Electrically conductive line side-by-side running distance equalization and related apparatuses and systems. An apparatus includes a first sense amplifier including a first pull-up sense amplifier, a first pull-down sense amplifier, and a first pair of lines connecting the first pull-up sense amplifier to the first pull-down sense amplifier. The apparatus also includes a second sense amplifier adjacent to the first sense amplifier. The second sense amplifier includes a second pull-up sense amplifier, a second pull-down sense amplifier, and a second pair of lines connecting the second pull-up sense amplifier to the second pull-down sense amplifier. Parallel running distances between lines of the first pair of lines and the second pair of lines are equalized by a wiring twist of at least one of the first pair of lines or the second pair of lines in a region of the first pull-up sense amplifier and the second pull-up sense amplifier.

A sense amplifier includes a first switch unit, a second switch unit, and an amplifier-latch module. A first port of the amplifier-latch module is electrically connected, via the first switch unit, to a bit line connected with a storage unit, and a second port of the amplifier-latch module is electrically connected to a reference voltage signal via the second switch unit. The amplifier-latch module is configured to amplify a signal in a sensing amplification phase. The first switch unit is configured to transmit a voltage on the bit line to the first port before the sensing amplification phase. The second switch unit is configured to transmit the reference voltage signal to the second port before the sensing amplification phase, and disconnect an electrical connection between the reference voltage signal and the second port in the sensing amplification phase.

Methods, systems, and devices for differential amplifier schemes for sensing memory cells are described. In one example, an apparatus may include a memory cell, a differential amplifier having a first input node, a second input node, and an output node that is coupled with the first input node via a first capacitor, and a second capacitor coupled with the first input node. The apparatus may include a controller configured to cause the apparatus to bias the first capacitor, couple the memory cell with the first input node, and generate, at the output node, a sense signal based at least in part on biasing the first capacitor and coupling the memory cell with the first input node. The apparatus may also include a sense component configured to determine a logic state stored by the memory cell based at least in part on the sense signal.

Embodiments of the present invention provide a semiconductor integrated circuit of a memory. The semiconductor integrated circuit can comprise a column selection module, a local read-write conversion module, and an amplifier module. The column selection module can be configured to couple a first data line to a bit line and couple a complementary data line to a complementary bit line. The local read-write conversion module can be configured to perform data transmission from at least one of the first data line or the first complementary data line to a second data line. The data transmission can occur during a memory read-write operation and in response to the local read-write conversion module receiving a read write control signal. The amplifier module can be configured to amplify data of the second data line based on a reference signal of a reference data line. The reference signal can serve as a reference for amplifying the data of the second data line.

Apparatuses and methods are disclosed that include ferroelectric memory and for operating ferroelectric memory. An example apparatus includes a capacitor having a first plate, a second plate, and a ferroelectric dielectric material. The apparatus further includes a first digit line and a first selection component configured to couple the first plate to the first digit line, and also includes a second digit line and a second selection component configured to couple the second plate to the second digit line.

Disclosed herein are related to a memory device including a memory cell and a bias supply circuit providing a bias voltage to the memory cell. In one aspect, the bias supply circuit includes a bias memory cell coupled to the memory cell, where the bias memory cell and the memory cell may be of a same semiconductor conductivity type. The memory cell may include at least two gate electrodes, and the bias memory cell may include at least two gate electrodes. In one configuration, the bias memory cell includes a drain electrode coupled to one of the at least two gate electrodes of the bias memory cell. In this configuration, the bias voltage provided to the memory cell can be controlled by regulating or controlling current provided to the drain electrode of the bias memory cell.

Devices and methods for sensing a memory cell are described. The memory cell may include a ferroelectric memory cell. During a read operation, a first switching component may selectively couple a sense component with the memory cell based on a logic state stored on the memory cell to transfer a charge between the memory cell and the sense component. A second switching component, which may be coupled with the first switching component, may down convert a voltage associated with the charge to another voltage that is within an operation voltage of the sense component. The sense component may operate at a lower voltage than a voltage at which the memory cell operates to reduce power consumption in some cases.

A semiconductor device includes a memory cell array, a first pre-charge circuit, and a data line switching control circuit. The memory cell array includes a first data line, a second data line, and a third data line. The first pre-charge circuit is configured to pre-charge the first data line according to a first voltage level of a first equalizing signal. The data line switching control circuit is configured to disconnect the second data line from the third data line according to a second voltage level of a data line switching control signal in a standby operation of the semiconductor device, to perform charge sharing of the first equalizing signal and the data line switching control signal for a first time in an active operation of the semiconductor device, and to drive the data line switching control signal to the first voltage level.

Disclosed herein are related to a memory system including a memory cell and a circuit to operate the memory cell. In one aspect, the circuit includes a pair of transistors to electrically couple, to the bit line, a selected one of i) a voltage source to supply a reference voltage to the memory cell or ii) a sensor to sense a current through the memory cell. In one aspect, the circuit includes a first transistor. The first transistor and the bit line may be electrically coupled between the pair of transistors and the memory cell in series.

A memory circuit system and method for using the same are provided. In one example, the memory circuit system includes a memory array, a first precharge circuit, and a second precharge circuit. The memory array writes a first set of columns of the memory array. The first precharge circuit charges bitlines of a second set of columns of the memory array while bitlines of the first set of columns discharge. The first set of columns is different from the second set of columns. The second precharge circuit charges the bitlines of the first set of columns after the memory array has finished writing the first set of columns.