A semiconductor memory device includes a test pattern data storage configured to store test write pattern data in response to a register write command and a register address and output test read pattern data in response to a test read command and a test pattern data selection signal during a test operation, a memory cell array including a plurality of memory cells and configured to generate read data, a read path unit configured to generate n read data, by serializing the read data, and a test read data generation unit configured to generate n test read data, by comparing the test read pattern data with each of the n read data, generated at a first data rate, and generate the n test read data, at a second data rate lower than the first data rate, during the test operation.

A semiconductor memory device includes a test pattern data storage configured to store test write pattern data in response to a register write command and a register address and output test read pattern data in response to a test read command and a test pattern data selection signal during a test operation, a memory cell array including a plurality of memory cells and configured to generate read data, a read path unit configured to generate n read data, by serializing the read data, and a test read data generation unit configured to generate n test read data, by comparing the test read pattern data with each of the n read data, generated at a first data rate, and generate the n test read data, at a second data rate lower than the first data rate, during the test operation.

A semiconductor device includes a test command generation circuit that generates a test write command and a test read command when entering a test mode, and an input/output control circuit that controls a memory block, the memory block including a plurality of banks such that write operations are simultaneously performed on the plurality of banks based on the test write command and read operations are simultaneously performed on the plurality of banks based on the test read command.

A system for outputting test data from cores to one communication interface. The system includes shared memories corresponding to the cores. Each shared memory includes a ring buffer and an array of slots. Each core generates a diagnostic message, and stores the generated diagnostic message in a select memory region of the ring buffer corresponding to a first empty slot of the array of slots. A selected core finds a first diagnostic message among diagnostic messages stored in the shared memories, and outputs the first diagnostic message to a personal computer through the communication interface.

A memory test method includes: testing a first memory to acquire defect information of the first memory; acquiring repair information of the first memory according to the defect information of the first memory; and storing the repair information of the first memory in a second memory. In the technical solutions provided in the embodiments of the present disclosure, other memories may be used to store the repair information of the currently tested memory, so that the storage space can be increased and the test efficiency can be improved.

A method for testing a memory chip includes: in response to read command for the memory chip, controlling clock signal to be kept in first state within first preset time period and at the same time controlling complementary clock signal to be kept in second state within first preset time period; in response to clock signal kept in the first state and complementary clock signal kept in the second state, keeping data strobe signal in the first state within second preset time period and at the same time keeping complementary data strobe signal in the second state within the second preset time period; and when the data strobe signal and the complementary data strobe signal are kept in first and second states respectively, controlling first and second driving modules connected respectively to data strobe terminal and complementary data strobe terminal to operate and measure first and second resistance values respectively.

A chip testing apparatus and system suitable for performing testing on multiple chips in a chip cluster are provided. The chip testing apparatus includes a signal interface and a test design circuit. The signal interface transmits an input signal and multiple driving signals in parallel from a test equipment to each of the chips. The test design circuit receives multiple output signals from the chips through the signal interface and serially outputs a test data to the test equipment according to the output signals.

Methods, systems, and devices for testing circuit for a memory device are described. An apparatus may include a memory system including contacts that route signals to different regions of the memory system. The apparatus may include a first substrate including a memory system interface coupled with the memory system and a probe interface. The apparatus may also include a second substrate coupled with a host system interface of the first substrate and receive the signal of the memory system from the memory system interface. The first interface may route a signal of the memory system to the probe interface and a tester to determine the signal's integrity and any errors associated with the memory system. The first substrate may include a resistor coupled with the contacts of the memory system, the resistor on a surface of the interface may be configured to improve the signal at the tester.

The present application discloses a chip socket, a testing fixture and a chip testing method thereof. The chip socket includes a pedestal, a plurality of conductive traces, a plurality of clamp structures, and a plurality of electrical contacts. The plurality of conductive traces are formed in the pedestal. The plurality of clamp structures are conductive and disposed on the first surface of the pedestal, and at least one of the plurality of clamp structures is coupled to a corresponding conductive trace and configured to clamp a solder ball of a chip to be tested. The plurality of electrical contacts are disposed on the second surface of the pedestal, and at least one of the plurality of electrical contacts is coupled to a corresponding clamp structure through a corresponding conductive trace.

A system comprises a memory sub-system controller mounted to a printed circuit board (PCB) and an in-circuit test (ICT) device. The memory sub-system controller has test points on the PCB comprising stimulus points and observation points. The ICT device connects to the test points of the controller. The ICT device converts automated test pattern generation (ATPG) input test vectors to test signals. A first set of pin drivers of the ICT device applies the test signals to the stimulus points of the controller and a second set of pin drivers of the ICT device read output signals output at the observation points of the controller. A comparator of the ICT device compares the output signals with output test vectors. The comparator provides test result data comprising a result of the comparison.