Methods, systems, and devices for a differential write operation are described. The operations described herein may be used to alter a portion of a program file from a first state to a second state. For example, a file (e.g., a patch file) that is associated with a signature may be received at a memory device. Based on an authentication process, the file may be used to alter the program file to the second state. In some examples, the program file may be altered to the second state using a buffer of the memory device. A host system may transmit a file that includes the difference between the first state and the second state. A signature may be associated with the file and may be used to authenticate the file.

Methods, systems, and devices for a differential write operation are described. The operations described herein may be used to alter a portion of a program file from a first state to a second state. For example, a file (e.g., a patch file) that is associated with a signature may be received at a memory device. Based on an authentication process, the file may be used to alter the program file to the second state. In some examples, the program file may be altered to the second state using a buffer of the memory device. A host system may transmit a file that includes the difference between the first state and the second state. A signature may be associated with the file and may be used to authenticate the file.

Technology herein provides a performance-enhanced memory device including a memory array including a local word line circuit and a plurality of local word lines coupled to the local word line circuit, a word line (WL) sense circuit coupled to an access node in the local word line circuit, the WL sense circuit to sense a voltage level in the local word line circuit while bypassing a disturbance to operation of the local word lines and to provide an output signal that indicates when the voltage level has reached a high voltage threshold value to enable a read operation. The technology also provides read logic coupled to the WL sense circuit, the read logic to receive the output signal from the WL sense circuit, and trigger a read operation for one or more cells in the memory array when the output signal indicates that the voltage level has reached the high voltage threshold value.

Technology herein provides a performance-enhanced memory device including a memory array including a local word line circuit and a plurality of local word lines coupled to the local word line circuit, a word line (WL) sense circuit coupled to an access node in the local word line circuit, the WL sense circuit to sense a voltage level in the local word line circuit while bypassing a disturbance to operation of the local word lines and to provide an output signal that indicates when the voltage level has reached a high voltage threshold value to enable a read operation. The technology also provides read logic coupled to the WL sense circuit, the read logic to receive the output signal from the WL sense circuit, and trigger a read operation for one or more cells in the memory array when the output signal indicates that the voltage level has reached the high voltage threshold value.

A method for producing a 3D memory device, the method including: providing a first level including a first single crystal layer and control circuits; forming at least one second level above the first level; performing a first etch step including etching holes within the second level; forming at least one third level above the at least one second level; performing a second etch step including etching holes within the third level; and performing additional processing steps to form a plurality of first memory cells within the second level and a plurality of second memory cells within the third level, where each of the first memory cells include one first transistor, where each of the second memory cells include one second transistor, where at least one of the first or second transistors has a channel, a source, and a drain having a same doping type.

A method for producing a 3D memory device, the method including: providing a first level including a first single crystal layer and control circuits; forming at least one second level above the first level; performing a first etch step including etching holes within the second level; forming at least one third level above the at least one second level; performing a second etch step including etching holes within the third level; and performing additional processing steps to form a plurality of first memory cells within the second level and a plurality of second memory cells within the third level, where each of the first memory cells include one first transistor, where each of the second memory cells include one second transistor, where at least one of the first or second transistors has a channel, a source, and a drain having a same doping type.

A method for producing a 3D memory device including: providing a first level including a single crystal layer and control circuits, where the control circuits include a plurality of first transistors; forming at least one second level above the first level; performing a first etch step including etching holes within the second level; performing processing steps to form a plurality of first memory cells within the second level, where each of the first memory cells include one of a plurality of second transistors, where the control circuits include memory peripheral circuits, where at least one first memory cell is at least partially atop a portion of the memory peripheral circuits, and where fabrication processing of the first transistors accounts for a temperature and time associated with processing the second level and the plurality of second transistors by adjusting a process thermal budget of the first level accordingly.

A method for producing a 3D memory device including: providing a first level including a single crystal layer and control circuits, where the control circuits include a plurality of first transistors; forming at least one second level above the first level; performing a first etch step including etching holes within the second level; performing processing steps to form a plurality of first memory cells within the second level, where each of the first memory cells include one of a plurality of second transistors, where the control circuits include memory peripheral circuits, where at least one first memory cell is at least partially atop a portion of the memory peripheral circuits, and where fabrication processing of the first transistors accounts for a temperature and time associated with processing the second level and the plurality of second transistors by adjusting a process thermal budget of the first level accordingly.

A 3D semiconductor device, the device including: a first level including a first single crystal layer, the first level including first transistors, where the first transistors each include a single crystal channel; first metal layers interconnecting at least the first transistors; a second metal layer overlaying the first metal layers; and a second level including a second single crystal layer, the second level including second transistors, where the second level overlays the first level, where the second transistors each include at least two side-gates, where the second level is bonded to the first level, and where the bonded includes oxide to oxide bonds.

A 3D semiconductor device, the device including: a first level including a first single crystal layer, the first level including first transistors, where the first transistors each include a single crystal channel; first metal layers interconnecting at least the first transistors; a second metal layer overlaying the first metal layers; and a second level including a second single crystal layer, the second level including second transistors, where the second level overlays the first level, where the second transistors each include at least two side-gates, where the second level is bonded to the first level, and where the bonded includes oxide to oxide bonds.