A ground-fixing system for a tire characteristics sensor housing (10) comprises: a fixing plate (1) comprising a plurality of recesses (2) of a given profile distributed over the surface of the fixing plate; and a plurality of fixing pins (3) of substantially corresponding profile, similarly distributed on a fixing face of said sensor housing (10), the shapes and dimensions of the recesses (2) and of the pins (3) for fixing being provided so as to allow, on the one hand, in a position of insertion of the pins, engagement of the latter in said recesses and, on the other hand, in a locking position of the pins, fixing of the sensor housing (10) on the fixing plate (1).

A system and a method for uniformed surface measurement are provided, in which a sensor is provided to perform measurements on a carrier in a polishing machine, and a measuring trajectory of the sensor on the carrier is adjusted by controlling the pivoting of a sensor carrier carrying the sensor and the rotation of a rotating platform in the polishing machine in order to achieve uniformed surface measurements of the carrier and real-time constructions of the surface topography. This allows the polishing state of the carrier to be monitored in real time, thereby improving the efficiency of the polishing process. A sensing apparatus for uniformed surface measurement is also provided.

A method and a set-up apparatus for a tool for punching or forming sheet-form materials having a punch holder into which a punch of the tool is insertable and a die holder into which a die of the tool or a die carrier holding the die is insertable. The punch holder and the die holder are movable towards one another by a guide. The punch holder is transferred along the guide into a measuring position in which the punch rests on a surface of a measurement object which rests on the die. A distance of the punch holder is measured from a zero point of the die holder and a distance of the measurement object from the zero point. An evaluation device outputs a punch length of the punch and a die height of the die or a die height of the die arranged in the die carrier.

A system and a method for uniformed surface measurement are provided, in which a sensor is provided to perform measurements on a carrier in a polishing machine, and a measuring trajectory of the sensor on the carrier is adjusted by controlling the pivoting of a sensor carrier carrying the sensor and the rotation of a rotating platform in the polishing machine in order to achieve uniformed surface measurements of the carrier and real-time constructions of the surface topography. This allows the polishing state of the carrier to be monitored in real time, thereby improving the efficiency of the polishing process. A sensing apparatus for uniformed surface measurement is also provided.

There is provided a roughness tester that improves measurement efficiency and roughness measurement accuracy. A roughness tester includes a stylus unit including a stylus that is provided in such a manner as to protrude from and retract into a through hole of a skid and performs scanning movement along a surface of a workpiece, and a stylus displacement detecting unit that detects displacement of the stylus, and a drive unit that moves the stylus unit forward and backward in a drive-axis direction. The roughness tester further includes a height detector that is provided in such a manner as to face a front end face of the main-body housing part, interposing the skid between the height detector and the front end face and that detects a height of an object in a direction parallel with a measurement axis. When the height detector detects the object at the same height of the height of the main-body support foot in the measurement axis direction, the drive unit automatically starts driving in order for the stylus unit to perform scanning measurement of the surface of the workpiece.

A thickness detector device and method, a detector system and a slot device are provided, and the thickness detector device includes: a base, which has a side wall provided with a through slot that penetrates through the base; a slot component at the base and has n slots, n being an integer greater than 1, and a width of each slot being less than a width of the through slot; a driver component which is provided on the base, is in a fixed connection with the slot component, and is configured to change the slot that is in the slot component and is in communication with the through slot by driving the slot component to move.

A thickness detector device and method, a detector system and a slot device are provided, and the thickness detector device includes: a base, which has a side wall provided with a through slot that penetrates through the base; a slot component at the base and has n slots, n being an integer greater than 1, and a width of each slot being less than a width of the through slot; a driver component which is provided on the base, is in a fixed connection with the slot component, and is configured to change the slot that is in the slot component and is in communication with the through slot by driving the slot component to move.

An apparatus for shrouding the coated field joint area of connected line pipe segments, the shroud having first and second housing halves which have end walls which cooperate to form registering openings matching the diameter of the pipe to be shrouded, the housing halves forming a chamber. The housing can be of a clamshell design, being hinged on one side and having hasps, latches or the like on the other side to keep the shroud positioned once it is placed around the coated field joint area of a pipeline. An environment monitor is disposed in the chamber to measure conditions such as relative humidity and temperature.

A method of preparing a computer processor die includes determining a warpage shape of the computer processor die at a testing temperature. The method also includes selectively contouring a thickness of the computer processor die at a contouring temperature by physically removing material from a surface of the computer processor die such that the surface will be substantially flat at the testing temperature.

A method of preparing a computer processor die includes determining a warpage shape of the computer processor die at a testing temperature. The method also includes selectively contouring a thickness of the computer processor die at a contouring temperature by physically removing material from a surface of the computer processor die such that the surface will be substantially flat at the testing temperature.