A nonvolatile memory device includes a substrate including a cell array region, a first gate electrode including an opening on the cell array region of the substrate, a plurality of second gate electrodes stacked above the first gate electrode and including convex portions having an outward curve extending toward the substrate, and a word line cutting region cutting the opening and the convex portions.

A semiconductor device includes a substrate, a first bit line disposed on the substrate, a first tunnel insulation layer disposed on the first bit line, a variable resistance structure disposed on the first tunnel insulation layer and having a pillar structure, a second tunnel insulation layer disposed on an upper surface of the variable resistance structure, a second bit line disposed on the second tunnel insulation layer, a barrier insulation layer disposed on a sidewall surface of the variable resistance structure, and a word line disposed on the barrier insulation layer. A dielectric constant of the barrier insulation layer is greater than a dielectric constant of each of the first and second tunnel insulation layers.

A semiconductor device includes a substrate, a first bit line disposed on the substrate, a first tunnel insulation layer disposed on the first bit line, a variable resistance structure disposed on the first tunnel insulation layer and having a pillar structure, a second tunnel insulation layer disposed on an upper surface of the variable resistance structure, a second bit line disposed on the second tunnel insulation layer, a barrier insulation layer disposed on a sidewall surface of the variable resistance structure, and a word line disposed on the barrier insulation layer. A dielectric constant of the barrier insulation layer is greater than a dielectric constant of each of the first and second tunnel insulation layers.

A word line driver includes a PMOS area, a NMOS area, first gates, and second gates. The PMOS area includes first active areas extending along a first direction. The first active area includes a first channel area, a first source area and a first drain area. The NMOS area includes second active areas. The second active area includes a second channel area, a second source area, a second drain area, a third channel area, a third source area, and a third drain area. The extension direction of the first gate corresponding to the first active area is inclined compared with the first direction. The second gate covers the third channel area. The second gate, the third source area and the third drain area constitute a holding transistor.

A method for automatic expansion of a storage array includes: acquiring a word-line total number and bit-line total number of a target expanded storage array; calculating a translation amount of a translation array in a translation direction according to the word-line total number and the bit-line total number, a word-line total number and bit-line total number of the translation array and a preset translation rule, and calculating a number of repetitions of a repetition array in a repetition direction according to the translation amount, a word-line total number and bit-line total number of the repetition array and a preset repetition rule; and controlling at least part of the translation array and at least part of the repetition array to translate the translation amount along the translation direction and controlling the repetition array to repeat for the number of repetitions along the repetition direction to obtain the target expanded storage array.

A request to perform a write operation at a memory device is received. Current wordline start voltage (WLSV) information associated with a particular memory segment of the plurality of memory segments is retrieved. The write operation is performed on the particular memory segment. In a firmware record in a memory sub-system controller, information is stored indicative of a last written memory page associated with the particular memory segment on which the write operation is performed. The firmware record is managed in view of the information indicative of the last written memory page associated with the performed write operation. Each entry of the firmware record comprises one or more identifying indicia associated with a respective memory segment, at least one of the identifying indicia being a wordline start voltage (WLSV) associated with the respective memory segment.

A request to perform a write operation at a memory device is received. Current wordline start voltage (WLSV) information associated with a particular memory segment of the plurality of memory segments is retrieved. The write operation is performed on the particular memory segment. In a firmware record in a memory sub-system controller, information is stored indicative of a last written memory page associated with the particular memory segment on which the write operation is performed. The firmware record is managed in view of the information indicative of the last written memory page associated with the performed write operation. Each entry of the firmware record comprises one or more identifying indicia associated with a respective memory segment, at least one of the identifying indicia being a wordline start voltage (WLSV) associated with the respective memory segment.

A three-dimensional semiconductor device includes a first channel pattern on and spaced apart from a substrate, the first channel pattern having a first end and a second end that are spaced apart from each other in a first direction parallel to a top surface of the substrate, and a first sidewall and a second sidewall connecting between the first end and the second end, the first and second sidewalls being spaced apart from each other in a second direction parallel to the top surface of the substrate, the second direction intersecting the first direction, a bit line in contact with the first end of the first channel pattern, the bit line extending in a third direction perpendicular to the top surface of the substrate, and a first gate electrode adjacent to the first sidewall of the first channel pattern.

A three-dimensional semiconductor device includes a first channel pattern on and spaced apart from a substrate, the first channel pattern having a first end and a second end that are spaced apart from each other in a first direction parallel to a top surface of the substrate, and a first sidewall and a second sidewall connecting between the first end and the second end, the first and second sidewalls being spaced apart from each other in a second direction parallel to the top surface of the substrate, the second direction intersecting the first direction, a bit line in contact with the first end of the first channel pattern, the bit line extending in a third direction perpendicular to the top surface of the substrate, and a first gate electrode adjacent to the first sidewall of the first channel pattern.

An integrated circuit includes a plurality of memory cells, a first pair of complementary data lines, and a second pair of complementary data lines. The plurality of memory cells include a first array of memory cells and a second array of memory cells. The first pair of complementary data lines are coupled to the first array of memory cells. The second pair of complementary data lines are different from the first pair of complementary data lines and are coupled to the second array of memory cells. A number of memory cells in the first array of memory cells is different from a number of memory cells in the second array of memory cells.