A sensing module, a memory device, and a sensing method are provided to perform a read operation so that the un-programmed/programmed state of a memory cell is identified. The sensing module includes a sensing amplifier and a current sink, and both are electrically connected to the memory cell. The sensing amplifier generates a sensing current and identifies the un-programmed/programmed state of the memory cell accordingly. The current sink receives a reference current being equivalent to the summation of the sensing current and a cell current flowing through the memory cell. The reference current is constant, and the sensing current is changed with the cell current. The cell current is generated based on a high read voltage and a low read voltage applied to the memory cell. The sensing current is higher if the memory cell is un-programmed, and the sensing current is lower if the memory cell is programmed.

A programmable resistive memory element and a method of adjusting a resistance of a programmable resistive memory element are provided. The programmable resistive memory element includes at least one resistive memory element. Each resistive memory element includes an Indium-Gallium-Zinc-Oxide (IGZO) resistive layer, a first electrical contact and a second electrical contact. The first and second electrical contacts are disposed on the IGZO resistive layer in the same plane. The programmable resistive memory element includes a voltage generator coupled to the first and second electrical contacts, constructed and arranged to apply a thermal treatment to the resistive memory element to adjust a resistance of the resistive memory element.

The present disclosure provides bit cells with data redundancy according to various aspects. In certain aspects, a bit cell includes a first memory element coupled to a write bit line, and a first write-access switch coupled between the first memory element and a ground. The bit cell also includes a second memory element coupled to the write bit line, and a second write-access switch coupled between the second memory element and the ground. The bit cell further includes a read-access switch coupled between the first memory element and a read bit line, wherein a control input of the read-access switch is coupled to a read-select line.

A nanostructured cross-wire memory architecture is provided that can interface with conventional semiconductor technologies and be electrically accessed and read. The architecture links lower and upper sets of generally parallel nanowires oriented crosswise, with a memory element that has a characteristic conductance. Each nanowire end is attached to an electrode. Conductance of the linkages in the gap between the wires encodes the information. The nanowires may be highly-conductive, self-assembled, nucleic acid-based nanowires enhanced with dopants including metal ions, carbon, metal nanoparticles and intercalators. Conductance of the memory elements can be controlled by sequence, length, conformation, doping, and number of pathways between nanowires. A diode can also be connected in series with each of the memory elements. Linkers may also be redox or electroactive switching molecules or nanoparticles where the charge state changes the resistance of the memory element.

A memory device is disclosed. The memory device includes a plurality of memory cells arranged in a plurality of rows and a plurality of columns; a plurality of word lines, each of the word lines coupled to a corresponding row of the memory cells; a plurality of bit lines, each of the bit lines coupled to a corresponding column of the memory cells; and a plurality of second word lines, each of the second word lines coupled to a corresponding column of the memory cells.

A memory includes a plurality of word line drivers with each driver controlling the voltage of a word line and the voltage of a select line during a memory operation. The driver operates to couple the select line to a first voltage setting terminal when the word line is asserted and couple the select line to a second voltage setting terminal when the word line is not asserted.

A fuse block unit includes a share flip-flop. The share flip-flop includes a first switch element, a second switch element, a third switch element, a fourth switch element, a first latch, and a second latch. The first switch element selectively couples a first laser latch to a first node according to the first load voltage. The second switch element selectively couples a second laser latch to the first node according to the second load voltage. The third switch element selectively couples an input node to the first node according to the inverted shift voltage. The first latch is coupled between the first node and a second node. The fourth switch element selectively couples the second node to a third node according to the shift voltage. The second latch is coupled between the third node and an output node.

A programmable resistive memory element and a method of adjusting a resistance of a programmable resistive memory element are provided. The programmable resistive memory element includes at least one resistive memory element. Each resistive memory element includes an Indium-Gallium-Zinc-Oxide (IGZO) resistive layer, a first electrical contact and a second electrical contact. The first and second electrical contacts are disposed on the IGZO resistive layer in the same plane. The programmable resistive memory element includes a voltage generator coupled to the first and second electrical contacts, constructed and arranged to apply a thermal treatment to the resistive memory element to adjust a resistance of the resistive memory element.

In some embodiments, the present disclosure relates to a one-time program (OTP) memory cell. The OTP memory cell includes a read transistor and a program transistor neighboring the read transistor. The read transistor includes a read dielectric layer and a read gate electrode overlying the read dielectric layer. The program transistor includes a program dielectric layer and a program gate electrode overlying the program dielectric layer. The program transistor has a smaller breakdown voltage than the read transistor.

The present invention relates to a dynamic random access memory and a programming method therefor with two stages. In a first stage, a capacitor of a memory cell of the dynamic random access memory is broken down, so that the dynamic random access memory becomes a one-time programmable memory. In a second stage, a resistance of the capacitor that is broken down is reduced, so that state data of the memory cell can be more easily interpreted.