A microelectronic chip device includes a semiconductor substrate and multiple on-chip strain sensors (OCSSs) constructed on the substrate at various locations of the substrate. The OCSSs may each include multiple piezoresistive devices configured to sense a strain at a location of the various locations and produce a strain signal representing the strain at that location. A strain measurement circuit may also be constructed on the semiconductor substrate and configured to measure strain parameters from the strain signals produced by the OCSSs. The strain parameters represent the strains at the various location. Values of the strain parameters can be used for analysis of mechanical stress on the chip device.

A wearable device comprises one or more deformable signaling pathways wherein each deformable signaling pathway is configured to enable an electrical connection between two devices electrically connected to each other via the deformable signaling pathway. Deformable signaling pathways enable the conduction of electrical signals between various circuit elements similar to one or more circuit elements such as electronic traces or wires. A deformable signaling pathway includes one or more conductive elements surrounded by a conductive gel. Both the conductive gel and the one or more conductive elements are encased in an elastomeric shell. The elastomeric shell is attached to terminals (e.g., one on either end). The one or more connectors are attached to one another such that the one or more connectors span the length of the elastomeric shell and form a low resistance contact between the terminals of the deformable signaling pathway.

A bridge driver circuit applies a bias voltage across first and second input nodes of a resistive bridge circuit configured to measure a physical property such as pressure or movement. A sensing circuit senses a bridge current that flows through the resistive bridge circuit in response to the applied bias voltage. A temperature dependent sensitivity of the resistive bridge circuit is determined by processing the sensed bridge current. A voltage output at first and second output nodes of the resistive bridge circuit is processed to determine a value of the physical property. This processing further involves applying a temperature correction in response to the determined temperature dependent sensitivity.

A semiconductor device includes: a first board that has a first end surface and a second end surface opposite to the first end surface; a second board that is attached to the second end surface of the first board; a plurality of first electrodes that are provided on the first end surface; a second electrode that is provided on the second end surface and electrically coupled to an electrode of the second board; an internal wiring that is provided inside the first board and electrically coupled to the second electrode; a plurality of third electrodes that are provided inside the first board and electrically couple the first electrodes to the internal wiring; and a strain sensor that is provided inside the first board and measures a strain generated in the first board, in which a linear expansion coefficient of each of the third electrodes is larger than a linear expansion coefficient of the first board.

A foldable display including a bendable region, the bendable region comprising a first surface functioning as a display surface of the display and a second surface disposed opposite to the first surface. The foldable display has an unfolded state and a folded state. The foldable display includes a state detecting unit disposed in the bendable region for detecting a deformation state of a surface of the bendable region and generating an electrical signal indicating a corresponding deformed state.

Provided is a strain sensor. The strain sensor according to embodiments of the inventive concept includes a flexible substrate, rigid patterns on the flexible substrate, the rigid patterns including a first pattern and a second pattern spaced apart from the first pattern in a first direction, a first electrode on the first pattern, a second electrode on the second pattern, the second electrode being spaced apart from the first electrode, and a piezoresistive layer connecting the first electrode and the second electrode. Here, each of the rigid patterns may have a stiffness greater than that of the flexible substrate.

Provided is a strain sensor unit that enables inhibition of a positional deviation of a strain sensor. The strain sensor unit includes: a substrate that is stretchable; at least one strip-shaped or string-shaped strain sensor that is arranged on the substrate along a direction of stretching and contracting of the substrate; and a deformation restraining member that is arranged in proximity to longitudinal end portions of the at least one strain sensor respectively, to extend in a direction intersecting a longitudinal direction of the strain sensor, and restrains deformation of the substrate.

A film resistor and a film sensor are disclosed. In an embodiment a film resistor includes a piezoresistive layer comprising a M.sub.1+nAX.sub.n phase, wherein M comprises at least one transition metal, A comprises a main-group element, and X comprises carbon and/or nitrogen, and wherein n=1, 2 or 3.

The present invention features a stretchable strain sensor for detecting minute amounts of strain or pressure. The stretchable strain sensor may comprise a first soft polymer layer, a wrinkled conductive layer disposed on the first soft polymer layer, and a second soft polymer layer disposed on the wrinkled conductive layer. Strain applied to the sensor may cause the wrinkled conductive layer to stretch and crack and send a signal based on resistance. Pressure applied to the sensor may cause the wrinkled conductive layer to deform and crack and send a signal based on resistance. The stretchable strain sensor may be capable of measuring contractions of a tissue, detecting fluid flowing through a microfluidic channel, and detecting whether a microfluidic valve is closed or not.

Aspects of the subject disclosure may include, for example, obtaining a first plurality of circumference measurements, each of the first plurality of circumference measurements corresponding to a first circumference around a limb of a person at a respective one of a plurality of locations of the limb, each of the first plurality of circumference measurements being obtained from a respective one of a plurality of elastic measurement elements that is positioned at a respective one of the locations; determining, based upon the first plurality of circumference measurements, a first geometric profile along a length of the limb; and outputting data representing the first geometric profile. Other embodiments are disclosed.