Patent classifications
G11C8/18
Memory devices with low pin count interfaces, and corresponding methods and systems
A method can include, in an integrated circuit device: at a unidirectional command-address (CA) bus having no more than four parallel inputs, receiving a sequence of no less than three command value portions; latching each command value portion in synchronism with rising edges of a timing clock; determining an input command from the sequence of no less than three command value portions; executing the input command in the integrated circuit device; and on a bi-directional data bus having no more than six data input/outputs (IOs), outputting and inputting sequences of data values in synchronism with rising and falling edges of the timing clock. Corresponding devices and systems are also disclosed.
Shared decoder circuit and method
A circuit includes a plurality of registers, each register including SRAM cells, a read port configured to receive a read address, a write port configured to receive a write address, a selection circuit, a latch circuit, and a decoder coupled in series between the read and write ports and the plurality of registers, and a control circuit. Responsive to a clock signal and read and write enable signals, the control circuit causes the selection circuit, the latch circuit, and the decoder to select a first register of the plurality of registers in a read operation based on the read address, and select a second register of the plurality of registers in a write operation based on the write address.
Shared decoder circuit and method
A circuit includes a plurality of registers, each register including SRAM cells, a read port configured to receive a read address, a write port configured to receive a write address, a selection circuit, a latch circuit, and a decoder coupled in series between the read and write ports and the plurality of registers, and a control circuit. Responsive to a clock signal and read and write enable signals, the control circuit causes the selection circuit, the latch circuit, and the decoder to select a first register of the plurality of registers in a read operation based on the read address, and select a second register of the plurality of registers in a write operation based on the write address.
Memory device, memory system including the same and operating method thereof
A method of operating a memory device includes receiving a duty training request, performing first training for a write path in a first period, storing a result value of the first training, performing second training for a write path in a second period, storing a result value of the second training, transmitting the result value of the first training to an external device, and receiving a duty cycle adjuster (DCA) code value corresponding to the first training result value from the external device.
Memory device, memory system including the same and operating method thereof
A method of operating a memory device includes receiving a duty training request, performing first training for a write path in a first period, storing a result value of the first training, performing second training for a write path in a second period, storing a result value of the second training, transmitting the result value of the first training to an external device, and receiving a duty cycle adjuster (DCA) code value corresponding to the first training result value from the external device.
METHOD AND APPARATUS TO PERFORM TRAINING ON A DATA BUS BETWEEN A DYNAMIC RANDOM ACCESS MEMORY (DRAM) AND A DATA BUFFER ON A BUFFERED DUAL IN-LINE MEMORY MODULE
System boot time is decreased by performing Memory Receive enable (MRE) training and MDQ-MDQS Read Delay (MRD) training on a buffered Dual In-Line Memory Module (DIMM). MRE training configures the time at which a data buffer on the buffered DIMM enables its receivers to capture data read from DRAM integrated circuits on a MDQ/MDQS bus between the DRAM and the data buffer on the DIMM. After the MRE training has completed, the data buffer is configured to enable the data buffer receivers to receive data on the MDQ bus on the buffered DIMM during the preamble of the incoming MDQS burst from a read transaction in the DRAM. MRD training tunes the relationship between the MDQ/MDQS bus to ensure sufficient setup and hold eye margins for MDQ so that the data buffer optimally samples the data driven by the DRAM during reads of the DRAM.
METHOD AND APPARATUS TO PERFORM TRAINING ON A DATA BUS BETWEEN A DYNAMIC RANDOM ACCESS MEMORY (DRAM) AND A DATA BUFFER ON A BUFFERED DUAL IN-LINE MEMORY MODULE
System boot time is decreased by performing Memory Receive enable (MRE) training and MDQ-MDQS Read Delay (MRD) training on a buffered Dual In-Line Memory Module (DIMM). MRE training configures the time at which a data buffer on the buffered DIMM enables its receivers to capture data read from DRAM integrated circuits on a MDQ/MDQS bus between the DRAM and the data buffer on the DIMM. After the MRE training has completed, the data buffer is configured to enable the data buffer receivers to receive data on the MDQ bus on the buffered DIMM during the preamble of the incoming MDQS burst from a read transaction in the DRAM. MRD training tunes the relationship between the MDQ/MDQS bus to ensure sufficient setup and hold eye margins for MDQ so that the data buffer optimally samples the data driven by the DRAM during reads of the DRAM.
GHOST COMMAND SUPPRESSION IN A HALF-FREQUENCY MEMORY DEVICE
A memory device includes a command interface configured to receive a two-cycle command from a host device via multiple command address bits. The memory device also includes a command decoder configured to decode a first portion of the multiple command address bits in a first cycle of the two-cycle command. The command decoder includes mask circuitry. The mask circuitry includes mask generation circuitry configured to generate a mask signal. The mask circuitry also includes multiplexer circuitry configured to apply the mask signal to block the command decoder from decoding a second portion of the multiple command address bits in a second cycle of the two-cycle command.
Synchronous dynamic random access memory (SDRAM) dual in-line memory module (DIMM) having increased per data pin bandwidth
An apparatus is described. The apparatus includes logic circuitry to multiplex on a data bus a first data burst, a second data burst, a third data burst and a fourth data burst having different respective base target addresses that respectively target a first memory rank, a second memory rank, a third memory rank and a fourth memory rank. A first data transfer for the first data burst occurs on a first edge of a first pulse of a data strobe signal for the data bus and a second data transfer for the second data burst occurs on a second edge of the first pulse of the data strobe signal. A third data transfer for the third data burst occurs on a first edge of a second pulse of the data strobe signal for the data bus and a fourth data transfer for the fourth data burst occurs on a second edge of the second pulse. The second pulse immediately follows the first pulse on the data strobe signal. The first memory rank, the second memory rank, the third memory rank and the fourth memory rank are on a same memory module.
Synchronous dynamic random access memory (SDRAM) dual in-line memory module (DIMM) having increased per data pin bandwidth
An apparatus is described. The apparatus includes logic circuitry to multiplex on a data bus a first data burst, a second data burst, a third data burst and a fourth data burst having different respective base target addresses that respectively target a first memory rank, a second memory rank, a third memory rank and a fourth memory rank. A first data transfer for the first data burst occurs on a first edge of a first pulse of a data strobe signal for the data bus and a second data transfer for the second data burst occurs on a second edge of the first pulse of the data strobe signal. A third data transfer for the third data burst occurs on a first edge of a second pulse of the data strobe signal for the data bus and a fourth data transfer for the fourth data burst occurs on a second edge of the second pulse. The second pulse immediately follows the first pulse on the data strobe signal. The first memory rank, the second memory rank, the third memory rank and the fourth memory rank are on a same memory module.