A semiconductor device has stored therein a plurality of bits of fixed data. The semiconductor device includes a plurality of memory elements that correspond, respectively, to the plurality of bits of the fixed data, and that acquire, store, and output the value of each bit received at an input terminal of each of the memory elements according to a timing signal. An initialization control unit feeds, to the plurality of memory elements, an initialization signal upon receipt of a fixed data setting signal, each of the plurality of memory elements being initialized to a state of storing a corresponding value represented by a bit of the fixed data according to the initialization signal.

A 3D semiconductor device, the device including: a first single crystal layer including a plurality of first transistors; at least one first metal layer interconnecting the plurality of first transistors, where the interconnecting includes forming memory peripheral circuits; a plurality of second transistors overlaying the at least one first metal layer; a second metal layer overlaying the plurality of second transistors; a first memory cell overlaying the memory peripheral circuits; and a second memory cell overlaying the first memory cell, where the first memory cell includes at least one of the second transistors, where at least one of the second transistors includes a source, channel and drain, where the source, the channel and the drain have the same dopant type.

A 3D semiconductor device, the device including: a first single crystal layer including a plurality of first transistors; at least one first metal layer interconnecting the plurality of first transistors, where the interconnecting includes forming memory peripheral circuits; a plurality of second transistors overlaying the at least one first metal layer; a second metal layer overlaying the plurality of second transistors; a first memory cell overlaying the memory peripheral circuits; and a second memory cell overlaying the first memory cell, where the first memory cell includes at least one of the second transistors, where at least one of the second transistors includes a source, channel and drain, where the source, the channel and the drain have the same dopant type.

Provided is a semiconductor device having a plurality of memory cells (MC1 and MC2), in which each of the plurality of memory cells (MC1 and MC2) includes: a memory transistor (10M) having an oxide semiconductor layer (17M) as an active layer; and a first selection transistor (10S) having a crystalline silicon layer (13S) as the active layer and connected to the memory transistor (10M) in series.

Provided is a semiconductor device having a plurality of memory cells (MC1 and MC2), in which each of the plurality of memory cells (MC1 and MC2) includes: a memory transistor (10M) having an oxide semiconductor layer (17M) as an active layer; and a first selection transistor (10S) having a crystalline silicon layer (13S) as the active layer and connected to the memory transistor (10M) in series.

A method for producing a 3D memory device, the method including: providing a first level including a single crystal layer; forming at least one second level above the first level; performing a first etch step including etching holes within the second level; forming at least one third level above the at least one second level; performing a second etch step including etching holes within the third level; and performing additional processing steps to form a plurality of first memory cells within the second level and a plurality of second memory cells within the third level, where each of the first memory cells includes one first transistor, where each of the second memory cells includes one second transistor, where at least one of the first or second transistors has a channel, a source and a drain having the same doping type, and where the forming at least one third level includes forming a window within the third level so to allow a lithography alignment through the third level to an alignment mark disposed underneath the third level.

A method for producing a 3D memory device, the method including: providing a first level including a single crystal layer; forming at least one second level above the first level; performing a first etch step including etching holes within the second level; forming at least one third level above the at least one second level; performing a second etch step including etching holes within the third level; and performing additional processing steps to form a plurality of first memory cells within the second level and a plurality of second memory cells within the third level, where each of the first memory cells includes one first transistor, where each of the second memory cells includes one second transistor, where at least one of the first or second transistors has a channel, a source and a drain having the same doping type, and where the forming at least one third level includes forming a window within the third level so to allow a lithography alignment through the third level to an alignment mark disposed underneath the third level.

The present disclosure provides a one-time programmable memory, which includes a one-time programmable (OTP) diode and a control field effect transistor (FET). One end of the OTP diode is electrically connected to a source line. The control FET includes a gate, a first source/drain and a second source/drain, the gate of the control FET is electrically connected to a word line, the first source/drain of the control FET is electrically connected to a bit line, and the second source/drain of the control FET is electrically connected to another of the OTP diode.

A method for producing a 3D memory device including: providing a first level including a single crystal layer; forming at least one second level above the first level; performing a first etch step including etching holes within the second level; forming at least one third level above the at least one second level; performing a second etch step including etching holes within the third level; performing additional processing steps to form memory cells within the second level and within the third level, each of the first memory cells include one first transistor, each of the second memory cells include one second transistor, where at least one of the first or second transistors has a channel, a source and a drain having the same doping type, the memory is NAND, the first level includes memory peripheral circuits, at least one of the first memory cells is at least partially atop a portion of the peripheral circuits.

A method for producing a 3D memory device including: providing a first level including a single crystal layer; forming at least one second level above the first level; performing a first etch step including etching holes within the second level; forming at least one third level above the at least one second level; performing a second etch step including etching holes within the third level; performing additional processing steps to form memory cells within the second level and within the third level, each of the first memory cells include one first transistor, each of the second memory cells include one second transistor, where at least one of the first or second transistors has a channel, a source and a drain having the same doping type, the memory is NAND, the first level includes memory peripheral circuits, at least one of the first memory cells is at least partially atop a portion of the peripheral circuits.