A system may include an array of interconnected memristors. Each memristor may include a first electrode, a second electrode, and a memristor material positioned between the first electrode and the second electrode. The system may further include a controller communicatively coupled to the array of interconnected memristors. The controller may be configured to tune the array of interconnected memristors.

Systems, methods, and apparatus related to memory devices. In one approach, a vertical three-dimensional cross-point memory device uses digit line decoders that include, on the digit line side of memory cells, a current limiter and sensing circuit configured to control program current in either of positive or negative program polarities, as selected by a controller. Two current limiters are each used on the digit line side of each memory cell. A negative polarity current limiter is used for pull-up, and a positive polarity current limiter is used for pull-down. A negative polarity sensing circuit is used between the respective digit line decoder and a positive supply voltage. A positive polarity sensing circuit is used between the respective digit line decoder and a negative supply voltage. The current limiter and sensing circuit pair of the same polarity is coupled to each digit line decoder based on the selected program polarity.

Methods, systems, and devices related to a multi-level self-selecting memory device are described. A self-selecting memory cell may store one or more bits of data represented by different threshold voltages of the self-selecting memory cell. A programming pulse may be varied to establish the different threshold voltages by modifying one or more durations during which a fixed level of voltage or fixed level of current is maintained across the self-selecting memory cell. The self-selecting memory cell may include a chalcogenide alloy. A non-uniform distribution of an element in the chalcogenide alloy may determine a particular threshold voltage of the self-selecting memory cell. The shape of the programming pulse may be configured to modify a distribution of the element in the chalcogenide alloy based on a desired logic state of the self-selecting memory cell.

Methods, systems, and devices related to techniques to access a self-selecting memory device are described. A self-selecting memory cell may store one or more bits of data represented by different threshold voltages of the self-selecting memory cell. A programming pulse may be varied to establish the different threshold voltages by modifying one or more time durations during which a fixed level of voltage or current is maintained across the self-selecting memory cell. The self-selecting memory cell may include a chalcogenide alloy. A non-uniform distribution of an element in the chalcogenide alloy may determine a particular threshold voltage of the self-selecting memory cell. The shape of the programming pulse may be configured to modify a distribution of the element in the chalcogenide alloy based on a desired logic state of the self-selecting memory cell.

The present disclosure includes apparatuses and methods for buffer reset commands for write buffers. An example apparatus includes a memory and a controller coupled to the memory. The memory can include an array of resistance variable memory cells configured to store data corresponding to a managed unit across multiple partitions each having a respective write buffer corresponding thereto. The controller can be configured to update the managed unit by providing, to the memory, a write buffer reset command followed by a write command. The memory can be configured to execute the write buffer reset command to place the write buffers in a reset state. The memory can be further configured to execute the write command to modify the content of the write buffers based on data corresponding to the write command and write the modified content of the write buffers to an updated location in the array.

Sensing memory cells can include: applying a voltage ramp to a group of memory cells to sense their respective states; sensing when a first switching event occurs to one of the memory cells responsive to the applied voltage ramp; stopping application of the voltage ramp after a particular amount of time subsequent to when the first switching event occurs; and determining which additional memory cells of the group experience the switching event during the particular amount of time. Those cells determined to have experienced the switching event responsive to the applied voltage ramp are sensed as storing a first data value and those cells determined to not have experienced the switching event responsive to the applied voltage ramp are sensed as storing a second data value. The group stores data according to an encoding function constrained such that each code pattern includes at least one data unit having the first data value.

A method of operating a synapse array includes applying a pulse sequence to a resistor coupled between a row and a column of the synapse array, and in response to the applying the pulse sequence, lowering a conductance level of the resistor. Each pulse of the pulse sequence includes a pulse number, an amplitude, a leading edge, a pulse width, and a trailing edge, the trailing edge having a duration longer than a duration of the leading edge, and applying the pulse sequence includes increasing the pulse number while increasing one of the amplitude, the pulse width, or the trailing edge duration.

A semiconductor memory includes first variable resistance layers and insulating layers alternately stacked; conductive pillars passing through the first variable resistance layers and the insulating layers; a slit insulating layer vertically passing through the insulating layers, extending in a first direction, and being disposed in a second direction of the insulating layers, the second direction intersecting with the first direction; conductive layers disposed between the slit insulating layer and the first variable resistance layers; and electrode layers disposed between the conductive layers and the first variable resistance layers. The first variable resistance layers remain in an amorphous state during a program operation.

A method of manufacturing an electronic device includes alternately forming first variable resistance layers and insulating layers, forming conductive pillars passing through the first variable resistance layers and the insulating layers, forming a slit passing through the first variable resistance layers and the insulating layers and extending in a first direction, forming openings by etching the first variable resistance layers exposed through the slit, and forming conductive layers in the respective openings.

Methods, systems, and devices related to techniques to access a self-selecting memory device are described. A self-selecting memory cell may store one or more bits of data represented by different threshold voltages of the self-selecting memory cell. A programming pulse may be varied to establish the different threshold voltages by modifying one or more time durations during which a fixed level of voltage or current is maintained across the self-selecting memory cell. The self-selecting memory cell may include a chalcogenide alloy. A non-uniform distribution of an element in the chalcogenide alloy may determine a particular threshold voltage of the self-selecting memory cell. The shape of the programming pulse may be configured to modify a distribution of the element in the chalcogenide alloy based on a desired logic state of the self-selecting memory cell.