A memory-control logic, disposed in a memory circuit, is provided. The memory circuit includes a memory-cell array that is divided into a plurality of regions that include a damaged region. The memory-control logic includes a one-time-programmable (OTP) memory array, an array-control circuit, and an address-redirecting circuit. The array-control circuit programs a memory-size type of the memory-cell array, a region-failure flag corresponding to each region, and a redirecting mapping table corresponding to each region in the OTP memory array. The array-control circuit programs the redirecting mapping table corresponding to each region according to the memory-size type to direct the redirecting mapping table corresponding to each damaged region to non-repetitive good regions. The address-redirecting circuit converts the address signal into a first redirected address signal according to the redirecting mapping table corresponding to each region, and inputs the redirected address signal into the memory-cell array.

A circuit includes a memory array, a control circuit configured to identify an address of a first row containing a weak cell, and store corresponding address information in a storage device, and an address decoding circuit including NAND pairs, inverter pairs, and a logic tree. Each NAND pair receives corresponding bits of the address information and the address of the first row and corresponding inverted bits of the address information and the address of the first row inverted by corresponding inverter pairs, and output terminals of the NAND pairs are connected to the logic tree. The logic tree matches the address information with the address of the first row based on output logic levels from the NAND pairs and, in response to the corresponding address information matching the address of the first row, activates a second row of the memory array simultaneously with the first row being activated.

A memory system includes a memory device including plural non-volatile memory blocks and a controller configured to determine whether a first memory block among the plural non-volatile memory blocks is re-usable after the first memory block is determined to be a bad block and copy second block information associated with a second memory block including a second program sequence number within a set range of a first program sequence number in the first memory block to first block information of the first memory block.

Methods, systems, and devices for imprint recovery management for memory systems are described. In some cases, memory cells may become imprinted, which may refer to conditions where a cell becomes predisposed toward storing one logic state over another, resistant to being written to a different logic state, or both. Imprinted memory cells may be recovered using a recovery or repair process that may be initiated according to various conditions, detections, or inferences. In some examples, a system may be configured to perform imprint recovery operations that are scaled or selected according to a characterized severity of imprint, an operational mode, environmental conditions, and other factors. Imprint management techniques may increase the robustness, accuracy, or efficiency with which a memory system, or components thereof, can operate in the presence of conditions associated with memory cell imprinting.

Exemplary methods, apparatuses, and systems include determining that data in a group of memory cells of a first memory device is to be moved to a spare group of memory cells. The group of memory cells spans a first dimension and a second dimension that is orthogonal to the first dimension and the spare group of memory cells also spans the first dimension and the second dimension. The data is read from the group of memory cells along the first dimension of the group of memory cells. The data is written to the spare group of memory cells along the second dimension of the spare group of memory cells.

Embodiments of the disclosure are drawn to apparatuses and methods for automatic soft post-package repair (ASPPR). A memory may receive a row address along with a signal indicating an ASPPR operation, such as a bad page flag being set. A word line engine generates a physical address based on the row address, and ASPPR registers stores the physical address. The time it takes from receiving the row address to storing the physical address may be within the timing of an access operation on the memory such as tRAS. The row address may specify a single page of information. If the bad page flag is set, then a subsequent PPR operation may blow fuses to encode the physical address stored in the ASPPR registers.

Semiconductor structure, comprising a memory-array unit comprising: a substrate, a memory array disposed on the substrate, and a first bonding region disposed around the memory array. The memory array comprises multiple word lines, multiple bit lines, and multiple source lines. The first bonding region comprises a first substrate-connecting bonding region, a first bit-line bonding region, a first word-line bonding region, and a first source-line bonding region. The first substrate-connecting bonding region is configured to connect the substrate electrically to a surface of the memory-array unit, the first bit-line bonding region is configured to connect the bit lines electrically to the surface of the memory-array unit, the first word-line bonding region is configured to connect the word lines electrically to the surface of the memory-array unit, and the first source-line bonding region is configured to connect the source lines electrically to the surface of the memory-array unit.

A repair method of a memory includes dividing a plurality of general bits into a plurality of first groups and dividing a plurality of redundancy bits into a plurality of second groups. When one of the plurality of first groups has a defective bit, one of the plurality of second groups is selected to replace the first group which has the defective bit. Because the repair method uses a group as a repair unit, a repair circuit is simpler and smaller and a processing speed of the repair circuit is faster.

A 3D semiconductor device with a built-in-test-circuit (BIST), the device comprising: a first single-crystal substrate with a plurality of logic circuits disposed therein, wherein said first single-crystal substrate comprises a device area, wherein said plurality of logic circuits comprise at least a first interconnected array of processor logic, wherein said plurality of logic circuits comprise at least a second interconnected set of circuits comprising a first logic circuit, a second logic circuit, and a third logic circuit, wherein said second interconnected set of logic circuits further comprise switching circuits that support replacing said first logic circuit and/or said second logic circuit with said third logic circuit; and said built-in-test-circuit (BIST), wherein said first logic circuit is testable by said built-in-test-circuit (BIST), and wherein said second logic circuit is testable by said built-in-test-circuit (BIST).

A memory device includes a memory cell array including normal memory cells and redundant memory cells; first page buffers connected to the normal memory cells through first bit lines including a first bit line group and a second bit line group and arranged in a first area corresponding to the first bit lines in a line in a first direction; and second page buffers connected to the redundant memory cells through second bit lines including a third bit line group and a fourth bit line group and arranged in a second area corresponding to the second bit lines in a line in the first direction, wherein, when at least one normal memory cell connected to the first bit line group is determined as a defective cell, normal memory cells connected to the first bit line group are replaced with redundant memory cells connected to the third bit line group.