A sense amplifier is biased to reduce leakage current equalize matched transistor bias during an idle state. A first read select transistor couples a true bit line and a sense amplifier true (SAT) signal line and a second read select transistor couples a complement bit line and a sense amplifier complement (SAC) signal line. The SAT and SAC signal lines are precharged during a precharge state. An equalization circuit shorts the SAT and SAC signal lines during the precharge state. A differential sense amplifier circuit for latching the memory cell value is coupled to the SAT signal line and the SAC signal line. The precharge circuit and the differential sense amplifier circuit are turned off during a sleep state to cause the SAT and SAC signal lines to float. A sleep circuit shorts the SAT and SAC signal lines during the sleep state.

Techniques are described for maintaining a stable voltage difference in a memory device, for example, during a critical operation (e.g., a sense operation). The voltage difference to be maintained may be a read voltage across a memory cell or a difference associated with a reference voltage, among other examples. A component (e.g., a local capacitor) may be coupled, before the operation, with a node biased to a first voltage (e.g., a global reference voltage) to sample a voltage difference between the first voltage and a second voltage while the circuitry is relatively quiet (e.g., not noisy). The component may be decoupled from the node before the operation such that a node of the component (e.g., a capacitor) may be allowed to float during the operation. The voltage difference across the component may remain stable during variations in the second voltage and may provide a stable voltage difference during the operation.

A semiconductor device may include a plurality of memory banks arranged in a first direction; an address decoder arranged at one side of the memory banks; a plurality of local sense amplifier arrays arranged under each of the memory banks; a plurality of first input/output lines connected between the memory banks and the local sense amplifier arrays corresponding to each of the memory banks; and at least one second input/output line connected to the local sense amplifier arrays and extended in the first direction.

Methods, systems, and devices for differential amplifier schemes for sensing memory cells are described. In one example, an apparatus may include a memory cell, a differential amplifier having a first input node, a second input node, and an output node that is coupled with the first input node via a first capacitor, and a second capacitor coupled with the first input node. The apparatus may include a controller configured to cause the apparatus to bias the first capacitor, couple the memory cell with the first input node, and generate, at the output node, a sense signal based at least in part on biasing the first capacitor and coupling the memory cell with the first input node. The apparatus may also include a sense component configured to determine a logic state stored by the memory tell based at least in part on the sense signal.

A semiconductor memory device is implemented as a string of storage transistors with sense amplifier connected drain terminals and floating source terminals. In some embodiments, a method in the semiconductor memory device applies a bit line control (BLC) voltage with a voltage step down to the bias device during the read operation to reduce the settling time on the bit line, thereby shortening the access time for data read out from the storage transistors. In other embodiments, a method in the semiconductor memory device including an array of strings of storage transistors uses a current from a biased but unselected bit line as the sense amplifier reference current for reading stored data from a selected bit line. In one embodiment, the sense amplifier reference current is provided to a referenced sense amplifier to generate a sense amplifier data latch signal.

A memory device includes: a cell array including a memory cell and a reference cell; a sense amplifier configured to sense a difference between a first current flowing through the memory cell and a second current flowing through the reference cell, based on an activated sense enable signal; a controller configured to inactivate the sense enable signal in a program interval and activate the sense enable signal in a verify interval subsequent to the program interval, during a write operation; and a voltage driver configured to provide a write voltage to the memory cell in the program interval and the verify interval during the write operation, and to provide a read voltage to the memory cell during a read operation.

According to an embodiment of the present disclosure, a semiconductor memory device includes a bit line sense amplifier coupled between a pull-up voltage line and a pull-down voltage line, and suitable for sensing a voltage difference between first and second bit lines by sequentially performing a precharge operation, an offset cancellation operation, a charge sharing operation, and an amplification operation, wherein the bit line sense amplifier pre-biases a voltage level of the second bit line depending on a voltage level of the first bit line during the charge sharing operation; and a driving circuit suitable for supplying operating voltages to the pull-up voltage line and the pull-down voltage line during the offset cancellation operation, the charge sharing operation, and the amplification operation.

A circuit includes a reference voltage node, first and second data lines, a sense amplifier, first and second switching devices coupled between the first and second data lines and first and second input terminals of the sense amplifier, third and fourth switching devices coupled between the first and second data lined and first and second nodes, fifth and sixth switching devices coupled between the first and second nodes and the reference voltage node, and first and second capacitive devices coupled between the first and second nodes and second and first input terminals. Each of the first through fourth switching devices is switched on and each of the fifth and sixth switching devices is switched off in a first operational mode, and each of the first through fourth switching devices is switched off and each of the fifth and sixth switching devices is switched on in a second operational mode.

Systems, methods, and apparatuses for temperature-compensated operation of electronic devices are described. For example, an apparatus for performing voltage compensation on a sense amplifier based on temperature may include a sense amplifier control circuit coupled to the sense amplifier to provide a compensation pulse to the sense amplifier, wherein the sense amplifier operates in a voltage compensation phase during the compensation pulse. The apparatus may determine the compensation pulse responsive to a voltage compensation duration signal that is based on the operating temperature of the apparatus. The voltage compensation occurs when there is no activate command immediately before or immediately after so that compensation duration change do not happen during an activate command from the command decoder.

An integrated circuit may include an amplifier circuit configured to receive a pull-up voltage in response to a pull-up enable signal, receive a pull-down voltage in response to a pull-down enable signal, and amplify a voltage difference between a first line and a second line through the pull-up and pull-down voltages; a first delay path configured to generate the pull-down enable signal by delaying an input signal; and a second delay path configured to generate the pull-up enable signal by delaying the input signal, wherein a change in a delay of the first delay path due to variation of a power supply voltage is smaller than a change in a delay of the second delay path due to the variation.