A semiconductor device capable of holding analog data is provided. Two holding circuits, two bootstrap circuits, and one source follower circuit are formed with use of four transistors and two capacitors. A memory node is provided in each of the two holding circuits; a data potential is written to one of the memory nodes and a reference potential is written to the other of the memory nodes. At the time of data reading, the potential of the one memory node is increased in one of the bootstrap circuits, and the potential of the other memory node is increased in the other of the bootstrap circuits. A potential difference between the two memory nodes is output by the source follower circuit. With use of the source follower circuit, the output impedance can be reduced.

A memory is provided that is configured to practice two different modes of read operation, such as both a normal read operation and a burst-mode read operation. In one example, the memory is a pseudo-dual-port memory. The memory may include an address comparator to perform a time-division multiplexing to first compare a read address to a stored address and then to compare a write address to the stored address.

One embodiment relates to a memory structure that includes a bank group and a port emulation circuit module. The bank group includes a plurality of memory banks, each memory bank having one read port and one write port. The port emulation circuit module provides a group read/write port and a group read port for the bank group. Another embodiment relates to a port emulation circuit module. The port emulation circuit module includes a port emulation control circuit that receives control signals including a first address for a group read/write port and a second address for a group read port, a first data path circuit for the group read/write port, and a second data path circuit for the group read port, wherein the second data path circuit outputs a second read data. Other embodiments and features are also disclosed.

A memory device is provided. The memory device includes a bit cell having a first invertor connected between a first node and a second node and a second invertor connected between the first node and the second node. The first invertor and the second invertor are cross coupled at a first data node and a second data node. The memory device further includes a pull down circuit connected to the second node. The pull down circuit is operative to pull down a voltage of the second node below a ground voltage in response to an enable signal.

Various SRAM non-clamping write driver with write-assist are disclosed, including a write driver circuitry that does not clamp the Bitlines (BLs) during the write operations, and a negative BL Write-Assist (WA) circuit that provides a negative BL boost desirable for use with high-density bit cells. When used with memories other than those having high-density bit cells, the negative BL WA improves the minimum voltage (Vmin) and frequency of operation.

Examples are disclosed that relate to a multi-port synchronous dynamic random access memory (SDRAM). One example provides a multi-port SDRAM comprising a first port, a second port, a first memory portion, and a second memory portion. At least the first memory portion is configured as shared such that the first memory portion is accessible at the first port and not the second port in a first mode, and the first memory portion is accessible at the second port and not the first port in a second mode. The multi-port SDRAM further comprises a mode controller controllable to selectively change the multi-port SDRAM between at least the first mode and the second mode.

A multiport memory includes an address control circuit, a memory array, a data input-output circuit and a control circuit and first and second address signals and a clock signal are input through two ports. The address control circuit includes first and second latch circuits, a selection circuit, a decode circuit and a word line drive circuit. The first address signal input through one port is input into the first latch circuit and the second address signal input through the other port is input into the selection circuit. The selection circuit selects one of the first and second address signals, the second latch circuit latches and outputs the selected address signal to the decode circuit. The word line drive circuit drives a word line on the basis of an output signal from the decode circuit.

A semiconductor device according to an embodiment of the present disclosure includes a write transistor and a read transistor disposed over a substrate. The write transistor includes a write word line disposed on a plane that is substantially parallel to a surface of the substrate over the substrate, a write gate dielectric layer disposed over the write word line, a write channel layer disposed over the write gate dielectric layer, and a write bit line disposed over the substrate and extending in a direction substantially perpendicular to a surface of the substrate, and electrically connected to one end of the write channel layer. The read transistor includes a read channel layer disposed on the plane over the substrate, a read gate dielectric layer disposed over the read channel layer, and a read gate electrode layer disposed over the read gate dielectric layer and electrically connected to the other end of the write channel layer.

A data latch circuit includes a first transistor of a first conductivity type and a second transistor of the first conductivity type, and a third transistor of a second conductivity type and a fourth transistor of the second conductivity type. The third and fourth transistors are controlled to perform a first control operation to store data in the data latch circuit and to perform a second control operation to read the stored data.

A static random access memory device includes a first gate of a write port circuit disposed in a standard threshold voltage region of a substrate and a second gate of a read port circuit disposed in a low threshold voltage region, abutting the standard threshold voltage region, of the substrate. A distance between a first edge, corresponding to an edge of the first gate, and a boundary, between the standard threshold voltage region and the low threshold voltage region, is different from a distance between the boundary and a second edge, corresponding to an edge of the second gate.