G11C17/02

OTP cell with reversed MTJ connection

A one time programming (OTP) apparatus unit cell includes magnetic tunnel junctions (MTJs) with reversed connections for placing the MTJ in an anti-parallel resistance state during programming. Increased MTJ resistance in its anti-parallel resistance state causes a higher programming voltage which reduces programming time and programming current.

Memory with one-time programmable (OTP) cells

A magnetoresistive random access memory (MRAM) array includes MRAM cells, each MRAM cell having a corresponding Magnetic Tunnel Junction (MTJ) capable of being in a blown state or non-blown state, in which the blown state corresponds to a permanent breakdown of a tunnel dielectric layer of the corresponding MTJ. Write circuitry performs a one-time-programmable (OTP) write operation to blow selected MRAM cells. For each MRAM cell being blown, the write circuitry uses an initial OTP program reference for the MRAM cell being blown to detect onset of tunnel dielectric breakdown after application of each OTP write pulse of the OTP write operation. After detection of the onset, the write circuitry updates the initial OTP program reference, applies at least one additional OTP write pulse to the MRAM cell being blown, and uses the updated OTP program reference to verify that current saturation of the MRAM cell being blown has occurred.

Memory with one-time programmable (OTP) cells

A magnetoresistive random access memory (MRAM) array includes MRAM cells, each MRAM cell having a corresponding Magnetic Tunnel Junction (MTJ) capable of being in a blown state or non-blown state, in which the blown state corresponds to a permanent breakdown of a tunnel dielectric layer of the corresponding MTJ. Write circuitry performs a one-time-programmable (OTP) write operation to blow selected MRAM cells. For each MRAM cell being blown, the write circuitry uses an initial OTP program reference for the MRAM cell being blown to detect onset of tunnel dielectric breakdown after application of each OTP write pulse of the OTP write operation. After detection of the onset, the write circuitry updates the initial OTP program reference, applies at least one additional OTP write pulse to the MRAM cell being blown, and uses the updated OTP program reference to verify that current saturation of the MRAM cell being blown has occurred.

SEMICONDUCTOR DEVICES INCLUDING REVERSIBLE AND ONE-TIME PROGRAMMABLE MAGNETIC TUNNEL JUNCTIONS
20170110171 · 2017-04-20 ·

A semiconductor device includes a memory cell array, which further includes an array of first magnetic memory cells and an array of second magnetic memory cells. Each of the first magnetic memory cells includes a first magnetic tunnel junction structure having a reversible resistance state, and each of the second magnetic memory cells includes a second magnetic tunnel junction structure having a one-time programmable (OTP) resistance state.

SEMICONDUCTOR DEVICES INCLUDING REVERSIBLE AND ONE-TIME PROGRAMMABLE MAGNETIC TUNNEL JUNCTIONS
20170110171 · 2017-04-20 ·

A semiconductor device includes a memory cell array, which further includes an array of first magnetic memory cells and an array of second magnetic memory cells. Each of the first magnetic memory cells includes a first magnetic tunnel junction structure having a reversible resistance state, and each of the second magnetic memory cells includes a second magnetic tunnel junction structure having a one-time programmable (OTP) resistance state.

Programming of Non-Volatile Memory Subjected to High Temperature Exposure

A memory device having features of the present invention comprises a reprogrammable memory portion including therein a first plurality of magnetic tunnel junctions (MTJs) whose resistance is switchable; and a one-time-programmable (OTP) memory portion including therein a second plurality of MTJs whose resistance is switchable and a third plurality of MTJs whose resistance is fixed. Each MTJ of the first, second, and third plurality of MTJs includes a magnetic free layer having a magnetization direction substantially perpendicular to a layer plane thereof and a magnetic reference layer having a fixed magnetization direction substantially perpendicular to a layer plane thereof. The second plurality of MTJs represents one of two logical states and the third plurality of MTJs represents the other one of the two logical states.

ONE TIME PROGRAMMABLE (OTP) MAGNETORESISTIVE RANDOM-ACCESS MEMORY (MRAM)
20250078892 · 2025-03-06 ·

A memory device includes a plurality of magnetoresistive random-access memory (MRAM) cells including a first one-time programmable (OTP) MRAM cell. A first OTP select transistor is connected to the first OTP MRAM cell. The first OTP select transistor configured to selectively apply a breakdown current to the first OTP MRAM cell to write the first OTP MRAM cell to a breakdown state.

One-Time Programmable Device with Integrated Heat Sink
20170047126 · 2017-02-16 ·

Junction diodes fabricated in standard CMOS logic processes can be used as program selectors with at least one heat sink or heater to assist programming for One-Time Programmable (OTP) devices, such as electrical fuse, contact/via fuse, contact/via anti-fuse, or gate-oxide breakdown anti-fuse, etc. The heat sink can be at least one thin oxide area, extended OTP element area, or other conductors coupled to the OTP element to assist programming. A heater can be at least one high resistance area such as an unsilicided polysilicon, unsilicided active region, contact, via, or combined in serial, or interconnect to generate heat to assist programming. The OTP device has at least one OTP element coupled to at least one diode in a memory cell. The diode can be constructed by P+ and N+ active regions in a CMOS N well, or on an isolated active region as the P and N terminals of the diode. The isolation between P+ and the N+ active regions of the diode in a cell or between cells can be provided by dummy MOS gate, SBL, or STI/LOCOS isolations. The OTP element can be polysilicon, silicided polysilicon, silicide, polymetal, metal, metal alloy, local interconnect, metal-0, thermally isolated active region, CMOS gate, or combination thereof.

Operating method of physically unclonable function magnetic memory device

A physically unclonable function magnetic memory device includes a plurality of magnetic resistance cells disposed on a substrate and each including a pinned magnetic layer, a free magnetic layer, and a tunnel insulating layer or a non-magnetic conductive layer interposed between the pinned magnetic layer and the free magnetic layer. In an operating method of the physically unclonable magnetic memory device, an external magnetic field, decaying with time, is applied to the plurality of magnetic resistance cells to randomize a magnetization direction of the free magnetic layer of each of the plurality of magnetic resistance cells.

Operating method of physically unclonable function magnetic memory device

A physically unclonable function magnetic memory device includes a plurality of magnetic resistance cells disposed on a substrate and each including a pinned magnetic layer, a free magnetic layer, and a tunnel insulating layer or a non-magnetic conductive layer interposed between the pinned magnetic layer and the free magnetic layer. In an operating method of the physically unclonable magnetic memory device, an external magnetic field, decaying with time, is applied to the plurality of magnetic resistance cells to randomize a magnetization direction of the free magnetic layer of each of the plurality of magnetic resistance cells.