A method for producing a 3D semiconductor device including: providing a first level including a first single crystal layer; forming peripheral circuitry in and/or on the first level, and includes first single crystal transistors; forming a first metal layer on top of the first level; forming a second metal layer on top of the first metal layer; forming second level disposed on top of the second metal layer; performing a first lithography step; forming a third level on top of the second level; performing a second lithography step; processing steps to form first memory cells within the second level and second memory cells within the third level, where the plurality of first memory cells include at least one second transistor, and the plurality of second memory cells include at least one third transistor; and deposit a gate electrode for second and third transistors simultaneously.

A method for producing a 3D semiconductor device including: providing a first level including a first single crystal layer; forming peripheral circuitry in and/or on the first level, and includes first single crystal transistors; forming a first metal layer on top of the first level; forming a second metal layer on top of the first metal layer; forming second level disposed on top of the second metal layer; performing a first lithography step; forming a third level on top of the second level; performing a second lithography step; processing steps to form first memory cells within the second level and second memory cells within the third level, where the plurality of first memory cells include at least one second transistor, and the plurality of second memory cells include at least one third transistor; and deposit a gate electrode for second and third transistors simultaneously.

A memory includes two or more portions of memory circuitry and two or more processor in memory (PIM) functional blocks, each PIM functional block associated with a respective portion of the memory circuitry. In operation, at least one other PIM functional block other than a particular PIM functional block copies data from a source location accessible to the other PIM functional block. The other PIM functional block then provides the data to the particular PIM functional block. The particular acquires and stores the data in a destination location accessible to the particular PIM functional block. The particular PIM functional block next performs one or more PIM operations using the data.

A memory includes two or more portions of memory circuitry and two or more processor in memory (PIM) functional blocks, each PIM functional block associated with a respective portion of the memory circuitry. In operation, at least one other PIM functional block other than a particular PIM functional block copies data from a source location accessible to the other PIM functional block. The other PIM functional block then provides the data to the particular PIM functional block. The particular acquires and stores the data in a destination location accessible to the particular PIM functional block. The particular PIM functional block next performs one or more PIM operations using the data.

A 3D semiconductor device, the device comprising: a first level comprising a first single crystal layer, said first level comprising first transistors, wherein each of said first transistors comprises a single crystal channel; first metal layers interconnecting at least said first transistors; a second metal layer overlaying said first metal layers; and a second level comprising a second single crystal layer, said second level comprising second transistors, wherein said second level overlays said first level, wherein at least one of said second transistors comprises a gate all around structure, wherein said second level is directly bonded to said first level, and wherein said bonded comprises direct oxide to oxide bonds.

A 3D semiconductor device, the device comprising: a first level comprising a first single crystal layer, said first level comprising first transistors, wherein each of said first transistors comprises a single crystal channel; first metal layers interconnecting at least said first transistors; a second metal layer overlaying said first metal layers; and a second level comprising a second single crystal layer, said second level comprising second transistors, wherein said second level overlays said first level, wherein at least one of said second transistors comprises a gate all around structure, wherein said second level is directly bonded to said first level, and wherein said bonded comprises direct oxide to oxide bonds.

A storage unit includes a latch, and the latch provides a first storage bit. The storage unit further includes a first MOS transistor. A gate of the first MOS transistor is connected to the first storage bit, a source of the first MOS transistor is connected to a first read line, and a drain of the first MOS transistor is connected to a second read line. In a first state, the first read line is a read word line, and the second read line is a read bit line; or in a second state, the second read line is a read word line, and the first read line is a read bit line.

A memory device is provided. The memory device includes a bit cell having a first invertor connected between a first node and a second node and a second invertor connected between the first node and the second node. The first invertor and the second invertor are cross coupled at a first data node and a second data node. The memory device further includes a pull down circuit connected to the second node. The pull down circuit is operative to pull down a voltage of the second node below a ground voltage in response to an enable signal.

A semiconductor device with a novel structure is provided. One embodiment of the present invention is a semiconductor device including a memory module. The memory module includes a first memory cell, a first wiring, and a second wiring and a third wiring that include a metal oxide. The first memory cell includes a read transistor and a rewrite transistor. The first wiring includes a region functioning as a back gate of the read transistor and a region where the second wiring functions as a conductor. The second wiring includes a region functioning as a channel formation region of the read transistor, a region functioning as a back gate of the rewrite transistor, and a region where the third wiring functions as a conductor. The third wiring includes a region functioning as a channel formation region of the rewrite transistor and a region functioning as a conductor.

New CMOS harvesting circuits are proposed that improve 2-port/multiport Register File Array circuit speed and substantially lower the energy cost of moving data along local and global bitpaths when engaging harvested data to self-limit energy dissipation. The uncertainty in BL signal development due to statistical variations in cell read current is eliminated by self-disabling action in the selected cell when the electric potential of harvested data matches the BL voltage from signal development while demanding fewer peripheral circuit transistors per column than conventional sensing schemes. Proposed bit path circuits engage harvested charge to provide immunity to disturb current noise during concurrent Read and Write access along a wL-eliminating the performance, area and energy overheads of BL keeper circuits typically required in conventional Register File arrays. Proposed circuits improve the reliability of Read performance-limiting bitcell devices from voltage accelerated aging mechanisms by lowering of vertical and lateral electric fields across these cell transistors when holding harvested charge during most of active and standby periods. Register File bitcell transistor design trade-off constraints between array leakage in active mode and read current are considerably relaxed when engaging harvested charge enabling much higher read currents for any given total array leakage. Area overheads of proposed circuits are expected to be marginally lower based on device widths of replacements to conventional peripheral circuits and can be further minimized by sharing of devices and their connections between bit slices of the array peripheral circuits. Moreover, proposed circuits do not require any changes to the CMOS platform, to the bitcell or to the array architecture with much of the flow for design, verification and test of 2-Port/multiport RF Memory arrays expected to remain unchanged—minimizing risk and allowing integration of proposed circuits into existing products with minimal disruption to schedule and cost.