes a write driver circuit configured to mask a write operation of a first bit of the write data that corresponds to a bit of the first subset of the read data and to perform a write operation for a second bit of the write data that corresponds to the data received via the data terminals.
Apparatuses and methods to mask write operations for a mode of operation using ECC circuitry
An exemplary semiconductor device includes an input/output (I/O) circuit configured to combine data corresponding to a write command received via data terminals with a first subset of corrected read data retrieved from a memory cell array to provide write data. The exemplary semiconductor device further includes a write driver circuit configured to mask a write operation of a first bit of the write data that corresponds to a bit of the first subset of the read data and to perform a write operation for a second bit of the write data that corresponds to the data received via the data terminals.
Address latch comprising intermediate latch circuit that latches the address data latched by the write latch circuit, display device and address latching method
An address latch, a display device, and an address latching method are disclosed. The address latch includes a write control circuit, a write latch circuit, a latch control circuit, an intermediate latch circuit, and an output latch circuit. The write latch circuit is configured to latch an address data in response to N write control signals generated by the write control circuit, N data bits of the address data are divided into (M−1) data bit groups; the latch control circuit is configured to sequentially generate M latch control signals; the intermediate latch circuit is configured to, in response to first to (M−1)-th latch control signals, latch first to (M−1)-th data bit groups latched by the write latch circuit in a time-division manner; and the output latch circuit is configured to output the address data latched by the intermediate latch circuit in response to an M-th latch control signal.
Address latch comprising intermediate latch circuit that latches the address data latched by the write latch circuit, display device and address latching method
An address latch, a display device, and an address latching method are disclosed. The address latch includes a write control circuit, a write latch circuit, a latch control circuit, an intermediate latch circuit, and an output latch circuit. The write latch circuit is configured to latch an address data in response to N write control signals generated by the write control circuit, N data bits of the address data are divided into (M−1) data bit groups; the latch control circuit is configured to sequentially generate M latch control signals; the intermediate latch circuit is configured to, in response to first to (M−1)-th latch control signals, latch first to (M−1)-th data bit groups latched by the write latch circuit in a time-division manner; and the output latch circuit is configured to output the address data latched by the intermediate latch circuit in response to an M-th latch control signal.
VOLTAGE REGULATOR AND SEMICONDUCTOR MEMORY DEVICE HAVING THE SAME
A voltage regulator and a semiconductor memory device having the same are disclosed. The voltage regulator includes an amplifier configured to amplify a difference between a reference voltage and a feedback voltage to generate an amplifier output voltage, a voltage feedback unit connected between an output supply voltage generation node and a ground voltage and configured to generate the feedback voltage, a first transfer gate unit connected between an input supply voltage and the voltage generation node and driven in response to the amplifier output voltage to provide first current, a current load replica unit connected between the voltage generation node and the ground voltage and configured to consume the first current, and a transfer unit connected between the input supply voltage and the voltage generation node and driven in response to the amplifier output voltage when the current load unit performs an operation, to provide second current.
VOLTAGE REGULATOR AND SEMICONDUCTOR MEMORY DEVICE HAVING THE SAME
A voltage regulator and a semiconductor memory device having the same are disclosed. The voltage regulator includes an amplifier configured to amplify a difference between a reference voltage and a feedback voltage to generate an amplifier output voltage, a voltage feedback unit connected between an output supply voltage generation node and a ground voltage and configured to generate the feedback voltage, a first transfer gate unit connected between an input supply voltage and the voltage generation node and driven in response to the amplifier output voltage to provide first current, a current load replica unit connected between the voltage generation node and the ground voltage and configured to consume the first current, and a transfer unit connected between the input supply voltage and the voltage generation node and driven in response to the amplifier output voltage when the current load unit performs an operation, to provide second current.
MEMORY
A memory includes: a plurality of row lines; a plurality of column lines; and a plurality of memory cells each of which is coupled to one row line among the row lines and one column line among the column lines, wherein memory cells corresponding to a row line which is selected based on a row address among the row lines are simultaneously activated, and data are read from memory cells corresponding to column lines which are selected based on a column address among the activated memory cells, and the selected column lines are not adjacent to each other.
PROGRAMMABLE COLUMN ACCESS
Methods, systems, and devices for programmable column access are described. A device may transfer voltages from memory cells of a row in a memory array to respective digit lines for the memory cells. The voltages may be indicative of logic values stored at the memory cells. The device may communicate respective control signals to a set of multiplexers coupled with the digit lines, where each multiplexer is coupled with a respective subset of the digit lines. Each multiplexer may couple a digit line of the respective subset of digit lines with a respective sense component for that multiplexer based on the respective control signal for that multiplexer.
SRAM with burst mode operation
A memory is provided that is configured to practice both a conventional normal read operation and also a burst mode read operation. During the normal read operation, the memory pre-charges the bit lines in a group of multiplexed columns. Each column has a sense amplifier that latches a bit decision for the column during the normal read operation. If a subsequent read operation addresses the same group of multiplexed columns, the memory invokes the burst-mode read operation during which the bit lines are not pre-charged.